Claims
- 1. A method of manufacturing an electronic component provided with a concave portion, said method comprising the steps of:
- preparing a laminate comprising a plurality of ceramic sheets, specific ones of said ceramic sheets having burnaway film formed thereon, said burnaway film being made of a material capable of being burned away by firing, said burnaway films being provided in positions corresponding to a position of said concave portion;
- firing said laminate to burn out said burnaway films, thereby obtaining a sintered body being formed with a plurality of cavities and a plurality of thin layers being formed between said plurality of cavities; and
- crushing said thin layers of said sintered body, thereby forming said concave portion.
- 2. A method of manufacturing an electronic component in accordance with claim 1, wherein said burnaway films contain carbon.
- 3. A method of manufacturing an electronic component in accordance with claim 1, wherein said burnaway films contain resin.
- 4. A method of manufacturing an electronic component in accordance with claim 1, wherein said crushing step includes at least one of barrel polishing, blasting, application of a water jet and application of ultrasonic waves.
Priority Claims (3)
Number |
Date |
Country |
Kind |
4-096681 |
Apr 1992 |
JPX |
|
4-096682 |
Apr 1992 |
JPX |
|
4-156735 |
Jun 1992 |
JPX |
|
Parent Case Info
This is a division of application Ser. No. 08/047,716, filed Apr. 14, 1993.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
4806295 |
Trickett et al. |
Feb 1989 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
47716 |
Apr 1993 |
|