Claims
- 1. A method of preparing a cross-linked polymer composition for use in a printed circuit board composing the steps of:forming an admixture having not less than 50% by weight of a polymer selected from the group consisting of lignin, crop oils, wood resins, tannins, polysaccharide resins, and combinations thereof; an epoxy resin cross-linking agent selected from the group consisting of diglycidyl ether benzylamine, epoxy novolacs epoxy cresol novolacs; an initiator selected from the group consisting of benyldimethylamine tetamethylbutane diamine, 2-methyl imidazole, caffeine, guanine and folic acid; adding energy selected from the group consisting of heat and electroergetic radiation to cause cross linking.
- 2. The method of preparing the cross-linked polymer composition for use in a printed circuit board as defined in claim 1 wherein said composition also contains compounds comprising the reaction products of amines or amides and formaldehydes and selected from the group selected of amino aldehydes, urea-formaldehyde, melamine formaldehyde, glycouril-formaldehyde, benoguanamine-formaldehyde polymers.
- 3. The method of preparing the cross-linked polymer composition for use in a printed circuit board as defined in claim 2 wherein said composition contains additives selected from the group consisting of particles, rods, fibers and cloths.
- 4. The method of preparing the cross-linked polymer composition for use in a printed circuit board as defined in claim 2 wherein said admixture has between about 50% and 60% by weight of said polymer.
- 5. The method of preparing the cross-linked polymer composition for use in a printed circuit board as defined in claim 4 wherein said composition contains conventional glass reinforcements, organic fiber reinforcements, cellulose fiber reinforcements, jute fiber reinforcements, kenaf fiber reinforcements, ramie fiber reinforcements, flax reinforcements.
CROSS-REFERENCES TO RELATED APPLICATIONS
This is a continuation of application Ser. No. 08/529,849, filed Sep. 18, 1995.
U.S. application Ser. No. 08/528,889, entitled Cross-Linked Biobased Materials and Uses Thereof, filed on the same day herewith to Afzali et al., the teaching of which is incorporated herein by reference.
U.S. application Ser. No. 08/529,932, entitled Structures Fabricated with Cross-Linked Biobased Materials, filed on the same day herewith to Afzali et al., the teaching of which is incorporated herein by reference.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2 281 709 |
Mar 1995 |
GB |
Non-Patent Literature Citations (1)
Entry |
“Bio-Based Resins for the Manufacture of Printed Wiring Boards”, L.L. Kosbar and J. Gelorme, Annu. Tech. Conf. Soc. Plast. Eng. (54th), vol. 2, May 1996, pp. 1378-1381. |
Continuations (1)
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Number |
Date |
Country |
Parent |
08/529849 |
Sep 1995 |
US |
Child |
08/770212 |
|
US |