Claims
- 1. A device for determining an end of cleaning of a semiconductor manufacturing apparatus having a semiconductor substrate process chamber comprising:
- means for cleaning an interior of the chamber using plasma discharge etching;
- means for monitoring a temperature in the chamber; and
- means for detecting a transition in a rate of change of the monitored temperature to determine the end of the cleaning.
- 2. A device according to claim 1, wherein said detecting means determines the end of cleaning after a predetermined period of time has elapsed from the occurrence of the transition in the temperature change rate, said predetermined period of time resulting in overetching in the chamber.
Priority Claims (1)
Number |
Date |
Country |
Kind |
62-78505 |
Mar 1987 |
JPX |
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Parent Case Info
This is a division of application Ser. No. 07/320,643, filed Nov. 30, 1988, now U.S. Pat. No. 5,016,663.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4207137 |
Tretola |
Jun 1980 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
55-34229 |
Sep 1980 |
JPX |
0019624 |
Feb 1981 |
JPX |
58-79722 |
May 1983 |
JPX |
2076330 |
Dec 1981 |
GBX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
320643 |
Nov 1988 |
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