Patent Application
20120187111
1. Field of the Invention
The present invention relates to a method for soldering electronic components to a circuit board and more particularly to a method for soldering electronic components to a circuit board by means of employing a high-frequency soldering technique.
2. Description of the Related Art
Conventionally, when soldering electronic components to a circuit board, it is the common way to apply a solder paste, for example, tin paste to solder contacts at the circuit board at first, and then to arrange the electronic components on the circuit board and to keep lead pins of the electronic components in contact with the solder contacts of the circuit board, and then to send the circuit board with the arranged electronic components to a reflow oven. Thus, the high temperature in the reflow oven can melt the solder paste, enabling the electronic components to be soldered to the circuit board.
However, a reflow oven has a big size and occupies much installation space. Further, a reflow oven must be pre-heated to the desired temperature before use. During soldering, the reflow oven transfers thermal energy from its outer side toward its inner side, and therefore the soldering process takes much time to melt the applied solder paste, consuming much electrical energy and increasing the soldering cost.
The present invention has been accomplished under the circumstances in view. It is the main object of the present invention to provide method for soldering electronic components to a circuit board, which involves a high-frequency soldering technique.
It is another object of the present invention to provide method for soldering electronic components to a circuit board by employing a high-frequency soldering technique, which prohibits the electronic components from biasing during soldering.
To achieve these and other objects of the present invention, object of the present invention, a method for soldering electronic components to a circuit board includes the steps of: (a) preparing a circuit board having at least one solder contact and a solder paste applied to the at least one solder contact; (b) arranging at least one electronic component on the circuit board and keeping at least one pin of the at least one electronic component in contact with the at least one solder contact of the circuit board; and (c) applying a high frequency to melt the solder paste for enabling the at least one electronic component to be electrically connected to the circuit board electrically by the solder paste. By means of employing a high-frequency soldering technique to melt the applied solder paste rapidly, the invention saves much the soldering time and the consumption of electrical energy and relatively lowers the soldering cost.
Further, the solder paste can be applied to the at least one solder contact by printing.
In one embodiment of the present invention, the solder paste is applied to the top wall of the circuit board over the at least one solder contact during step (a), and the at least one pin of the at least one electronic component is kept in contact with the at least one solder contact at the top wall of the circuit board during step (b).
In another embodiment of the present invention, each solder contact of the circuit board is a via hole and the solder paste is applied to a bottom wall of the circuit board around each via hole during step (a); the at least one pin of the at least one electronic component is respectively inserted into the at least one via hole of the circuit board and kept in contact with the solder paste during step (b).
The method of the invention further comprises, after step (b) and before step (c), a sub step of preparing a cover plate having bottom at least one bottom recess corresponding to the at least one electronic component and then covering the cover plate on the circuit board over the at least one electronic component to accommodate the at least one electronic component in the at least one bottom recess.
Further, applying a high frequency to melt the solder paste during step (c) is done by means of placing the circuit board in an induction coil after arrangement of the at least one electronic component on the circuit board and then applying a high-frequency current to the induction coil to melt the solder paste.
Other and further benefits, advantages and features of the present invention will be understood by reference to the following specification in conjunction with the accompanying drawings, in which like reference characters denote like elements of structure.
Referring to
At first, as shown in
Thereafter, as shown in
At final, as shown in
In actual practice, the power level of the high-frequency current being applied to the induction coil 20, a length of time in which the high-frequency current is applied to the induction coil 20 and the distance between the induction coil 20 and the circuit board 10 can determine the melting speed of the solder paste 13.
As stated above, the invention involves the application of a high frequency to melt the solder paste rapidly. When compared to the conventional techniques, the invention greatly shortens the soldering time and greatly reduces the consumption of electrical energy, thereby lowering the soldering cost.
In conclusion, the invention provides a method for bonding electronic components to a circuit board, which involves a high-frequency soldering technique to melt the applied solder paste rapidly, saving much the soldering time and electrical energy consumption and relatively lowering the soldering cost. Further, subject to the use of the cover plate to hold electronic components in position for accurate soldering, the invention prevents soldering failure due to deviation of electronic components from respective contacts, and assures a high level of soldering quality.
| Number | Date | Country | Kind |
|---|---|---|---|
| 100102394 | Jan 2011 | TW | national |
