Kikkawa et al, "A Quarter Micrometer Interconnection Technology Using a TiN/Al-Si-Cu/TiN/Al-Si-Cu/TiN/Ti Multilayer Structure", IEEE Trans. on Elect. Devices, vol. 40, No. 2, Feb. 1993, pp. 296-302. |
Moreau, "Contribution a l'etude des Textures dans les Couches Minces Caracterisation de Barrieres de Diffusion de Nitrure de Titane", Doctoral Thesis, UFR-MIM-Sciences of the University of Metz, 1993, pp. 85; 99-101, 106-107. |
Kageyama et al, "Formation of Texture Controlled Aluminum and its Migration Performonce In Al-Si/TiN Stacked Structure", 29th Annual Proceedings, Reliability Physics, IEEE, 1991, pp. 97-101. |
Biberger et al, "Comparison of the Film Properties of Sequentially Deposited Non-Collimated Ti/TiN Versus Collimated Ti/TiN", Defect Structure Morphology And Properties Of Deposits, Proceedings of a Symposium sponsored by the Non-Ferrous Metals Committee of the Structural Materials Division (SMD) and the Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic and Photonic Materials Division (EMPMD) of the Minerals, Metals & Materials Society held during Materials Week '94 in Rosemount, Illinois, Oct. 4-6, 1994, edited by Harish D. Merchant, pp. 379-391. |
J. J. Estabil et al., Electromigration Improvements With Titanium Underlay And Overlay In Al(Cu) Metallurgy, VMIC Conference, 1991 IEEE, Jun. 11-12, 1991, pp. 242-248. |
C. C. Lee et al., Roles Of Ti-intermetallic Compound Layers On The Electromigration Resistance Of Al-Cu Interconnecting Stripes, J. Appl. Phys. 71 (12), 15 Jun. 1992, pp. 5877-5887. |
M. Ben-Tzur et al., Modifications In The Interfacial Reaction Between Thin Films Of Ti and Al Due To Alloying The Al With Si, J. Vac. Sci. Technol. A8 (6), Nov./Dec. 1990, pp. 4069-4071. |