Claims
- 1. A method for protecting a conductive foil laminate substrate sheet such as a conductive foil suitable for use in the manufacture of printed circuit boards, comprising the steps of:
- (A) providing a release layer coating on one side of a protective film;
- (B) applying an electron beam curable adhesive coating to the other side of the protective film;
- (C) curing said adhesive coating; and
- (D) laminating said protective film to a conductive foil laminate substrate sheet;
- (E) subsequently, removing said protective release layer from said conductive foil laminate substrate sheet which provides the conductive foil laminate substrate sheet with a substantially contaminate free surface.
- 2. The method of claim 1 wherein said release coating is provided by applying an electron beam curable release coating on one side of said film and curing said release coating.
- 3. The method of claim 1 wherein said release coating is provided by vacuum depositing a coating of aluminum on one side of said film.
- 4. The method of claim 1 where said substrate sheet is a copper foil laminate.
- 5. The method of claim 1 wherein said adhesive coating comprises a saturated copolyester with terminal acrylic double bonds.
- 6. The method of claim 5 wherein said film is a polyester film.
- 7. The method of claim 5 wherein said laminating step (D) is carried out under heat and pressure and said substrate sheet comprises a dielectric.
- 8. The method of claim 1 wherein said substrate sheet comprises a polycarbonate.
- 9. The method of claim 1 wherein said substrate sheet comprises an acrylic.
- 10. A method for protecting a substrate sheet, comprising the steps of:
- (A) providing a release layer on one side of a protective film;
- (B) applying an electron beam curable pressure-sensitive adhesive coating to the other side of the protective film;
- (C) curing said adhesive coating; and
- (D) laminating said protective film to a substrate sheet with the cured pressure-sensitive adhesive coating contacting the sheet;
- (E) subsequently, removing said protective film-release layer from said substrate sheet which provides the substrate sheet with a substantially contaminate free surface.
Parent Case Info
This application is a divisional of U.S. patent application Ser. No. 08/548,492, filed Oct. 26, 1995, now abandoned, which is a continuation-in-part of U.S. patent application Ser. No. 08/278,871, filed Jul. 8, 1994, now abandoned.
US Referenced Citations (5)
Divisions (1)
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Number |
Date |
Country |
Parent |
548492 |
Oct 1995 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
278871 |
Jul 1994 |
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