Method for preparing rubber plate used in an ion implanter

Information

  • Patent Grant
  • 6826822
  • Patent Number
    6,826,822
  • Date Filed
    Monday, February 11, 2002
    22 years ago
  • Date Issued
    Tuesday, December 7, 2004
    19 years ago
Abstract
One embodiment is directed to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; and trimming the rubber plate using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.
Description




CROSS-REFERENCES TO RELATED APPLICATIONS




This application claims priority from R.O.C. patent application Ser. No. 090105018, filed Mar. 5, 2001, the entire disclosure of which is incorporated herein by reference.




BACKGROUND OF THE INVENTION




The present invention relates to a rubber plate used in an ion implanter, as well as the method and accessories for preparing the rubber plate.




The ion implanter is a complex apparatus used in the manufacture of doped wafers. During the ion implantation process, wafers to be processed are placed on a platform within the load/unload system of the ion implanter. The present invention is related to a rubber plate disposed on top of this platform.




The platform, represented as platform


10


in

FIG. 1



a


, has primary notches


12


for the wafer pad to pass through and primary holes


11


for locating the platform


10


. Wafers are not placed directly on top of the platform. Instead, a rubber plate


30


is placed between the wafer and the platform


10


to prevent sliding, direct impact between the wafers and the platform, and more importantly, allow the wafers to lay evenly on the platform so the heat generated during implanting can be dissipated evenly.




Preparation of the rubber plate in the prior art consists of, first, attaching the rubber plate


30


to the platform


10


(

FIG. 1



b


) and then trimming off unwanted parts from the rubber plate


30


(

FIG. 1



c


). However, this procedure tends to cause damage to the platform


10


. Also, the rubber plate


30


may peel off the platform


10


and cause uneven cooling of the wafers during ion implantation, which in turn leads to sticky or broken wafers. Also, debris may be produced during the trimming process and hamper wafer production.




BRIEF SUMMARY OF THE INVENTION




The present invention is directed to a method and accessories for trimming a rubber plate used in an ion implanter without the above drawbacks of the prior art. In specific embodiments, the rubber plate is trimmed prior to being placed on the platform using a template that matches the shape and features of the platform. The trimmed rubber plate is then placed on top of the platform. In this way, the problems of in situ trimming of the rubber plate are avoided so as to ensure the quality and efficiency of wafer production.




An aspect of the present invention is directed to a set of trimming accessories for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The set of trimming accessories comprises a trimming member configured to trim the rubber plate and a template. The template includes a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter. The template is adapted to guide the trimming member to trim the rubber plate to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.




In some embodiments, the trimming member comprises a knife or a laser. An optical detector is configured to detect contours of the template formed by the plurality of secondary holes and the plurality of secondary notches. A controller is coupled to the trimming member and to the optical detector to control the trimming member based on the detected contours of the template from the optical detector to trim the rubber plate to form the plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form the plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template. The template is adapted to be placed over the rubber plate for guiding the trimming member to trim the rubber plate.




In accordance with another aspect of the present invention, a method is provided for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter. The rubber plate is trimmed using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.




In some embodiments, the template is placed over the rubber plate for guiding a trimming member to trim the rubber plate. A controller automatically controls a trimming member based on contours of the template to trim the rubber plate to form the plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form the plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template. The method may further comprise optically detecting the contours of the template and providing the detected contours to the controller to automatically control the trimming member based on the detected contours of the template to trim the rubber plate. The tertiary holes in the rubber plate are trimmed to match the primary holes of the platform and the tertiary notches in the rubber plate are trimmed to match the primary notches of the platform.




Yet another aspect of the present invention relates to a method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, wherein the platform of the ion implanter includes a plurality of primary holes and a plurality of primary notches. The method comprises providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter. The template is placed over the rubber plate. A trimming member is automatically controlled for trimming the rubber plate to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.




In some embodiments, the contours of the template are optically detected and the detected contours are provided to the controller to automatically control the trimming member based on the detected contours of the template to trim the rubber plate. The tertiary holes in the rubber plate are trimmed to match the primary holes of the platform and the tertiary notches in the rubber plate are trimmed to match the primary notches of the platform. The trimmed rubber plate can then be placed on the platform so that the tertiary holes of the rubber plate match the primary holes of the platform and the tertiary notches of the rubber plate match the primary notches of the platform.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1



a


is a simplified top plan view of a platform of the ion implanter and a pre-trimmed rubber plate;





FIG. 1



b


is a simplified top plan view of a pre-trimmed rubber plate placed on top of the platform;





FIG. 1



c


is a simplified top plan view of a trimmed rubber plate disposed on top of the platform;





FIG. 2

is a simplified top plan view of the trimming accessories including a template and a trimming equipment according to an embodiment of the present invention;





FIG. 2



a


is a simplified schematic view of examples of trimming members;





FIG. 2



b


is a block diagram of a control system for operating the trimming equipment;





FIG. 3



a


is a simplified top plan view of a template and an pre-trimmed rubber plate;





FIG. 3



b


is a simplified top plan view of the pre-trimmed rubber plate placed underneath the template;





FIG. 3



c


is a simplified top plan view of the trimmed rubber plate disposed underneath the template;





FIG. 3



d


is a simplified top plan view of the platform of the ion implanter, and the trimmed rubber plate; and





FIG. 3



e


is a simplified top plan view of the trimmed rubber plate placed on the top of the platform.











DETAILED DESCRIPTION OF THE INVENTION




As shown in

FIG. 2

, the set of trimming accessories for a rubber plate used in an ion implanter comprises a template


20


and trimming equipment such as a knife or preferably a laser


40


used to trim the rubber plate


30


(

FIG. 1



a


). The template


20


is configured to match the shape and features of the platform


10


, including multiple secondary holes


21


which correspond to the primary holes


11


of the platform


10


and multiple secondary notches


22


which correspond to the primary notches


12


of the platform


10


. The trimming equipment


40


includes a knife, a cutter, or more preferably a laser or the like.

FIG. 2



a


shows a knife


40




a


or a laser


40




b


as the trimming member, for example. The template


20


is typically made of a metal but may be made of other materials that will not be damaged or altered by the trimming equipment


40


. As shown in

FIG. 2



a


, an optical detector


42


may be provided to detect the contours of the template


20


formed by the plurality of secondary holes


21


and the plurality of secondary notches


22


. A controller


44


is coupled to the trimming member


40


and to the optical detector to control the trimming member


40


for trimming the rubber plate


30


.




The method according to an embodiment of the present invention includes the following steps. A pre-trimmed rubber plate


30


is shown in

FIG. 3



a


. The template


20


has the features of the platform


10


. The template


20


is placed on top of the rubber plate


30


as shown in

FIG. 3



b


. The rubber plate


30


is trimmed using the trimming equipment


40


as guided by the contour of the template


20


. This can be done manually or under automatic control, for instance, using an optical device to follow the contour of the template


20


and guide the trimming equipment


40


. The trimming equipment


40


forms a plurality of tertiary holes


31


in the rubber plate


30


according to the secondary holes


21


of template


20


and a plurality of tertiary notches


32


in the rubber plate


30


according to the secondary notches


22


of template


20


, as seen in

FIG. 3



c


. To automate the trimming process, the optical detector


42


of

FIG. 2



a


may be used to detect the contours of the template


20


and provide the detected contours to the controller


44


. Based on the detected contours of the template


20


from the optical detector


42


, the controller


44


automatically controls the trimming member


40


to trim the rubber plate


30


to form the plurality of tertiary holes


31


and the plurality of tertiary notches


32


.




As shown in

FIG. 3



d


, the trimmed rubber plate


30


includes features that match the features of the platform


10


. The trimmed rubber plate


30


is then placed onto the platform


10


in the orientation so that the tertiary holes


31


of the rubber plate


30


match the primary holes


11


of the platform


10


and the tertiary notches


32


match the primary notches


12


of the platform


10


, as illustrated in

FIG. 3



e.






Accordingly, by applying the method of the present invention, damage to the platform and uneven cooling of the wafer due to uneven attachment between the wafer and the platform are reduced. Thus, the efficiency and life span of the ion implanter is increased.




The above-described arrangements of apparatus and methods are merely illustrative of applications of the principles of this invention and many other embodiments and modifications may be made without departing from the spirit and scope of the invention as defined in the claims. The scope of the invention should, therefore, be determined not with reference to the above description, but instead should be determined with reference to the appended claims along with their full scope of equivalents.



Claims
  • 1. A method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, the platform of the ion implanter including a plurality of primary holes and a plurality of primary notches, the method comprising:providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; and prior to placing the rubber plate on the platform of the ion implanter, trimming the rubber plate using the template as a guide to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.
  • 2. The method of claim 1 wherein the template is placed over the rubber plate for guiding a trimming member to trim the rubber plate.
  • 3. The method of claim 1 wherein the rubber plate is trimmed using a trimming member selected from the group consisting of a knife and a laser.
  • 4. The method of claim 1 further comprising providing a controller to automatically control a trimming member based on contours of the template to trim the rubber plate to form the plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form the plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.
  • 5. The method of claim 4 further comprising optically detecting the contours of the template and providing the detected contours to the controller to automatically control the trimming member based on the detected contours of the template to trim the rubber plate.
  • 6. The method of claim 1 wherein the tertiary holes in the rubber plate are trimmed to match the primary holes of the platform and the tertiary notches in the rubber plate are trimmed to match the primary notches of the platform.
  • 7. A method for trimming a rubber plate which is configured to be placed on a platform of an ion implanter, the platform of the ion implanter including a plurality of primary holes and a plurality of primary notches, the method comprising:providing a template including a plurality of secondary holes corresponding to the plurality of primary holes of the platform of the ion implanter and a plurality of secondary notches corresponding to the plurality of primary notches of the platform of the ion implanter; placing the template over the rubber plate; and prior to placing the rubber plate on the platform of the ion implanter, automatically controlling a trimming member for trimming the rubber plate to form a plurality of tertiary holes in the rubber plate corresponding to the plurality of secondary holes of the template and to form a plurality of tertiary notches in the rubber plate corresponding to the plurality of secondary notches of the template.
  • 8. The method of claim 7 further comprising optically detecting contours of the template and providing the detected contours to the controller to automatically control the trimming member based on the detected contours of the template to trim the rubber plate.
  • 9. The method of claim 7 wherein the tertiary holes in the rubber plate are trimmed to match the primary holes of the platform and the tertiary notches in the rubber plate are trimmed to match the primary notches of the platform.
  • 10. The method of claim 7 wherein the trimming member comprises a laser.
  • 11. The method of claim 7 wherein the trimming member comprises a knife.
  • 12. The method of claim 7 further comprising placing the trimmed rubber plate on the platform so that the tertiary holes of the rubber plate match the primary holes of the platform and the tertiary notches of the rubber plate match the primary notches of the platform.
Priority Claims (1)
Number Date Country Kind
90105018 A Mar 2001 TW
US Referenced Citations (5)
Number Name Date Kind
3617683 Beresford et al. Nov 1971 A
4458133 Macken Jul 1984 A
5744776 Bauer Apr 1998 A
6139049 Gallagher Oct 2000 A
6216354 Carbone Apr 2001 B1
Foreign Referenced Citations (3)
Number Date Country
129288 Feb 1990 CN
02037656 Feb 1990 JP
05211129 Aug 1993 JP
Non-Patent Literature Citations (1)
Entry
“Formation of shallow P-type layers by implantation of molecular diborane ions”; Yokota, K.; Nishimura, H.; Terada, K.; Nakamura, K.; Sakai, S.; Tanjou, M.; Takano, H.; Kumagai, M.; 1998 International Conference on Jun. 22-26, 1998; pp. 9194.