Claims
- 1. A method for dicing semiconductor devices of different dimensions from a semiconductor substrate, comprising:providing a semiconductor substrate including a plurality of semiconductor devices, at least two semiconductor devices of said plurality of semiconductor devices having at least one different corresponding dimension; and forming at least one die corresponding to one of said plurality of semiconductor devices.
- 2. The method of claim 1, wherein said forming said at least one die comprises forming at least one die with at least one semiconductor device thereon.
- 3. The method of claim 1, wherein said forming comprises varying a lateral distance between successive parallel cuts of a saw to form said at least one different corresponding dimension between at least two semiconductor devices of said plurality of semiconductor devices.
- 4. The method of claim 3, wherein said varying includes laterally indexing said saw in multiples of a fixed increment of distance relative to said semiconductor substrate.
- 5. The method of claim 3, wherein said varying includes indexing said semiconductor substrate in multiples of a fixed increment of distance relative to said saw.
- 6. The method of claim 1, wherein said forming includes substantially simultaneously cutting said semiconductor substrate in at least two locations.
- 7. The method of claim 6, wherein said substantially simultaneously cutting is effected with a saw including at least two blades.
- 8. The method of claim 6, further including subsequently forming a single cut in said semiconductor substrate.
- 9. The method of claim 8, wherein said subsequently forming is effected with a single blade of a saw including at least two blades.
- 10. A method for dicing semiconductor devices of different dimensions from a semiconductor substrate, comprising:providing a semiconductor substrate carrying a plurality of electronic components, at least two electronic components of said plurality of electronic components having at least one different corresponding dimension; and forming at least one die corresponding to at least one of said plurality of electronic components.
- 11. The method of claim 10, wherein said forming said at least one die comprises forming at least one die with at least one electronic component thereon.
- 12. The method of claim 10, wherein said forming comprises varying a lateral distance between successive parallel cuts of a saw to form said at least one different corresponding dimension between at least two electronic components of said plurality of electronic components.
- 13. The method of claim 12, wherein said varying includes laterally indexing said saw in multiples of a fixed increment of distance relative to said semiconductor substrate.
- 14. The method of claim 12, wherein said varying includes indexing said semiconductor substrate in multiples of a fixed increment of distance relative to said saw.
- 15. The method of claim 10, wherein said forming includes substantially simultaneously cutting said semiconductor substrate in at least two locations.
- 16. The method of claim 15, wherein said substantially simultaneously cutting is effected with a saw including at least two blades.
- 17. The method of claim 15, further including subsequently forming a single cut in said semiconductor substrate.
- 18. The method of claim 17, wherein said subsequently forming is effected with a single blade of a saw including at least two blades.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is a continuation of application Ser. No. 09/434,147, filed Nov. 4, 1999, now U.S. Pat. No. 6,196,096, issued Mar. 6, 2001, which is a continuation of Ser. No. 09/270,539, filed Mar. 17, 1999, now U.S. Pat. No. 6,155,247, issued Dec. 5, 2000, which is a divisional of application Ser. No. 09/069,561, filed Apr. 29, 1998, now U.S. Pat. No. 6,119,675, issed Sep. 19, 2000, which is a divisional of application Ser. No. 08/747,299, filed Nov. 12, 1996, now abandoned.
US Referenced Citations (57)
Foreign Referenced Citations (2)
Number |
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287869 |
Oct 1915 |
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2810054 |
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Continuations (2)
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09/753159 |
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09/270539 |
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09/434147 |
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