This application is a continuation of application Ser. No. 07/199,561 filed May 27, 1988, now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
3482263 | Ryder | Dec 1969 | |
3487353 | Massa | Dec 1969 | |
3668299 | McNeal | Jun 1972 | |
3772637 | Paullus et al. | Nov 1973 | |
3784952 | Murray | Jan 1974 | |
3816641 | Iversen | Jun 1974 | |
3914003 | Loy | Oct 1975 | |
3951506 | Bennett et al. | Apr 1976 | |
4083902 | Clyde | Apr 1978 | |
4179319 | Lofdahl | Dec 1979 | |
4335932 | Herrmann Jr. | Jun 1982 | |
4514752 | Engel et al. | Apr 1985 | |
4656315 | Rathmachers et al. | Apr 1987 | |
4663833 | Tanaka et al. | May 1987 | |
4679875 | Ramsey | Jul 1987 |
Number | Date | Country |
---|---|---|
47901 | Jan 1979 | DEX |
Entry |
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Adhesive and Sealant Compound Formulations, Second Edition, 1984. |
Polymer Materials for Electronic Applications, Ace Symposium Series 184. |
Polymers in Electronics, Ace Symposium Series 242. |
Concise Encyclopedia of Chemical Technology. |
Adhesives, Sealants, and Coatings for the Electronic Industry by Ernest W. Flick. |
Catalog entitle, "Leaders in Micro-Precision Technology", (select pages). |
Number | Date | Country | |
---|---|---|---|
Parent | 199561 | May 1988 |