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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1815Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical semiconductor element mounting package and optical semicond...
- Patent number 12,317,657
- Issue date May 27, 2025
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having plural stacked first chips sealed in a...
- Patent number 12,237,315
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takayuki Ide
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming same
- Patent number 12,222,545
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 12,199,066
- Issue date Jan 14, 2025
- Kioxia Corporation
- Gen Toyota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 12,191,163
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,132,024
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pre-reflowed solder
- Patent number 12,132,027
- Issue date Oct 29, 2024
- Texas Instruments Incorporated
- James Raymond Maliclic Baello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including inner conductive layer having region...
- Patent number 12,125,823
- Issue date Oct 22, 2024
- Denso Corporation
- Shingo Tsuchimochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,235
- Issue date Aug 20, 2024
- Rohm Co., Ltd.
- Masaaki Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package structures with recesses in molding comp...
- Patent number 12,057,432
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,533
- Issue date Jul 23, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi Takayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 12,046,480
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shou Zen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency modules
- Patent number 12,003,025
- Issue date Jun 4, 2024
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a light emitting device
- Patent number 11,984,545
- Issue date May 14, 2024
- SHENZHEN JUFEI OPTOELECTRONICS CO., LTD.
- Naoyuki Urasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,378
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,972,991
- Issue date Apr 30, 2024
- Mitsubishi Electric Corporation
- Hiroki Shiota
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
- Patent number 11,955,434
- Issue date Apr 9, 2024
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250233040
- Publication date Jul 17, 2025
- MEDIATEK INC.
- Sang-Mao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...
- Publication number 20250226304
- Publication date Jul 10, 2025
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...
- Publication number 20250226353
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Chin Yong Neo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20250219009
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Allen Marfil Descartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250218916
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Seungwan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250219001
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JongTae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210502
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210560
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Ji-Han KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH HEAT SPREADER LAYER AND METHOD FOR MANUFACTU...
- Publication number 20250210609
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUITS AND METHODS OF FORMING
- Publication number 20250210611
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manafacturing Co., Ltd.
- Chung-Hui Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210563
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250210476
- Publication date Jun 26, 2025
- FUJI ELECTRIC CO., LTD.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201644
- Publication date Jun 19, 2025
- Siliconware Precision Industries Co., Ltd.
- Chun-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192071
- Publication date Jun 12, 2025
- Samsung Electronics Co.,Ltd.
- Chengjing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20250191983
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- IN-JAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192019
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Byung Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183146
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250183170
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kyungsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...
- Publication number 20250174575
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Hung-Hsiang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174505
- Publication date May 29, 2025
- Shinko Electric Industries Co., Ltd.
- Kei MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174556
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jitaek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174540
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...
- Publication number 20250174565
- Publication date May 29, 2025
- SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD.
- Wei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167093
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- DOHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD
- Publication number 20250167087
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical semiconductor element mounting package and optical semicond...

Molded product for semiconductor strip and method of manufacturing...

Semiconductor package including heat dissipation structure

Semiconductor device and method for manufacturing the same

Semiconductor device having plural stacked first chips sealed in a...

Semiconductor module and power conversion apparatus

Package and method of forming same

Package-on-package assembly with wire bond vias

Semiconductor device and method for producing the same

Packaged semiconductor devices and methods of packaging semiconduct...

Semiconductor package and method of manufacturing the same

Semiconductor device assembly with pre-reflowed solder

Semiconductor device including inner conductive layer having region...

Semiconductor device

Semiconductor device

Integrated fan-out package structures with recesses in molding comp...

Chip package structure with multiple gap-filling layers and fabrica...

Package structure and method of forming the same

Semiconductor device

Manufacturing method of a semiconductor device

Semiconductor device

Semiconductor package

Package structure and method for forming the same

Selectively shielded radio frequency modules

Fingerprint sensor and manufacturing method thereof

Method of manufacturing a light emitting device

Semiconductor package structure and method for forming the same

Semiconductor device

Ultra small molded module integrated with die by module-on-wafer as...

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS AND METHOD OF...

SEMICONDUCTOR PACKAGE SUITABLE FOR HIGH VOLTAGE APPLICATIONS AND ME...

HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE WITH HEAT SPREADER LAYER AND METHOD FOR MANUFACTU...

THREE-DIMENSIONAL INTEGRATED CIRCUITS AND METHODS OF FORMING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

EMBEDDED THREE-DIMENSIONAL FAN-OUT PACKAGE STRUCTURE AND PREPARATIO...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH SUBSTRATE PAD