Number | Date | Country | Kind |
---|---|---|---|
63-222273 | Sep 1988 | JPX | |
63-289208 | Nov 1988 | JPX | |
63-326687 | Dec 1988 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
4283439 | Higashinakagawa et al. | Aug 1981 | |
4582563 | Hazuki et al. | Apr 1986 | |
4584207 | Wilson | Apr 1986 | |
4617193 | Wu | Oct 1986 | |
4746621 | Thomas et al. | May 1988 | |
4764484 | Mo | Aug 1988 |
Number | Date | Country |
---|---|---|
139026 | Jun 1986 | JPX |
141740 | Jun 1987 | JPX |
Entry |
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"High-Density High-Reliability Tungsten Interconnection by Filled Interconnect Groove Metallization", IEEE Transactions on Electron Devices, vol. 35, No. 7, Jul. 1988. |
S. K. Ghandhi, VLSI Fabrication Principles, John Wiley & Sons, New York, (1983), pp. 424-427. |