Method of manufacturing interconnect substrate

Abstract

A method of manufacturing an interconnect substrate by electroless plating which causes a metal to be deposited without using a plating resist, the method including: (a) immersing a substrate in a catalyst solution including palladium, hydrogen peroxide, and hydrochloric acid to form a catalyst layer on the substrate; and (b) depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution to form a metal layer.

Description

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

FIG. 1 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 2 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 3 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 4 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 5 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 6 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 7 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 8 is a diagram showing a method of manufacturing an interconnect substrate according to one embodiment of the invention.

FIG. 9 shows an example of an electronic device to which an interconnect substrate according to one embodiment of the invention is applied.

Claims

1. A method of manufacturing an interconnect substrate by electroless plating which causes a metal to be deposited without using a plating resist, the method comprising: (a) immersing a substrate in a catalyst solution including palladium, hydrogen peroxide, and hydrochloric acid to form a catalyst layer on the substrate; and(b) depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution to form a metal layer.

2. The method of manufacturing an interconnect substrate as defined in claim 1, wherein the catalyst solution has a pH adjusted to 4.0 to 6.9.

3. The method of manufacturing an interconnect substrate as defined in claim 1, wherein the catalyst solution has a pH adjusted to 4.0 to 5.0.

4. The method of manufacturing an interconnect substrate as defined in claim 1, wherein the electroless plating solution has a pH adjusted to 4.1 to 4.4.

5. The method of manufacturing an interconnect substrate as defined in claim 4, wherein the electroless plating solution includes nickel.

6. A method of manufacturing an interconnect substrate by electroless plating which causes a metal to be deposited without using a plating resist, the method comprising: (a) immersing a substrate in a catalyst solution to form a catalyst layer on the substrate; and(b) depositing a metal on the catalyst layer by immersing the substrate in an electroless plating solution having a pH adjusted to 4.1 to 4.4 to form a metal layer.

7. The method of manufacturing an interconnect substrate as defined in claim 6, wherein the electroless plating solution includes nickel.

8. The method of manufacturing an interconnect substrate as defined in claim 1, further comprising: forming a resist layer on the substrate in a region other than a region of a desired interconnect pattern before the step (a);forming a surfactant layer including a surfactant on the substrate before the step (a); andremoving the resist layer to remove the surfactant layer and the catalyst layer in the region other than the region of the desired interconnect pattern after the step (a).

9. A catalyst solution for electroless plating comprising: a mixed aqueous solution including palladium, hydrogen peroxide, and hydrochloric acid.