Claims
- 1. A method of forming a module of an electrical system for an automobile, comprising the steps of:
- subjecting to heat treatment a substrate formed from stainless steel sheet, the heat treatment being such as to heat the substrate to a temperature in the range 800 degrees C. to 1000 degrees C., whereby a chromium oxide layer is formed on the substrate;
- applying an initial adhesion layer of a dielectric material to a surface portion of the substrate such that an uncoated surface portion remains exposed, the dielectric material being selected to have a coefficient of thermal expansion substantially equal that of stainless steel;
- subsequently applying a final layer of a further dielectric material selected to have a coefficient of thermal expansion substantially matched to that of a thick film ink;
- applying electrical components including conductors by a screen printing process in which thick film inks are printed onto the final layer to thereby form a thick film circuit; and
- surface mounting further electrical components by soldering to conductors of the thick film circuit.
- 2. A method as claimed in claim 1, further comprising the step of mounting the module in the vehicle such that an uncoated surface portion of the substrate is in contact with a body panel of the vehicle.
- 3. A method as claimed in claim 2, further comprising a step of bending the substrate into a desired shape such that the substrate constitutes a structural element of the vehicle.
- 4. A method as claimed in claim 2, further comprising the step of encapsulating the thick film circuit in a moisture-proof coating.
- 5. A method as claimed in claim 1, including the step of applying at least one additional layer of dielectric material to the initial adhesion layer before the addition of the final layer, the respective dielectric material of the at least one additional layer being selected such that the coefficients of thermal expansion of the dielectric layers are progressively graded.
Priority Claims (1)
| Number |
Date |
Country |
Kind |
| 8908366 |
Apr 1989 |
GBX |
|
Parent Case Info
This application is a divisional application of application Ser. No. 508,285, filed 13 Apr. 1990, now U.S. Pat. No. 5,198,696.
US Referenced Citations (4)
Foreign Referenced Citations (1)
| Number |
Date |
Country |
| 253244 |
Jan 1988 |
EPX |
Non-Patent Literature Citations (1)
| Entry |
| IBM Technical Disclosure Bulletin vol. 25 No. 2 Jul. 1982 pp. 653-655 by N. G. Aakalu et al. |
Divisions (1)
|
Number |
Date |
Country |
| Parent |
508285 |
Apr 1990 |
|