Method of manufacturing light emitting diode package

Abstract

A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a side sectional view illustrating a conventional light emitting diode package;

FIG. 2( a) to 2(e) are sectional views illustrating the steps of manufacturing a light emitting diode package according to an embodiment of the present invention;

FIG. 3( a) to 3(c) are schematic perspective views illustrating various forms of rough patterns according to the present invention; and

FIG. 4 is a graph illustrating an effect of improved light extraction efficiency according to an embodiment of the present invention.

Claims

1. A method of manufacturing a light emitting diode package comprising: preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;injecting a liquid-state transparent resin in the recess of the package structure;applying a stamp with a micro rough pattern engraved thereon, on an upper surface of the liquid-state transparent resin before the liquid-state transparent resin is completely cured;curing the liquid-state transparent resin with the stamp applied thereon to form a resin encapsulant; andremoving the stamp from the resin encapsulant.

2. The method according to claim 1, wherein the step of applying a stamp is implemented after the injected liquid-state transparent resin is partially cured.

3. The method according to claim 1, wherein the step of injecting a liquid-state transparent resin comprises injecting the liquid-state transparent resin in such an amount that the upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.

4. The method according to claim 1, wherein the liquid-state transparent resin has phosphor dispersed therein to convert the wavelength.

5. The method according to claim 1, further comprising forming a phosphor film for converting the wavelength on a surface of the light emitting diode chip before forming a resin encapsulant.

6. The method according to claim 1, wherein the step of forming a resin encapsulant comprises a deaeration process to remove bubbles in the liquid-state transparent resin with the stamp applied on the liquid-state transparent resin.

7. The method according to claim 1, wherein the stamp comprises a planar structure with the micro rough pattern engraved on a surface thereof.

8. The method according to claim 1, wherein the micro rough pattern engraved on the stamp comprises a plurality of triangular prisms arranged in one direction.

9. The method according to claim 1, wherein the rough pattern engraved on the stamp comprises a plurality of quadrangular pyramids arranged in lines and rows.

10. The method according to claim 1, further comprising applying a release agent on a surface of the stamp that comes in contact with the transparent resin before applying the stamp.