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B81C1/00896

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00896Temporary protection during separation into individual elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method with mechanical dicing process for producing MEMS components
- Patent number 12,060,266
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS tab removal process
- Patent number 11,905,170
- Issue date Feb 20, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 11,807,522
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective member forming apparatus
- Patent number 11,794,384
- Issue date Oct 24, 2023
- Disco Corporation
- Yoshinori Kakinuma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator, optical scanning device, and manufacturing methods
- Patent number 11,635,615
- Issue date Apr 25, 2023
- Mitsumi Electric Co., Ltd.
- Kensuke Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Techniques for fabricating waveguide facets and die separation
- Patent number 11,402,579
- Issue date Aug 2, 2022
- Medlumics S.L.
- José Luis Rubio Guivernau
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 11,235,971
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 10,710,875
- Issue date Jul 14, 2020
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Singulation of wafer level packaging
- Patent number 10,611,632
- Issue date Apr 7, 2020
- Texas Instruments Incorporated
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of cross talk in WLCSP's through laser drilled technique
- Patent number 10,607,912
- Issue date Mar 31, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of cross talk in WLCSP's through laser drilled technique
- Patent number 10,396,004
- Issue date Aug 27, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device
- Patent number 10,281,442
- Issue date May 7, 2019
- Sensirion AG
- Werner Hunziker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-layer single chip MEMS WLCSP fabrication
- Patent number 10,106,399
- Issue date Oct 23, 2018
- MCube, Inc.
- Chien Chen Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and a method of producing the same
- Patent number 9,981,843
- Issue date May 29, 2018
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transfer method, manufacturing method, device and electronic appara...
- Patent number 9,908,775
- Issue date Mar 6, 2018
- GOERTEK INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective sheeting for use in processing a semiconductor-sized waf...
- Patent number 9,905,453
- Issue date Feb 27, 2018
- Disco Corporation
- Karl Heinz Priewasser
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for wafer-level chip scale package testing
- Patent number 9,676,619
- Issue date Jun 13, 2017
- MEMSIC SEMICONDUCTOR (WUXI) CO., LTD.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming chip package
- Patent number 9,611,143
- Issue date Apr 4, 2017
- Xintec Inc.
- Yen-Shih Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for shielding MEMS structures during front side wafer dicing
- Patent number 9,458,012
- Issue date Oct 4, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor protective coating
- Patent number 9,425,382
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Dubravka Bilic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Shielding MEMS structures during wafer dicing
- Patent number 9,346,671
- Issue date May 24, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device h...
- Patent number 9,199,836
- Issue date Dec 1, 2015
- Renesas Electronics Corporation
- Koichi Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for embedding conducting material and devices resulting fro...
- Patent number 9,061,897
- Issue date Jun 23, 2015
- IMEC
- Alain Phommahaxay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of formation thereof
- Patent number 9,034,677
- Issue date May 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective thin films for use during fabrication of semiconductors,...
- Patent number 8,987,029
- Issue date Mar 24, 2015
- Applied Microstructures, Inc.
- Jeffrey D. Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a semiconductor integrated circuit device h...
- Patent number 8,835,207
- Issue date Sep 16, 2014
- Renesas Electronics Corporation
- Koichi Arai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micro-electro-mechanical device, in part...
- Patent number 8,679,887
- Issue date Mar 25, 2014
- STMicroelectronics S.r.l.
- Simone Sassolini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS component, method for producing a MEMS component, and method f...
- Patent number 8,674,464
- Issue date Mar 18, 2014
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a semiconductor device having recessed bondin...
- Patent number 8,580,594
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a plurality of chips and a chip produced accor...
- Patent number 8,405,210
- Issue date Mar 26, 2013
- Robert Bosch GmbH
- Torsten Kramer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method of Manufacturing and Passivating a Die
- Publication number 20220359258
- Publication date Nov 10, 2022
- TDK Electronics AG
- Mehrdad Shayganpoor
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS TAB REMOVAL PROCESS
- Publication number 20220185662
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE MEMBER FORMING APPARATUS
- Publication number 20220024085
- Publication date Jan 27, 2022
- Disco Corporation
- Yoshinori KAKINUMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS
- Publication number 20210253421
- Publication date Aug 19, 2021
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULANT BARRIER
- Publication number 20200339416
- Publication date Oct 29, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILICONE-BASED ADHESIVE SHEET, MULTILAYER STRUCTURE INCLUDING SAME,...
- Publication number 20200339848
- Publication date Oct 29, 2020
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGULATION OF WAFER LEVEL PACKAGING
- Publication number 20200231434
- Publication date Jul 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Clayton Lee Stevenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique
- Publication number 20190355641
- Publication date Nov 21, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique
- Publication number 20190229028
- Publication date Jul 25, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR, OPTICAL SCANNING DEVICE, AND MANUFACTURING METHODS
- Publication number 20190196181
- Publication date Jun 27, 2019
- MITSUMI ELECTRIC CO., LTD.
- Kensuke YAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULANT BARRIER
- Publication number 20190144270
- Publication date May 16, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR ARRAYS
- Publication number 20180133679
- Publication date May 17, 2018
- Alastair J. MALCOLM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE SHEETING FOR USE IN PROCESSING A SEMICONDUCTOR-SIZED WAF...
- Publication number 20180005862
- Publication date Jan 4, 2018
- Karl Heinz PRIEWASSER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARA...
- Publication number 20170260045
- Publication date Sep 14, 2017
- GOERTEK INC.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Wafer-Level Chip Scale Package Testing
- Publication number 20170113929
- Publication date Apr 27, 2017
- Memsic Semiconductor (Wuxi) Co., Ltd.
- Yang Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20160347609
- Publication date Dec 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip Package and a Method of Producing the Same
- Publication number 20160311679
- Publication date Oct 27, 2016
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE
- Publication number 20150284244
- Publication date Oct 8, 2015
- XINTEC INC.
- Yen-Shih HO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING
- Publication number 20150232332
- Publication date Aug 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Simultaneous Structuring and Chip Singulation
- Publication number 20150217997
- Publication date Aug 6, 2015
- INFINEON TECHNOLOGIES AG
- Thomas Grille
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SHIELDING MEMS STRUCTURES DURING WAFER DICING
- Publication number 20150217998
- Publication date Aug 6, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Alan J. Magnus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER AND METHOD OF SINGU...
- Publication number 20150054095
- Publication date Feb 26, 2015
- Samsung Electronics Co., Ltd.
- Byung-gil JEONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of Manufacturing A Semiconductor Integrated Circuit Device H...
- Publication number 20140339659
- Publication date Nov 20, 2014
- RENESAS ELECTRONICS CORPORATION
- Koichi ARAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Method of Formation Thereof
- Publication number 20140248730
- Publication date Sep 4, 2014
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE H...
- Publication number 20130193536
- Publication date Aug 1, 2013
- RENESAS ELECTRONICS CORPORATION
- Koichi ARAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD AND SYSTEM FOR FABRICATING THE SAME
- Publication number 20130193571
- Publication date Aug 1, 2013
- Xintec Inc.
- Yu-Lung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND METHOD OF FORMATION THEREOF
- Publication number 20130037891
- Publication date Feb 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE, IN PART...
- Publication number 20120208343
- Publication date Aug 16, 2012
- STMicroelectronics S.r.l.
- Simone Sassolini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods for Embedding Conducting Material and Devices Resulting fro...
- Publication number 20120126391
- Publication date May 24, 2012
- IMEC
- Alain Phommahaxay
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROTECTIVE THIN FILMS FOR USE DURING FABRICATION OF SEMICONDUCTORS,...
- Publication number 20120045884
- Publication date Feb 23, 2012
- Jeffrey Chinn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Temporary protection during separation into individual elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method with mechanical dicing process for producing MEMS components

MEMS tab removal process

Encapsulant barrier

Protective member forming apparatus

Actuator, optical scanning device, and manufacturing methods

Techniques for fabricating waveguide facets and die separation

Singulation of wafer level packaging

Encapsulant barrier

Singulation of wafer level packaging

Reduction of cross talk in WLCSP's through laser drilled technique

Reduction of cross talk in WLCSP's through laser drilled technique

Sensor device

Multi-layer single chip MEMS WLCSP fabrication

Chip package and a method of producing the same

Transfer method, manufacturing method, device and electronic appara...

Protective sheeting for use in processing a semiconductor-sized waf...

Method for wafer-level chip scale package testing

Method for forming chip package

Method for shielding MEMS structures during front side wafer dicing

Sensor protective coating

Shielding MEMS structures during wafer dicing

Method of manufacturing a semiconductor integrated circuit device h...

Methods for embedding conducting material and devices resulting fro...

MEMS device and method of formation thereof

Protective thin films for use during fabrication of semiconductors,...

Method of manufacturing a semiconductor integrated circuit device h...

Method for manufacturing a micro-electro-mechanical device, in part...

MEMS component, method for producing a MEMS component, and method f...

Method of fabricating a semiconductor device having recessed bondin...

Method for producing a plurality of chips and a chip produced accor...

Patents Applicationslast 30 patents

Method of Manufacturing and Passivating a Die

MEMS TAB REMOVAL PROCESS

PROTECTIVE MEMBER FORMING APPARATUS

METHOD WITH MECHANICAL DICING PROCESS FOR PRODUCING MEMS COMPONENTS

ENCAPSULANT BARRIER

SILICONE-BASED ADHESIVE SHEET, MULTILAYER STRUCTURE INCLUDING SAME,...

SINGULATION OF WAFER LEVEL PACKAGING

Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique

Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique

ACTUATOR, OPTICAL SCANNING DEVICE, AND MANUFACTURING METHODS

ENCAPSULANT BARRIER

METHODS OF MANUFACTURING SEMICONDUCTOR ARRAYS

PROTECTIVE SHEETING FOR USE IN PROCESSING A SEMICONDUCTOR-SIZED WAF...

TRANSFER METHOD, MANUFACTURING METHOD, DEVICE AND ELECTRONIC APPARA...

Method For Wafer-Level Chip Scale Package Testing

MEMS Packages and Methods of Manufacture Thereof

Chip Package and a Method of Producing the Same

METHOD FOR FORMING CHIP PACKAGE

METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING

Method for Simultaneous Structuring and Chip Singulation

SHIELDING MEMS STRUCTURES DURING WAFER DICING

CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCER AND METHOD OF SINGU...

Method of Manufacturing A Semiconductor Integrated Circuit Device H...

MEMS Device and Method of Formation Thereof

METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE H...

SEMICONDUCTOR PACKAGE AND METHOD AND SYSTEM FOR FABRICATING THE SAME

MEMS DEVICE AND METHOD OF FORMATION THEREOF

METHOD FOR MANUFACTURING A MICRO-ELECTRO-MECHANICAL DEVICE, IN PART...

Methods for Embedding Conducting Material and Devices Resulting fro...

PROTECTIVE THIN FILMS FOR USE DURING FABRICATION OF SEMICONDUCTORS,...