The present disclosure generally relates to methods and apparatus for heating and temperature monitoring. More particularly, the present disclosure relates to methods and apparatus for heating and temperature monitoring in equipment used to fabricate semiconductor devices.
Various components of a system used for fabricating semiconductor devices may need constant temperature regulation. A heating source may be applied to the component in cases where a temperature above room temperature is desired. Alternatively, a cooling source may be applied to the component in cases where a temperature below room temperature is desired. In many applications, heater jackets are used as the heating source, and the heater jackets wrap around the component. The heater jackets, however, are bulky and may not provide sufficient heating or thermal uniformity to the component due to inconsistent contact with the components.
The system may also include temperature sensors to monitor the actual temperature of the heated or cooled component. In many cases, the information from the temperature sensor is used to control the operation of the heating source or the cooling source to regulate the temperature of the component. However, conventional temperature sensors may suffer from contact mismatch or misplacement, which may result in inaccurate temperature readings and, thus, undesired operation of the heating or cooling source and poor temperature regulation of the component.
An apparatus may provide a component, such as a showerhead, a pipe, a valve manifold, or a vessel, having a printed heater affixed to an outer surface of the component. In addition, a printed temperature sensor may be affixed to the outer surface of the component. The apparatus may further provide a controller to control the power to the printed heater according to data output from the printed temperature sensor.
These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to the drawings of certain embodiments, which are intended to illustrate and not to limit the invention.
It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the relative size of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of illustrated embodiments of the present disclosure.
Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an example of semiconductor processing system in accordance with the present disclosure is shown in
The description of exemplary embodiments provided below is merely exemplary and is intended for purposes of illustration only; the following description is not intended to limit the scope of the disclosure or the claims. Moreover, recitation of multiple embodiments having stated features is not intended to exclude other embodiments having additional features or other embodiments incorporating different combinations of stated features.
The present disclosure generally relates to a printed heater affixed to an outer surface of a component used in a semiconductor processing system. In addition, some aspects of the present technology are generally related to a printed temperature sensor affixed to an outer component used in a semiconductor processing system.
Referring to
In various embodiments, and referring to
In various embodiments, the printed heater 200 may be affixed on an outer surface of the component 225. For example, the printed heater 200 may be printed directly on the outer surface of the component 225. Alternatively, the printed heater 200 may be attached to the outer surface of the component 225 with an adhesive layer 300 arranged directly between the component and the printed heater 200. In various embodiments, the printed heater 200 may be a low-profile heater having a total thickness T in the range of 0.1 mm to approximately 10 millimeters. The printed heater 200 may have a width of 1 to 10 millimeters, or any suitable dimensions. The length and width of the printed heater 200 may be any suitable dimension and may be selected according to the application site.
In various embodiments, the second dielectric layer 220 may comprise any suitable insulating material and/or non-conductive material, such as a plastic. In some embodiments, the second dielectric layer 220 may be formed directly on an outer surface of the component 225 using any suitable method. Alternatively, the second dielectric layer 220 may be adhered to the outer surface of the component 225 with the adhesive layer 300. The second dielectric layer 220 may have a thickness in the range of 0.1 mm to approximately 5 millimeters.
In various embodiments, the conductive layer 215 may comprise any suitable conducting material, such as a conducting metal (e.g., copper). In various embodiments, the conductive layer 215 may overlie the second dielectric layer 220. Alternatively, the conductive layer 215 may be deposited directly on the outer surface of the component 225. Alternatively, the conductive layer 215 may be adhered to the outer surface of the component 225 with the adhesive layer 300. The conductive layer 215 may have any suitable pattern, such as a serpentine pattern, a comb-shaped pattern, a spiral pattern, and the like. The conductive layer 215 may have a thickness in the range of 0.1 mm to approximately 5 millimeters. In various embodiments, the conductive layer 220 may be electrically connected to the solder pad 205.
In various embodiments, the first dielectric layer 210 comprise an insulating material and/or non-conductive material, such as a plastic and may overlie the conducting layer 215. The first dielectric layer 210 may have a thickness in the range of 0.1 mm to approximately 5 millimeters.
In various embodiments, the printed heater 200 may operate according to a control signal.
In various embodiments, the temperature regulation system may further comprise a temperature sensor 600, such as a printed thermocouple, configured to detect temperature and generate an output sensor signal Vout corresponding to the detected temperature. In various embodiments, the temperature sensor 600 may be affixed on an outer surface of the component 225. For example, the temperature sensor 600 may be printed directly on the outer surface of the component 225. Alternatively, the temperature sensor 600 may be attached to the outer surface of the component 225 with an adhesive layer 300 arranged directly between the component and the temperature sensor 600. In various embodiments, the temperature sensor 600 may be a low-profile sensor having a thickness in the range of 0.1 millimeters to 10 millimeters.
In various embodiments, the temperature sensor 600 may comprise a first leg formed from a first material, such as nickel, chromium, aluminum or a combination thereof, and a second leg formed from a second material, such as nickel, chromium, aluminum, or a combination thereof. The first material may be different from the second material. For example, the first material may be Ni2OCr while the second material may be Ni5Al.
In addition, the temperature sensor 600 may be embedded within or covered with a thermal coating (not shown). The thermal coating may comprise one or more layers of any suitable material, such as yttria stabilized zirconia.
In various embodiments, the system 100 may further comprise a processor 610 or other suitable control system configured to receive the sensor signal Vout. The processor 610 may respond to the sensor signal Vout by generating a control signal to increase/decrease the temperature of the heating source in order to heat the component 225 to a desired temperature. In various embodiments, the processor 610 may receive and respond to the sensor signal Vout to control the temperature of the printed heater 200. In addition or alternatively, the processor 610 may receive and respond to the sensor signal Vout to control the temperature of a different heating source, such as a heater jacket 605.
In an exemplary embodiment, and referring to
The first and second printed heaters 200(A), 200(B) may be connected to and controlled by the processor 610 (
Similarly, a third printed heater 200(C) may be affixed or adhered to the pipe 110 that connects to the vessel 105. In the present case, the printed heater 200(C) may wrap around the outer surface of the pipe 110. The third printed heater 200(C) may be connected to and controlled by the processor 610 (
In an exemplary embodiment, and referring to
In an exemplary embodiment, and referring to
In addition, the temperature sensor 600 may be located on the outer surface of the valve assembly that is adjacent to the inlet/outlet pipe 700. The inlet/outlet pipe 700 may be attached to or continuous with the pipe 110.
In various embodiments, the valve assembly 115 may be configured to open and close according to an electrical signal or by a mechanical mechanism. For example, the valve assembly 115 may comprise a pneumatically-controlled valve, a solenoid-controlled valve, or any suitable valve control style. In addition, the valve assembly 115 may comprise a diaphragm valve, plug valve, needle valve, or the like. The particular valve type may be selected according to the particular application and/or system. For example, a particular valve may be more suitable for a particular application based on the valve specifications, such as flow rate, temperature rating, pressure rating, and the like.
In an exemplary embodiment, and referring to
In the present embodiment, the seventh printed heater 200(G) may be applied to small features and/or spaces with a tight clearance. For example, the seventh printed heater 200(G) may be continuous across a region comprising a feature having a height 815 and a clearance space 820 between two features. In other embodiments, the printed heater 200 may be continuous across a region comprising a feature having a height 815 and/or a clearance space 820.
In an exemplary embodiment, and referring to
In the present case, the temperature sensor 600(C) and/or the printed heater 200 may be affixed or adhered to the outward facing surface outer surface 915 and the sidewall surface 920 of the showerhead 130. The printed heater 200 may be a single, continuous element, such that the entirety of the printed heater 200 heats at the same degree.
Alternatively, a number of printed heaters 200 may be affixed or adhered to the outward facing surface 915 and/or the sidewall surface 920, wherein each printed heater 200 is independently-controlled relative to the other printed heaters on the showerhead 130. In such a case, one printed heater 200(I) may heat to a first temperature while another printed heater 200(J) may heat to a second temperature that is different from the first temperature. Controlling the temperature of each printed heater independently may provide a more uniform thermal pattern of the showerhead 130, and thus a more uniform chemical deposition on the substrate 910. In the present embodiment, the printed heaters 200(I), 200(J) may be configured to generate a temperature in the range of 90 to 250 degrees Celsius.
In some embodiments, information from the temperature sensor 600(C) may be used to control an adjacent printed heater, such as printed heater 200(I). Similarly, a different temperature sensor (not shown) may be used to control the printed heater 200(J).
In operation, and referring to
In response to the sensor signal Vout, the processor 610 may generate one or more output control signals, such as a first control signal S1 and a second control signal S2, and transmit the control signal to one or more printed heaters 200 and/or other suitable heating sources, such as a heater jacket 605 and the like. For example, in some cases, each printed heater 200 may be independently controlled relative to other printed heaters 200 in the system 100. In the present case, each printed heater 200 may be controlled according to a temperature sensor 600 that corresponds to the respective printed heater and/or is physically adjacent to the respective printed heater. For example, the printed heater 200(F) may be controlled by the second temperature sensor 600(B), while the fourth and fifth printed heaters 200(D), 200(E) may be controlled by a sensor signal from a different printed temperature sensor (not shown). In other words, in this case, the control signals S1 and S2 would have different values.
In other cases, two or more printed heaters 200 may be controlled according to the same control signal and a signal sensor signal Vout. For example, the fourth and fifth printed heaters 200(D), 200(E) may be controlled by a sensor signal from a same (shared) temperature sensor 600. In other words, in this case, the control signals S1 and S2 would have the same value.
Although this disclosure has been provided in the context of certain embodiments and examples, it will be understood by those skilled in the art that the disclosure extends beyond the specifically described embodiments to other alternative embodiments and/or uses of the embodiments and obvious modifications and equivalents thereof. In addition, while several variations of the embodiments of the disclosure have been shown and described in detail, other modifications, which are within the scope of this disclosure, will be readily apparent to those of skill in the art based upon this disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with, or substituted for, one another in order to form varying modes of the embodiments of the disclosure. Thus, it is intended that the scope of the disclosure should not be limited by the particular embodiments described above.
This application is a nonprovisional of, and claims priority to and the benefit of, U.S. Provisional Patent Application No. 63/295,487, filed Dec. 30, 2021 and entitled “METHODS AND APPARATUS FOR HEATING AND TEMPERATURE MONITORING,” which is hereby incorporated by reference herein.
Number | Date | Country | |
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63295487 | Dec 2021 | US |