Deposition of metallic or metal-silicide layers

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H01L21/32051

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/32051Deposition of metallic or metal-silicide layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,176,216
- Issue date Dec 24, 2024
- Kokusai Electric Corporation
- Motomu Degai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,148,621
- Issue date Nov 19, 2024
- Kokusai Electric Corporation
- Koei Kuribayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming semiconductor device
- Patent number 12,142,628
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Ming Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing the surface roughness of a metal layer
- Patent number 12,094,722
- Issue date Sep 17, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Pollet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of fabricating the same
- Patent number 12,057,469
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively depositing a metallic film on a substrate
- Patent number 12,033,861
- Issue date Jul 9, 2024
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,009,281
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency modules
- Patent number 12,003,025
- Issue date Jun 4, 2024
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Butted contacts and methods of fabricating the same in semiconducto...
- Patent number 12,002,756
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,967,500
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Arito Ogawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Directional deposition for semiconductor fabrication
- Patent number 11,955,338
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chun Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,935,926
- Issue date Mar 19, 2024
- SK Hynix Inc.
- Hyeng-Woo Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of manufacturing a semiconductor device
- Patent number 11,935,728
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation system and related methods
- Patent number 11,929,285
- Issue date Mar 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,915,936
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 11,898,247
- Issue date Feb 13, 2024
- Kokusai Electric Corporation
- Hidenari Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and systems for depositing a layer comprising vanadium, nit...
- Patent number 11,887,857
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Dieter Pierreux
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced spatial ALD of metals through controlled precursor mixing
- Patent number 11,887,856
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Kelvin Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing fluorine/carbon-free conformal tungsten
- Patent number 11,887,855
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Xinyu Fu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for manufacturing semiconductor layer
- Patent number 11,876,001
- Issue date Jan 16, 2024
- NEXCHIP SEMICONDUCTOR CORPORATION
- Baoyou Gong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,468
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon structure including protective layer
- Patent number 11,855,086
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Shao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermally conductive wafer layer
- Patent number 11,854,933
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with different threshold voltages
- Patent number 11,848,368
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lung-Kun Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with wireless charging means
- Patent number 11,837,517
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS
- Publication number 20240412981
- Publication date Dec 12, 2024
- Entegris, Inc.
- Phil S.H. Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...
- Publication number 20240412980
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Homoleptic Bismuth Precursors For Depositing Bismuth Oxide Containi...
- Publication number 20240392433
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Sergei V. Ivanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Metal Gapfill
- Publication number 20240395614
- Publication date Nov 28, 2024
- Toyota Research Institute, Inc.
- Yi XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE
- Publication number 20240384400
- Publication date Nov 21, 2024
- L'air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation Des Procedes Ge...
- Rocio Alejandra ARTEAGA MULLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device
- Publication number 20240379727
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Ming LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING MOLYBDENUM MONOFLUORIDE TO MOLYBDENUM PENTAFLUO...
- Publication number 20240368755
- Publication date Nov 7, 2024
- Central Glass Co., Ltd.
- Akiou KIKUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES
- Publication number 20240371710
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lan-Chou Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, POWER CONVERTER AND MANUFACTURING METHOD F...
- Publication number 20240355874
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Atsufumi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME
- Publication number 20240355868
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chiun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...
- Publication number 20240347476
- Publication date Oct 17, 2024
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS STRUCTURE WITH MICROCHANNELS
- Publication number 20240332124
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SE...
- Publication number 20240318039
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Yearin BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANU...
- Publication number 20240318040
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Yearin Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...
- Publication number 20240321746
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240318037
- Publication date Sep 26, 2024
- Kctech Co.,Ltd.
- Yearin Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20240297209
- Publication date Sep 5, 2024
- TOKYO ELECTRON LIMITED
- Susumu YAMAUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Layered Substrate with Ruthenium Layer and Method for Producing
- Publication number 20240282709
- Publication date Aug 22, 2024
- Zhaoxuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING DEFECTS ESTIMATING METHOD AND SEMICONDUCTOR DEVICE MANUFACT...
- Publication number 20240282643
- Publication date Aug 22, 2024
- HITACHI POWER SEEMICONDUCTOR DEVICE, LTD.
- Reo Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGULATOR CIRCUIT PACKAGE TECHNIQUES
- Publication number 20240282714
- Publication date Aug 22, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240271278
- Publication date Aug 15, 2024
- Kokusai Electric Corporation
- Atsushi Sano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...
- Publication number 20240266291
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Eunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS TUNGSTEN LAYER DEPOSITION
- Publication number 20240266215
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, ASSEMBLY AND SYSTEM FOR FILM DEPOSITION AND CONTROL
- Publication number 20240258154
- Publication date Aug 1, 2024
- ASM IP HOLDING B.V.
- Jereld Lee Winkler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240242942
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS

Deposition of metallic or metal-silicide layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing semiconductor device, substrate processing...

Method of processing substrate, method of manufacturing semiconduct...

Method of forming semiconductor device

Method for increasing the surface roughness of a metal layer

Semiconductor device and a method of fabricating the same

Method for selectively depositing a metallic film on a substrate

Package structure and method of manufacturing the same

Selectively shielded radio frequency modules

Butted contacts and methods of fabricating the same in semiconducto...

Thermal routing trench by additive processing

Method of manufacturing semiconductor device, substrate processing...

Devices and methods related to dual-sided radio-frequency package w...

Directional deposition for semiconductor fabrication

Regulator circuit package techniques

Semiconductor device and method for fabricating the same

Apparatus and method of manufacturing a semiconductor device

Methods of manufacturing an integrated circuit having stress tuning...

Backside metal patterning die singulation system and related methods

Semiconductor structure and manufacturing method thereof

Substrate processing apparatus, method of manufacturing semiconduct...

Methods and systems for depositing a layer comprising vanadium, nit...

Enhanced spatial ALD of metals through controlled precursor mixing

Methods for depositing fluorine/carbon-free conformal tungsten

Method and system for manufacturing semiconductor layer

Semiconductor device and method

Polysilicon structure including protective layer

Semiconductor device, method and machine of manufacture

Thermally conductive wafer layer

Transistors with different threshold voltages

Packaged semiconductor devices with wireless charging means

Patents Applicationslast 30 patents

COPPER REFLOW BY SURFACE MODIFICATION

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

SELECTIVE RUTHENIUM DEPOSITION AND RELATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE WITH INTERCONNECTS FORMED THROUGH ATOMIC LAYER...

Homoleptic Bismuth Precursors For Depositing Bismuth Oxide Containi...

Method for Metal Gapfill

METHOD OF FORMING A RUTHENIUM-CONTAINING LAYER AND LAMINATE

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

Method of Forming Semiconductor Device

SEMICONDUCTOR DEVICES

METHOD FOR REMOVING MOLYBDENUM MONOFLUORIDE TO MOLYBDENUM PENTAFLUO...

TEST LINE STRUCTURE FOR INTEGRATED CHIP COMPRISING OPTICAL DEVICES

SEMICONDUCTOR APPARATUS, POWER CONVERTER AND MANUFACTURING METHOD F...

SEMICONDUCTOR DEVICE AND A METHOD OF FABRICATING THE SAME

METHODS RELATED TO DUAL-SIDED RADIO-FREQUENCY PACKAGE WITH OVERMOLD...

POROUS STRUCTURE WITH MICROCHANNELS

CHEMICAL MECHANICAL POLISHING SLURRY AND METHOD OF MANUFACTURING SE...

CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION AND METHOD OF MANU...

BUTTED CONTACTS AND METHODS OF FABRICATING THE SAME IN SEMICONDUCTO...

SLURRY COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE...

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

FILM FORMING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

Layered Substrate with Ruthenium Layer and Method for Producing

PLATING DEFECTS ESTIMATING METHOD AND SEMICONDUCTOR DEVICE MANUFACT...

REGULATOR CIRCUIT PACKAGE TECHNIQUES

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND MET...

LOW STRESS TUNGSTEN LAYER DEPOSITION

METHOD, ASSEMBLY AND SYSTEM FOR FILM DEPOSITION AND CONTROL

APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE