Claims
- 1. An article comprising a copper or copper alloy substrate, having a surface structure with open interconnected channel network, wherein the interconnected channels include passages having a diameter from about 1 to about 20 microns.
- 2. The article of claim 1 wherein the interconnected channels have a depth up to about 75 microns.
- 3. The article of claim 1 further comprising a metal oxide or hydroxide coating formed on the surface of the substrate.
- 4. The article of claim 3 wherein the metal of the coating is selected from copper, bismuth, gallium, germanium, gold, indium, lead, palladium, silver, tin and alloys of said metals.
- 5. The article of claim 3 further comprising a silane coating on the metal oxide or hydroxide layer.
- 6. The article of claim 1 further comprising a silane coating on the surface of the copper or copper alloy substrate.
- 7. The article of claim 1 further comprising one or more of an adhesive, polytetrafluoroethylene, natural or synthetic elastomer, or a printed circuit board prepreg bonded to the copper or copper alloy substrate.
- 8. A printed circuit board prepared with the microporous article of claim 1.
- 9. An article comprising a copper or copper alloy substrate, having a surface structure with a non-dendritic open interconnected channel network, wherein the interconnected channels include passages having a diameter from about 1 to about 20 microns.
- 10. The article of claim 9, wherein the passages penetrate the surface structure of the substrate.
- 11. The article of claim 9, wherein the passages have an average diameter less than about 15 microns.
- 12. The article of claim 9, wherein about 50% to about 100% of the passages have an average diameter from about 1 micron to about 8 microns.
- 13. The article of claim 9, wherein the substrate has from about two to about nine layers.
- 14. The article of claim 9, wherein the surface structure forms an open cellular network.
- 15. The article of claim 9 further comprising a metal oxide or hydroxide coating formed on the surface of the substrate.
- 16. The article of claim 15 wherein the metal of the coating is selected from copper, bismuth, gallium, germanium, gold, indium, lead, palladium, silver, tin and alloys of said metals.
- 17. The article of claim 15 further comprising a silane coating on the metal oxide or hydroxide layer.
- 18. The article of claim 9 further comprising a silane coating on the surface of the copper or copper alloy substrate.
- 19. The article of claim 9 further comprising one or more of an adhesive, polytetrafluoroethylene, natural or synthetic elastomer, or a printed circuit board prepreg bonded to the copper or copper alloy substrate.
- 20. A printed circuit board prepared with the microporous article of claim 9.
Parent Case Info
This application is a divisional of application Ser. No. 08/994,184, filed Dec. 19, 1977, now U.S. Pat. No. 6,284,309.
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