Claims
- 1. A semiconductor device substrate including at least two different types of electronic elements, at least one of said at least two types of electronic elements comprising a semiconductor device.
- 2. The semiconductor device substrate of claim 1, comprising at least a portion of a wafer including semiconductor material.
- 3. The semiconductor device substrate of claim 1, wherein each of said at least two different types of electronic elements comprises a component of a radio-frequency ID device.
- 4. The semiconductor device substrate of claim 1, wherein at least one of said at least two different types of electronic elements comprises at least one of a battery, an integrated circuit chip, and an antenna.
- 5. The semiconductor device substrate of claim 1, including columns of electronic elements, at least one of said columns comprising at least one electronic element of a different type than a type of electronic element in a column adjacent thereto.
- 6. The semiconductor device substrate of claim 5, wherein said at least one electronic element of said different type has a different width than said type of electronic element in said column adjacent thereto.
- 7. The semiconductor device substrate of claim 5, wherein said at least one electronic element of said different type comprises one of a battery, an integrated circuit chip, and an antenna and said type of electronic element in said column adjacent thereto comprises another of a battery, an integrated circuit chip, and an antenna.
- 8. The semiconductor device substrate of claim 1, wherein said at least two electronic elements have different sizes from one another.
- 9. A semiconductor device substrate including a plurality of different types of electronic elements to be used in a single electronic device, comprising:
a first electronic element type; and a second electronic element type having a lateral dimension that differs from a corresponding lateral dimension of said first electronic element type.
- 10. The semiconductor device substrate of claim 9, further comprising a third electronic element type.
- 11. The semiconductor device substrate of claim 9, wherein electronic elements of each column of semiconductor devices formed thereon are of the same electronic element type.
- 12. The semiconductor device substrate of claim 9, wherein a first column of semiconductor devices formed thereon includes at least one electronic element having a different width than an adjacent semiconductor device located in a second column adjacent to said first column.
- 13. The semiconductor device substrate of claim 9, wherein the single electronic device comprises a radio-frequency ID device.
- 14. The semiconductor device substrate of claim 13, wherein said first electronic element type comprises one of a battery, an integrated circuit chip, and an antenna.
- 15. The semiconductor device substrate of claim 14, wherein said second electronic element type comprises another of a battery, an integrated circuit chip, and an antenna.
- 16. The semiconductor device substrate of claim 15, comprising a third electronic element type which comprises yet another of a battery, an integrated circuit chip, and an antenna.
- 17. A semiconductor device substrate including a plurality of electronic elements to be used in a radio-frequency ID device, comprising:
a first electronic element type comprising one of a battery, an integrated circuit chip, and an antenna; and a second electronic element type comprising another of a battery, an integrated circuit chip, and an antenna.
- 18. The semiconductor device substrate of claim 17, further comprising a third electronic element type comprising yet another of a battery, an integrated circuit chip, and an antenna.
- 19. The semiconductor device substrate of claim 18, wherein said first electronic element type has a different lateral dimension than a corresponding lateral dimension of said second electronic element type.
- 20. The semiconductor device substrate of claim 19, wherein said lateral dimension comprises width.
- 21. The semiconductor device substrate of claim 20, comprising a first column consisting essentially of electronic elements of said first electronic element type and an adjacent, second column consisting essentially of electronic elements of said second electronic element type.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application is a continuation of application Ser. No. 09/567,262, filed May 9, 2000, pending, which is a divisional of application Ser. No. 09/434,147, filed Nov. 4, 1999, now U.S. Pat. No. 6,196,096 B1, issued Mar. 6, 2001, which is a continuation of application Ser. No. 09/270,539, filed Mar. 17, 1999, abandoned, which is a divisional of application Ser. No. 09/069,561, filed Apr. 29, 1998, abandoned, which is a divisional of application Ser. No. 08/747,299, filed Nov. 12, 1996, pending.
Divisions (3)
|
Number |
Date |
Country |
Parent |
09434147 |
Nov 1999 |
US |
Child |
09567262 |
May 2000 |
US |
Parent |
09069561 |
Apr 1998 |
US |
Child |
09270539 |
Mar 1999 |
US |
Parent |
08747299 |
Nov 1996 |
US |
Child |
09069561 |
Apr 1998 |
US |
Continuations (2)
|
Number |
Date |
Country |
Parent |
09567262 |
May 2000 |
US |
Child |
09864737 |
May 2001 |
US |
Parent |
09270539 |
Mar 1999 |
US |
Child |
09434147 |
Nov 1999 |
US |