Number | Date | Country | Kind |
---|---|---|---|
3-320809 | Dec 1991 | JPX |
Filing Document | Filing Date | Country | Kind | 102e Date | 371c Date |
---|---|---|---|---|---|
PCT/JP92/01586 | 12/4/1992 | 2/1/1993 | 2/1/1993 |
Number | Name | Date | Kind |
---|---|---|---|
4735679 | Lasky | Apr 1988 | |
4879258 | Fisher | Nov 1989 | |
5081796 | Schultz | Jan 1992 |
Number | Date | Country |
---|---|---|
62-78260 | May 1987 | JPX |
62-199354 | Sep 1987 | JPX |
64-7548 | Jan 1989 | JPX |
1-136328 | May 1989 | JPX |
2-177435 | Jul 1990 | JPX |
2-237066 | Sep 1990 | JPX |
2-257629 | Oct 1990 | JPX |
3-104223 | May 1991 | JPX |
3-104224 | May 1991 | JPX |
3-108356 | May 1991 | JPX |
3-145129 | Jun 1991 | JPX |
3-180070 | Aug 1991 | JPX |
3-259521 | Nov 1991 | JPX |
Entry |
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W. J. Patrick et al., "Application of Chemical Mechanical Polishing to the Fabrication of VLSI Circuit Interconnections", J. Electrochem. Soc., vol. 138, No. 6, Jun. 1991, pp. 1778-1784. |
Translation of Miyajima JP 3-108356. |
Translation of Usui Shoji et al. JP 3-145129. |
Translation of Nemoto et al. JP 2-257629. |
Translation of Arimoto JP 2-237066. |
Translation of Ogawa JP 62-199354. |
"A Computer Controlled Polishing System for Silicon-on-Insulator (SOI)", Yamada et al, 5th International Workshop on Future Electron Devices-Three Dimensional Integration-(FED 3D Workshop), May 30-Jun. 1, 1988, Miyagi-Zao, pp. 201-205. |