Claims
- 1. A method of producing a mechanical microstructure comprising a deformable first layer overhanging a second layer and further comprising a cavity set back from an external face of said deformable first layer, wherein an abutment stud projection into said cavity, the method comprising connecting a wire to a portion of an internal face of said deformable first layer, wherein said portion is opposite a bottom area of said cavity into which said abutment stud projects, and wherein said abutment stud remains at a distance from said deformable first layer.
- 2. A microstructure production method according to claim 1, wherein said microstructure further comprises a support layer for said first layer and wherein said method further comprises:
forming a well in said support opening opposite said portion of the internal face of the first layer, wherein said wire is connected to said internal face of the first layer through said well.
- 3. A microstructure production method according to claim 2 further comprising, after said step of forming a well, forming a localized contact layer on the bottom of said well, wherein connection between the connecting wire and said first layer is made by means of said contact layer.
- 4. A mechanical microstructure comprising a deformable first layer overhanging a second layer and defining a cavity set back from an external face of said deformable first layer, wherein an abutment stud projection into said cavity, wherein said deformable first layer includes a portion to which is connected a wire, wherein said portion is opposite a bottom area of said cavity into which said abutment stud projects, and wherein said abutment stud remains at a distance from said deformable first layer.
- 5. A mechanical microstructure according to claim 4, further comprising a support layer for said deformable first layer, wherein said support layer includes a well exposing an internal face of said first deformable layer at said portion of said first deformable layer.
- 6. A mechanical microstructure according to claim 5, further comprising a localized contact layer at a bottom of said well, wherein a connection between said wire and said deformable first layer is made by means of said contact layer.
- 7. A microstructure according to either claim 5, further comprising an insulative layer between said deformable first layer and said support layer, wherein said insulative layer includes an undercut under edges of said well.
- 8. A microstructure according to either claim 6, further comprising an insulative layer between said deformable first layer and said support layer, wherein said insulative layer includes an undercut under edges of said well.
Priority Claims (1)
Number |
Date |
Country |
Kind |
0117014 |
Dec 2001 |
FR |
|
Parent Case Info
[0001] This application claims priority under 35 U.S.C. §119 to French patent application No. 0117014, filed Dec. 28, 2001.