Number | Date | Country | Kind |
---|---|---|---|
197 46 863 | Oct 1997 | DE |
This is a division of U.S. application Ser. No. 09/178,199, filed Oct. 23, 1998 now abandoned.
Number | Name | Date | Kind |
---|---|---|---|
5629564 | Nye, III et al. | May 1997 | A |
5877561 | Kim | Mar 1999 | A |
Number | Date | Country |
---|---|---|
31 28 187 | Feb 1983 | DE |
0 062 300 | Oct 1982 | EP |
0 493 051 | Jul 1992 | EP |
0 641 152 | Mar 1995 | EP |
61-002371 | Jan 1986 | JP |
02-154134 | Jun 1990 | JP |
04-63163 | May 1992 | JP |
09-293800 | Nov 1997 | JP |
Entry |
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US 5,814,937, 9/1998, Okazaki (withdrawn) |
“The Enhanced and Suppressed Electroless Plating of Copper by UV-Irradiation” (Ishikawa et al.), Japanese Journal of Applied Physics, vol. 27, No. 9, Sep. 1988, pp. 1764-1767. |
Derwent Abstract of German Published, Non-Prosecuted Application No. DE 31 28 187 A1 (Sieg et al.), dated Feb. 1983. |
Japanese Patent Abstract No. 61096778 (Toru), dated May 15, 1986. |
Japanese Patent Abstract No. 01283883 (Tadaaki), dated Nov. 15, 1989. |