Apparatus for mechanical treatment

Industry

CPC
H01L21/67092

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67092Apparatus for mechanical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of transferring wafer
- Patent number 12,211,732
- Issue date Jan 28, 2025
- Disco Corporation
- Yoshinori Kakinuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,211,733
- Issue date Jan 28, 2025
- Ebara Corporation
- Nobuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding apparatus
- Patent number 12,205,832
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Jonghyeon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire tension adjustment method and wire tension adjuster
- Patent number 12,191,173
- Issue date Jan 7, 2025
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for cleaning substrates using high temperature...
- Patent number 12,186,684
- Issue date Jan 7, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Fuping Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method of processing wafer and processing apparatus for wafer
- Patent number 12,191,204
- Issue date Jan 7, 2025
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method and wafer processing apparatus
- Patent number 12,183,635
- Issue date Dec 31, 2024
- Disco Corporation
- Kenya Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for manufacturing a semiconductor package structure
- Patent number 12,183,712
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Che-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring semiconductor wafer to polishing apparatus a...
- Patent number 12,179,308
- Issue date Dec 31, 2024
- Sumco Corporation
- Ryoya Terakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure and clamp...
- Patent number 12,176,240
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Yun Di Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding two substrates
- Patent number 12,176,244
- Issue date Dec 24, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP cleaning and apparatus
- Patent number 12,170,195
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Ming Huang
- B08 - CLEANING
Information Patent Grant
Gimbal bonding tool and a method to correct surface non-uniformitie...
- Patent number 12,170,212
- Issue date Dec 17, 2024
- VueReal Inc.
- Drew Robert Gingras
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus
- Patent number 12,170,211
- Issue date Dec 17, 2024
- Disco Corporation
- Yuta Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for bonding
- Patent number 12,165,888
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 12,165,902
- Issue date Dec 10, 2024
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer adaptor for adapting different sized wafers
- Patent number 12,165,921
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Enrique Sarile
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire tension adjustment method and wire tension adjuster
- Patent number 12,154,801
- Issue date Nov 26, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleave systems having spring members for cleaving a semiconductor s...
- Patent number 12,148,635
- Issue date Nov 19, 2024
- GlobalWafers Co., Ltd.
- Justin Scott Kayser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material processing apparatus and operating method thereof
- Patent number 12,136,555
- Issue date Nov 5, 2024
- Shao-Chi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing machine
- Patent number 12,134,143
- Issue date Nov 5, 2024
- Disco Corporation
- Yuji Hadano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for bonding of substrates
- Patent number 12,131,907
- Issue date Oct 29, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing using femtosecond-based laser and plasma etch
- Patent number 12,131,952
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing semiconductor wafers
- Patent number 12,131,924
- Issue date Oct 29, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method of manufacturing semiconductor device
- Patent number 12,125,718
- Issue date Oct 22, 2024
- Kioxia Corporation
- Yoshio Mizuta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...
- Publication number 20250038038
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Osamu ZAIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM
- Publication number 20250029847
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Nathan IP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...
- Publication number 20250029864
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- KANG GYUNE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SEPARATING WAFER SLICES
- Publication number 20250029846
- Publication date Jan 23, 2025
- Yield Engineering Systems, Inc.
- Al Stone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE
- Publication number 20250018486
- Publication date Jan 16, 2025
- COMPTAKE TECHNOLOGY INC.
- YAO-GUANG YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH
- Publication number 20250022755
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Wei-Sheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250014889
- Publication date Jan 9, 2025
- Disco Corporation
- Akira MIZUTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20250014916
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Naoto Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRECTION APPARATUS, EXPOSURE APPARATUS, COATER AND DEVELOPER APPA...
- Publication number 20250014918
- Publication date Jan 9, 2025
- Nikon Corporation
- Go ICHINOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD
- Publication number 20250014917
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Naoto Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE AND EDGE TRIMMING APPARATUS
- Publication number 20240429087
- Publication date Dec 26, 2024
- Disco Corporation
- Kokichi MINATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING
- Publication number 20240420978
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRAPURE WATER SUPPLY APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLU...
- Publication number 20240417301
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jongha YUN
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME
- Publication number 20240413093
- Publication date Dec 12, 2024
- Nikon Corporation
- Isao Sugaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...
- Publication number 20240413021
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME
- Publication number 20240404867
- Publication date Dec 5, 2024
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Bonding Semiconductor Devices
- Publication number 20240395766
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kai-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20240395573
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Atsushi Nagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTANT-TEMPERATURE LIQUID SUPPLY APPARATUS
- Publication number 20240387210
- Publication date Nov 21, 2024
- Disco Corporation
- Tadaomi MATSUMOTO
- B24 - GRINDING POLISHING
Information Patent Application
AFFIXING DEVICE
- Publication number 20240383245
- Publication date Nov 21, 2024
- Mitsui Chemicals Tohcello, Inc.
- Masao NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20240387201
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Hirofumi OKI
- B24 - GRINDING POLISHING
Information Patent Application
DEVICE AND METHOD FOR BONDING
- Publication number 20240387202
- Publication date Nov 21, 2024
- EV GROUP E. THALLNER GMBH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING
- Publication number 20240387222
- Publication date Nov 21, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20240387177
- Publication date Nov 21, 2024
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240379402
- Publication date Nov 14, 2024
- Disco Corporation
- Tomoharu TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD, AND LASER PROCE...
- Publication number 20240375209
- Publication date Nov 14, 2024
- TOKYO SEIMITSU CO., LTD.
- Yusuke KANESHIRO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...
- Publication number 20240379389
- Publication date Nov 14, 2024
- YAMAHA HATSUDOKI KABUSHIKI KAISHA
- Yoshikuni SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20240367266
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS
- Publication number 20240363398
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20240363372
- Publication date Oct 31, 2024
- EBARA CORPORATION
- Mitsuru MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of transferring wafer

Substrate processing apparatus and substrate processing method

Substrate debonding apparatus

Bonding system

Laser dicing for singulation

Laser processing device, laser processing system and laser processi...

Wire tension adjustment method and wire tension adjuster

Method and apparatus for cleaning substrates using high temperature...

Method of processing wafer and processing apparatus for wafer

Wafer processing method and wafer processing apparatus

Method and system for manufacturing a semiconductor package structure

Method of transferring semiconductor wafer to polishing apparatus a...

Method for manufacturing semiconductor package structure and clamp...

Method for bonding two substrates

Post-CMP cleaning and apparatus

Gimbal bonding tool and a method to correct surface non-uniformitie...

Laser processing apparatus

Method and system for bonding

Substrate bonding apparatus and substrate bonding method

Wafer adaptor for adapting different sized wafers

Wire tension adjustment method and wire tension adjuster

Cleave systems having spring members for cleaving a semiconductor s...

Method and apparatus for use in wafer processing

Carrier for microelectronic assemblies having direct bonding

Material processing apparatus and operating method thereof

Laser processing machine

Device and method for bonding of substrates

Wafer dicing using femtosecond-based laser and plasma etch

Method for processing semiconductor wafers

Bonding apparatus and method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MANUFACTURING DEVICE, WAFER MOUNTING DEVICE, DICING D...

INTEGRATED METROLOGY FOR PROCESS CONTROLS IN WAFER BONDING SYSTEM

CHUCK TABLE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD USING TH...

APPARATUS AND METHOD FOR SEPARATING WAFER SLICES

SYSTEM AND METHOD OF THINNING WAFER SUBSTRATE

WAFER DICING USING FEMTOSECOND-BASED LASER AND PLASMA ETCH

PROCESSING METHOD OF WAFER

SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD

CORRECTION APPARATUS, EXPOSURE APPARATUS, COATER AND DEVELOPER APPA...

SEPARATING APPARATUS, SEPARATING SYSTEM AND SEPARATING METHOD

CHUCK TABLE AND EDGE TRIMMING APPARATUS

RETAINING RING FOR CHEMICAL-MECHANICAL POLISHING

ULTRAPURE WATER SUPPLY APPARATUS, SUBSTRATE PROCESSING SYSTEM INCLU...

APPARATUS FOR STACKING SUBSTRATES AND METHOD FOR THE SAME

METHOD OF MEASURING THICKNESS OF SEMICONDUCTOR WAFER AND INSPECTING...

APPARATUS INCLUDING A BONDING HEAD AND A METHOD OF USING THE SAME

System and Method for Bonding Semiconductor Devices

BONDING METHOD AND BONDING SYSTEM

CONSTANT-TEMPERATURE LIQUID SUPPLY APPARATUS

AFFIXING DEVICE

SEMICONDUCTOR MANUFACTURING APPARATUS

DEVICE AND METHOD FOR BONDING

METHOD OF COMPENSATING DIE SHIFT IN THE COMPRESSION MOLDING

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

WAFER PROCESSING METHOD

LASER IRRADIATING DEVICE, LASER IRRADIATING METHOD, AND LASER PROCE...

EXPANDING DEVICE, SEMICONDUCTOR CHIP MANUFACTURING METHOD, AND SEMI...

PROCESSING APPARATUS AND PROCESSING METHOD

SEMICONDUCTOR DIE HAVING EDGE WITH MULTIPLE GRADIENTS

SUBSTRATE PROCESSING APPARATUS