Claims
- 1. The method of forming a unitary heat sink metal body for use in removal of heat from a heat generating electronic device package comprising the steps of:
- (a) extruding a unitary metal body of heat conducting material having a base surface on a first side thereof adapted to be positioned in thermally conductive contact with a heat generating electronic device package, said body including a predetermined number of parallel fins extending outwardly a first predetermined height from a side opposite said base surface, said predetermined number of parallel fins separated by a first predetermined number of parallel grooves of a first predetermined width and a first predetermined depth with the ratio of said first predetermined height to said first predetermined width being at least four to one; and
- (b) sawing the first predetermined number of parallel grooves to a second predetermined depth to provide a second predetermined height to said parallel fins, whereby the ratio of the second predetermined height of said predetermined number of parallel fins to the first predetermined width of said first predetermined number of parallel grooves is at least six to one.
- 2. The method set forth in claim 1 further including the step of sawing a second predetermined number of parallel grooves across and through said predetermined number of parallel fins to form a second predetermined number of parallel grooves having a third predetermined depth and a third predetermined width to form pins.
- 3. The method set forth in claim 2 wherein said third predetermined depth is substantially equal to said second predetermined depth.
- 4. The method set forth in claim 1 further including the step of surface treating the exterior surfaces of said unitary heat sink body.
- 5. The method set forth in claim 2 further including the step of surface treating the exterior surfaces of said unitary heat sink body.
Parent Case Info
This application is a division of application Ser. No. 07/262,695 filed Oct. 26, 1988 which is a continuation of application Ser. No. 07/042,706 filed Apr. 27, 1987 entitled Heat Sink Apparatus and Method of Manufacture, now abandoned.
US Referenced Citations (11)
Foreign Referenced Citations (1)
Number |
Date |
Country |
1213484 |
Apr 1960 |
FRX |
Non-Patent Literature Citations (1)
Entry |
IBM Technical Disclosure Bulletin-vol. 11, No. 10 Mar. 1969 (by J. R. Bryden). |
Divisions (1)
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Number |
Date |
Country |
Parent |
262695 |
Oct 1988 |
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Continuations (1)
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Number |
Date |
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Parent |
42706 |
Apr 1987 |
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