IBM Technical Disclosure Bulletin vol. 12, No. 4, Sep. 1969, p. 548, "Tinning Closely Spaced Leads". |
IBM Technical Disclosure Bulletin vol. 18, No. 5, Oct. 1975, pp. 1384-1385, "Cleaning of Solder Pads Prior to a Rework Operation". |
IBM Technical Disclosure Bulletin vol. 21, No. 11, Apr. 1979, p. 4482, "Desoldering Unit". |
IBM Technical Disclosure Bulletin vol. 24. No. 7A, Dec. 1981, p. 3481, "Use of a Tinned Copper Slug for Module Reworking". |
IBM Technical Disclosure Bulletin vol. 25, No. 5, Oct. 1982, p. 2285, "Method for Manufacturing Porous Metal Devices". |
IBM Technical Disclosure Bulletin vol. 27, No. 10B, Mar. 1985, pp. 6344-6345, "Chip Rework on Multilayer Ceramic Recess". |
IBM Technical Disclosure Bulletin vol. 34, No. 3, Aug. 1991, pp. 52-53, "Small Copper Block Application for Solder Bump Joined Chip Replacement". |
IBM Technical Disclosure Bulletin vol. 37, No. 5, May 1994, p. 35, "Copper Blocks for Chip Site Dress". |