Mechanical treatment

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CPC
H01L21/4878

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4878Mechanical treatment

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cooling system and methods
- Patent number 12,133,365
- Issue date Oct 29, 2024
- Shuaib Badat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method forming a semiconductor package device
- Patent number 12,094,727
- Issue date Sep 17, 2024
- Silicon Motion, Inc.
- Yi-Hung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal substrates with structures formed therein and methods of maki...
- Patent number 12,087,670
- Issue date Sep 10, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 12,021,006
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging chip
- Patent number 12,002,685
- Issue date Jun 4, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation warpage reduction for semiconductor die assemblies an...
- Patent number 11,955,345
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a power module unit
- Patent number 11,915,990
- Issue date Feb 27, 2024
- Siemens Aktiengesellschaft
- Daniel Kappauf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas quench for diffusion bonding
- Patent number 11,905,583
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Joseph F. Behnke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and substrate with dimple region
- Patent number 11,842,968
- Issue date Dec 12, 2023
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,810,833
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,728,285
- Issue date Aug 15, 2023
- NXP USA, INC.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having warpage control and method of f...
- Patent number 11,699,668
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation component and method for manufacturing same
- Patent number 11,682,604
- Issue date Jun 20, 2023
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for thinning solid-body layers provided with components
- Patent number 11,664,277
- Issue date May 30, 2023
- Siltectra GmbH
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive structure for heat dissipation in semiconducto...
- Patent number 11,658,044
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor apparatus and method for manufacturing the same
- Patent number 11,600,546
- Issue date Mar 7, 2023
- Mitsubishi Electric Corporation
- Hiroyuki Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and power...
- Patent number 11,587,797
- Issue date Feb 21, 2023
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structures, methods for forming the same and semiconducto...
- Patent number 11,482,482
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, vehicle and manufacturing method
- Patent number 11,456,233
- Issue date Sep 27, 2022
- Fuji Electric Co., Ltd.
- Nobuhide Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-attach method to compensate for thermal expansion
- Patent number 11,430,744
- Issue date Aug 30, 2022
- Cree, Inc.
- David Seebacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
- Patent number 11,342,281
- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Burst resistant thin wall heat sink
- Patent number 11,131,506
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Paul W. Coteus
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded sheet metal heat sink
- Patent number 11,125,429
- Issue date Sep 21, 2021
- SIGNIFY HOLDING B.V.
- Gwendolyn Anita Luiten
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method and equipment for forming the same
- Patent number 11,062,971
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for a heat transfer interface and method of manufacturing...
- Patent number 11,032,942
- Issue date Jun 8, 2021
- ALCATEL LUCENT
- Roger Scott Kempers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Crushable heat sink for electronic devices
- Patent number 11,032,944
- Issue date Jun 8, 2021
- Intel Corporation
- Paul Gwin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling apparatus, semiconductor module, vehicle, and manufacturing...
- Patent number 11,011,453
- Issue date May 18, 2021
- Fuji Electric Co., Ltd.
- Nobuhide Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 10,998,255
- Issue date May 4, 2021
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant Pin Fin heat sink with base integral pins
- Patent number 10,991,639
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Mark D. Schultz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN
- Publication number 20240404922
- Publication date Dec 5, 2024
- LUX SEMICONDUCTORS, INC.
- Chad B. MOORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...
- Publication number 20240395653
- Publication date Nov 28, 2024
- DENSO CORPORATION
- MASAKI AOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRC...
- Publication number 20240339375
- Publication date Oct 10, 2024
- STMicroelectronics International N.V.
- Didier CAMPOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312868
- Publication date Sep 19, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFAC...
- Publication number 20240304516
- Publication date Sep 12, 2024
- Kabushiki Kaisha Toshiba
- Toshihide UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device, Method for Manufacturing Same, and Powe...
- Publication number 20240274489
- Publication date Aug 15, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Haruna TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266245
- Publication date Aug 8, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Sijie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20240266191
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...
- Publication number 20240234237
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Nobuyoshi KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Heat Dissipation Structure and Method for Forming the...
- Publication number 20240145342
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method of Manufacturing the Same, an...
- Publication number 20240074122
- Publication date Feb 29, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Yasuyuki SANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
- Publication number 20240063087
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Liang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method and Equipment for Forming the Same
- Publication number 20230369162
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
- Publication number 20230299017
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230154882
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Ryotaro TSURUOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A POWER MODULE UNIT
- Publication number 20230131848
- Publication date Apr 27, 2023
- SIEMENS AKTIENGESELLSCHAFT
- DANIEL KAPPAUF
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230066652
- Publication date Mar 2, 2023
- NXP USA, Inc.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FORMING A SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20230062499
- Publication date Mar 2, 2023
- SILICON MOTION, INC.
- Yi-Hung CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230066154
- Publication date Mar 2, 2023
- Fuji Electric Co., Ltd.
- Kazuo ENOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC COOLING EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHO...
- Publication number 20230010115
- Publication date Jan 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS QUENCH FOR DIFFUSION BONDING
- Publication number 20220396857
- Publication date Dec 15, 2022
- Applied Materials, Inc.
- Joseph F. Behnke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...
- Publication number 20220367382
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CHIP
- Publication number 20220367209
- Publication date Nov 17, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Baoguan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...
- Publication number 20220359230
- Publication date Nov 10, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220352049
- Publication date Nov 3, 2022
- Mitsubishi Electric Corporation
- Hiroyuki YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20220254738
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...
- Publication number 20220084926
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Ian HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Base Plate for a Semiconductor Module Arrangement and Method for Pr...
- Publication number 20220005708
- Publication date Jan 6, 2022
- Marco Rasel
- H01 - BASIC ELECTRIC ELEMENTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cooling system and methods

Method forming a semiconductor package device

Metal substrates with structures formed therein and methods of maki...

Overmolded microelectronic packages containing knurled flanges and...

Package structure and method and equipment for forming the same

Method for packaging chip

Encapsulation warpage reduction for semiconductor die assemblies an...

Method for manufacturing a power module unit

Gas quench for diffusion bonding

Power semiconductor device and substrate with dimple region

Package structure and method and equipment for forming the same

Semiconductor device packaging warpage control

Semiconductor device package having warpage control and method of f...

Heat dissipation component and method for manufacturing same

Method for thinning solid-body layers provided with components

Thermally conductive structure for heat dissipation in semiconducto...

Power semiconductor apparatus and method for manufacturing the same

Semiconductor device, method for manufacturing the same, and power...

Substrate structures, methods for forming the same and semiconducto...

Semiconductor module, vehicle and manufacturing method

Die-attach method to compensate for thermal expansion

Power semiconductor device and manufacturing method for power semic...

Burst resistant thin wall heat sink

Folded sheet metal heat sink

Package structure and method and equipment for forming the same

Structure for a heat transfer interface and method of manufacturing...

Crushable heat sink for electronic devices

Cooling apparatus, semiconductor module, vehicle, and manufacturing...

Overmolded microelectronic packages containing knurled flanges and...

Compliant Pin Fin heat sink with base integral pins

Patents Applicationslast 30 patents

METHOD OF MAKING METAL SUBSTRATES WITH STRUCTURES FORMED THEREIN

HEAT DISSIPATION MEMBER, METHOD OF MANUFACTURING THE HEAT DISSIPATI...

HEAT SINK FASTENED ON THE SUBSTRATE OF A PACKAGE OF INTEGRATED CIRC...

SEMICONDUCTOR DEVICE

CERAMIC CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFAC...

Power Semiconductor Device, Method for Manufacturing Same, and Powe...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...

Package with Heat Dissipation Structure and Method for Forming the...

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

Power Semiconductor Device and Method of Manufacturing the Same, an...

THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME

Package Structure and Method and Equipment for Forming the Same

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING A POWER MODULE UNIT

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

METHOD FORMING A SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CYCLIC COOLING EMBEDDED PACKAGING SUBSTRATE AND MANUFACTURING METHO...

GAS QUENCH FOR DIFFUSION BONDING

SEMICONDUCTOR DEVICE PACKAGE HAVING WARPAGE CONTROL AND METHOD OF F...

METHOD FOR PACKAGING CHIP

ENCAPSULATION WARPAGE REDUCTION FOR SEMICONDUCTOR DIE ASSEMBLIES AN...

POWER SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

SUBSTRATE STRUCTURES, METHODS FOR FORMING THE SAME AND SEMICONDUCTO...

Base Plate for a Semiconductor Module Arrangement and Method for Pr...