Adding a circuit layer by thick film methods

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CPC
H05K3/4664

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4664Adding a circuit layer by thick film methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Additive manufacturing process of 3D electronic substrate
- Patent number 12,226,822
- Issue date Feb 18, 2025
- Schlumberger Technology Corporation
- Steven O. Dunford
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
RF absorbing structures
- Patent number 12,185,453
- Issue date Dec 31, 2024
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring formation method
- Patent number 12,096,570
- Issue date Sep 17, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing of multilayer circuits on graphics
- Patent number 12,052,832
- Issue date Jul 30, 2024
- JABIL INC.
- Sai Guruva Reddy Avuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic band gap element structure and fabrication methods
- Patent number 11,937,380
- Issue date Mar 19, 2024
- Nano Dimension Technologies, LTD.
- Minoru Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board and component fabrication apparatus
- Patent number 11,919,227
- Issue date Mar 5, 2024
- DST INNOVATIONS, LTD.
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusing electronic components into three-dimensional objects via add...
- Patent number 11,911,825
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method and system for fabricating cross-layer pattern
- Patent number 11,904,525
- Issue date Feb 20, 2024
- Stratasys Ltd.
- Daniel Dikovsky
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component carrier with embedded component covered by functional fil...
- Patent number 11,877,388
- Issue date Jan 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Imane Souli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufactured 3D electronic substrate
- Patent number 11,765,839
- Issue date Sep 19, 2023
- Schlumberger Technology Corporation
- Steven O. Dunford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making smart functional leather
- Patent number 11,665,830
- Issue date May 30, 2023
- Honda Motor Co., Ltd.
- Zainab I. Ali
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Metal body formed on a component carrier by additive manufacturing
- Patent number 11,659,648
- Issue date May 23, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Backplane and method for producing same
- Patent number 11,602,067
- Issue date Mar 7, 2023
- Siemens Aktiengesellschaft
- Joachim Seidl
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayered board
- Patent number 11,503,707
- Issue date Nov 15, 2022
- UNIJET CO., LTD.
- Sung-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus for performing additive manufacturing of an...
- Patent number 11,470,724
- Issue date Oct 11, 2022
- FUJI CORPORATION
- Masato Suzuki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Systems and methods of fabricating SMT mounting sockets
- Patent number 11,395,412
- Issue date Jul 19, 2022
- Nano Dimension Technologies, LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a three dimensionally printed wiring struc...
- Patent number 11,388,824
- Issue date Jul 12, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor chip having a plurality of LED for image display
- Patent number 11,373,978
- Issue date Jun 28, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Umberto Rossini
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Three-dimensional printing
- Patent number 11,304,313
- Issue date Apr 12, 2022
- Hewlett-Packard Development Company, L.P.
- Sterling Chaffins
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Electronic devices comprising a via and methods of forming such ele...
- Patent number 11,284,521
- Issue date Mar 22, 2022
- 3M Innovative Properties, Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for in situ sintering of conductive ink
- Patent number 11,191,167
- Issue date Nov 30, 2021
- Stratasys Ltd.
- Ira Yudovin-Farber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Enclosure with tamper respondent sensor
- Patent number 11,191,154
- Issue date Nov 30, 2021
- International Business Machines Corporation
- Silvio Dragone
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...
- Publication number 20250040060
- Publication date Jan 30, 2025
- enovate3D (Hangzhou) Technology Development Co., Ltd.
- Wangcan Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS
- Publication number 20240431038
- Publication date Dec 26, 2024
- Jabil Inc.
- Sai Guruva Reddy Avuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...
- Publication number 20240260201
- Publication date Aug 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Tianzhu Fan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODU...
- Publication number 20240251500
- Publication date Jul 25, 2024
- Canon Kabushiki Kaisha
- HIROKI SAITO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240237205
- Publication date Jul 11, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240147630
- Publication date May 2, 2024
- FUJIFILM CORPORATION
- Kazuo KAMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...
- Publication number 20240138062
- Publication date Apr 25, 2024
- Liquid Wire, LLC
- Mark S. Kruskopf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD
- Publication number 20240015892
- Publication date Jan 11, 2024
- Primax Electronics Ltd.
- Yi-Te Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof
- Publication number 20230413430
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC BAND GAP ELEMENT STRUCTURE AND FABRICATION METHODS
- Publication number 20230397340
- Publication date Dec 7, 2023
- NANO-DIMENSION TECHNOLOGIES LTD.
- Minoru Yamada
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...
- Publication number 20230389170
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HUAN-YU HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CERAMIC PACKAGE HAVING A MULTILAYER CERAMIC BASE AND AT...
- Publication number 20230380077
- Publication date Nov 23, 2023
- Kyocera International, Inc.
- Hiroshi MAKINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230262888
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Hiromichi TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM
- Publication number 20230240022
- Publication date Jul 27, 2023
- IO TECH GROUP LTD.
- Ralph S. Birnbaum
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230156907
- Publication date May 18, 2023
- GN Hearing A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RF ABSORBING STRUCTURES
- Publication number 20230126395
- Publication date Apr 27, 2023
- Pivotal Commware, Inc.
- Jay Howard McCandless
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING FORMATION METHOD
- Publication number 20230112913
- Publication date Apr 13, 2023
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF
- Publication number 20220346225
- Publication date Oct 27, 2022
- YingKeSong BiYe Research and Development Center Shenzhen CO.,LTD
- Hao Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220240378
- Publication date Jul 28, 2022
- FUJI CORPORATION
- Tasuku TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INK JET PRINTING OF A SUBSTRATE
- Publication number 20220192035
- Publication date Jun 16, 2022
- Notion Systems GmbH
- David Hahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS OF FABRICATING SMT MOUNTING SOCKETS
- Publication number 20220095461
- Publication date Mar 24, 2022
- NANO-DIMENSION TECHNOLOGIES LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220046802
- Publication date Feb 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS
- Publication number 20220007520
- Publication date Jan 6, 2022
- Jabil Inc.
- Sai Guruva Reddy Avuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Component Carrier With Embedded Component Covered by Functional Fil...
- Publication number 20210400803
- Publication date Dec 23, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Imane Souli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUSING ELECTRONIC COMPONENTS INTO THREE-DIMENSIONAL OBJECTS VIA ADD...
- Publication number 20210362411
- Publication date Nov 25, 2021
- Hewlett-Packard Development Company, L.P.
- Kristopher J. Erickson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING CROSS-LAYER PATTERN
- Publication number 20210283828
- Publication date Sep 16, 2021
- STRATASYS LTD.
- Daniel DIKOVSKY
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THREE-DIMENSIONAL PRINTING
- Publication number 20210282276
- Publication date Sep 9, 2021
- Hewlett-Packard Development Company, L.P.
- Sterling Chaffins
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
- Publication number 20210243904
- Publication date Aug 5, 2021
- NANO-DIMENSION TECHNOLOGIES LTD.
- Avishai Ya'ary
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Adding a circuit layer by thick film methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Additive manufacturing process of 3D electronic substrate

Printed circuit board and manufacturing method thereof

RF absorbing structures

Circuit board using thermocouple to dissipate generated heat and me...

Wiring formation method

Electromagnetic wave transmission board comprising an inner board w...

Circuit board and method for manufacturing the same

Printing of multilayer circuits on graphics

Circuit board

Electromagnetic band gap element structure and fabrication methods

Circuit board and component fabrication apparatus

Fusing electronic components into three-dimensional objects via add...

Method and system for fabricating cross-layer pattern

Component carrier with embedded component covered by functional fil...

Additive manufactured 3D electronic substrate

Method of making smart functional leather

Metal body formed on a component carrier by additive manufacturing

Backplane and method for producing same

Circuit board and method for manufacturing the same

Manufacturing method of multilayered board

Manufacturing apparatus for performing additive manufacturing of an...

Systems and methods of fabricating SMT mounting sockets

Component carrier having a three dimensionally printed wiring struc...

Semiconductor chip having a plurality of LED for image display

Methods and processes for forming electrical circuitries on three-d...

Three-dimensional printing

Electronic devices comprising a via and methods of forming such ele...

Method for producing resin multilayer board

Method and system for in situ sintering of conductive ink

Enclosure with tamper respondent sensor

Patents Applicationslast 30 patents

HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...

PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS

UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYS...

WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODU...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING CIRCUIT ASSEMBLI...

MANUFACTURING METHOD OF MEMBRANE CIRCUIT BOARD

Printed Circuit Board and Manufacturing Method Thereof

ELECTROMAGNETIC BAND GAP ELEMENT STRUCTURE AND FABRICATION METHODS

CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...

MULTI-LAYER CERAMIC PACKAGE HAVING A MULTILAYER CERAMIC BASE AND AT...

MULTILAYER STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

HYBRID PROCESS FOR PCB PRODUCTION BY LAD SYSTEM

CIRCUIT BOARD

RF ABSORBING STRUCTURES

WIRING FORMATION METHOD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

SIMPLIFIED PEN CORE MODULE AND THE PREPARATION METHOD THEREOF

MULTILAYER CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR INK JET PRINTING OF A SUBSTRATE

SYSTEMS AND METHODS OF FABRICATING SMT MOUNTING SOCKETS

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS

Component Carrier With Embedded Component Covered by Functional Fil...

FUSING ELECTRONIC COMPONENTS INTO THREE-DIMENSIONAL OBJECTS VIA ADD...

METHOD AND SYSTEM FOR FABRICATING CROSS-LAYER PATTERN

THREE-DIMENSIONAL PRINTING

DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS