This invention relates to contact printing of micron and submicron patterns, and in particular to patterns formed by the transfer of ink. The invention particularly relates to a MEMS device configured for providing such contact printing.
Microcontact printing (U.S. Pat. No. 5,512,131; Kumar and Whitesides 1993) has allowed many new possibilities for patterning at the sub-micron scale. The starting point is a stamp, which is normally patterned non-photolithographically to achieve suitable resolution (Xia et al. 1996). The stamp material is often an elastomer with a low interfacial free energy such as polydimethylsiloxane (PDMS; Young's modulus ≈1 MPa) (Bender et al. 2004); however, the PDMS may be deposited on a rigid backing to improve pattern transfer (Odom et al. 2002). The stamp is then coated in an ink, often an alkanethiol consisting of an alkane (CnH2n+2) terminated with a thiol group (SH), which adheres particularly well to metals. The stamp is contacted against a substrate to transfer the ink, which forms a self-assembled monolayer (SAM) (Xia, Zhai and Whitesides 1996). The SAM can act as a resist against wet or dry etching, to allow the pattern to be transferred to the substrate or an intermediate layer (Whidden et al. 1996). Suitable alkanethiols include hexadecanethiol, octadecanethiol, and eicosanethiol; lateral spreading of inked patterns is reduced with increasing molecular weight, since this reduces vapour pressure. The overall resolution is typically ≈100 nm.
Microcontact printing has been used to pattern many materials, both inorganic and organic. Of particular interest is its application in biochemistry, where the deposition of a micropatterned layer of protein (for example, fibronectin) has been used to immobilise biological cells on a surface for experimentation (Chen et. al. 1998). The protein is deposited by attachment to the surface of a suitably chosen SAM. Other applications in biochemistry include the functionalisation of individual sensor elements in a sensor array. This operation may require different sensitised layers to be deposited on different sites in sequence, and hence may require multiple aligned printing steps. In this case, it may be necessary to print on a fragile, non-planar substrate such as a cantilever array, if the transduction mechanism involves a change in resonance in a resonating system. Alternatively, it may be necessary to print on a fragile membrane, for example if the sensitised device acts as pre-concentrator operating by thermal desorption for another sensor type such as a mass spectrometer.
Microcontact printing has been adapted to non-planar surfaces (Jackman et al. 1995), cylindrical roller stamps have been developed (Xia, Qin and Whitesides 1996) and large-area patterning has been demonstrated with a contact mask aligner (Burgin et al. 2000). A variety of related techniques, including replica moulding, micro transfer moulding and solvent-assisted microcontact moulding have also been developed, and the general technique is termed “soft lithography” (Xia and Whitesides 1998).
A mask aligner typically contains an optical microscope to view the alignment of a pattern and a substrate, and a multi-axis positioning stage for adjustment of their relative positions. Although such equipment has been used for micro-contact-printing, the need to ink the stamper and then carry out layer-to-layer alignment without any contact prior to the final printing step makes multilayer patterning difficult, and it is hard to print on non-planar substrates. Furthermore, the cost of ownership of such equipment is a concern for some users, particularly biochemists. There is therefore a need for versatile, low-cost methods of performing inking and printing operations.
These and other problems of micro contact printing described above are addressed in accordance with the present invention by using microelectromechanical systems (MEMS) technology to combine key mechanical features needed for alignment and printing in the stamper itself, in a miniaturised micro-contact-printing engine.
Accordingly the present invention provides for MEMS technology to be used to combine mechanical alignment features and an actuation mechanism with a patterned stamper in a miniature engine for micro-contact-printing. The alignment features mate directly with further alignment features formed on both the inkwell and the die itself, so that inking and printing are entirely self-aligned, obviating the need for a microscope, precision positioning stages, or pre-contact. A simple elastic suspension allows motion, and a micro-actuator provides actuation.
The invention therefore provides a micro-contact printing engine as claimed in claim 1. Advantageous embodiments are provided in the dependent claims thereto. The invention also provides a substrate as claimed in claim 23 with advantageous embodiments provided in the claims dependent thereto. The invention also provides a method of printing a pattern onto a substrate as claimed in claim 26 and a product of that process. The invention also provides a device, substrate and method substantially as hereinafter described with reference to the accompanying drawings.
These and other features of the invention will be better understood with reference to the exemplary embodiments which follow.
a) is a section view and
a to 3c show in a schematic form a self-aligned inking process in accordance with the teachings of the present invention from the presentation of a printing engine to an inkwell provided on a substrate (
a) shows actuation of a micro-contact-printing engine using a pneumatic actuator and
Parts requiring mechanical rigidity (e.g. the stamper block and the surround) are formed in relatively thick layers of material, while flexible parts (e.g. the suspension) are formed in thinner layers. It will be understood that the terms “thick” and “thinner” are not definite dimensions but what is intended by these terms is that the thickness is sufficient to provide rigidity of that the thinness is sufficient to enable the part to flex sufficiently. The pattern itself may be formed either in a hard material, typical examples being silicon or diamond, or in a soft material such as an elastomer, to allow conformal contact during printing. It will be appreciated that depending on the application for which the stamper is intended that different stampers may carry different patterns, and a number of stampers may be used to build up a complex pattern by overlay.
To ink the stamper, the micro-contact-printing engine is simply located over an appropriate inkwell 202 in the first substrate, so that the mechanical alignment features provided on the first substrate and the printing engine cooperate and interlock. At this point, there is no contact between the print pattern on the stamper and the surface of the ink, the stamper is in its first non-active position. The stamper block is then deflected downwardly into the ink to coat the stamper. This second position is its active position. The deflection of the stamper downwardly may be achieved in a plurality of different ways, examples of which will be described later.
To transfer the pattern, the micro-contact-printing engine with the coated stamp is then relocated over an appropriate die site 208 on the second substrate, so that the mechanical alignment features of the second substrate and those of the print engine interlock. At this point, there is again no contact between the stamper pattern and the printing site, the stamper is in its first non-active position. The stamper block is then deflected down once more to adopt its second active position but in this instance is not taking up ink but rather transferring ink on the print pattern so as to generate an inked pattern on the second substrate.
Because the mechanical features on the micro-contact-printing engine interlock with those on the inkwells and die sites, the process is entirely self-aligning, and it is possible to locate and overlay patterns with high precision. Relocation of the micro-contact-printing engine between different inkwells and printing sites may be carried out manually or using automated equipment. The printing site may be non-planar, and may carry previously fabricated movable structures such as cantilever arrays, merely provided alignment features that allow mating with the micro-contact-printing engine are incorporated. The printing of this highly defined pattern on the second substrate enables the development of highly defined areas of controlled wettability on the second substrate. In this context the areas of wettability are useful in a variety of applications such as for example the provisions or sensors (or sensor arrays) where areas of specific wettability are provided for sensing specific constituents or products.
It will be appreciated by those skilled in the art that a range of different mechanical alignment features may be used to provide a kinematic location mount. Suitable features include but are not restricted to V-grooves, U-grooves, pyramidal cavities, spherical cavities, and spherical objects and cylindrical objects that are inserted into such grooves and cavities to lock them together. Each offers different advantages. For example,
In
Once a coating of ink has been achieved it is then necessary to transfer the ink to the desired site. One way of achieving this transfer is illustrated using a sequence of steps shown in
For biological applications, where low cost, transparent substrates are often required, suitably grooved or indented substrates may be prepared by etching of a glass or by replication of etched silicon masters by moulding of a plastic.
The initial separation between the stamper and the base of the ink well or the copy plate is determined with high precision by the geometry of the mechanical alignment system. The stamper stroke must at least equal this separation to allow printing to be carried out. The stamper motion may be monitored: either externally, for example by optical means, or be measured internally, for example by a strain sensor built into the elastic suspension, to allow the protection of fragile substrates containing features such as cantilevers or membranes.
Actuation of the stamper may be carried out by any of the methods previously demonstrated in MEMS. These methods include, but are not restricted to, manual, pneumatic, electrostatic, electromagnetic and piezoelectric actuation.
For example,
Similarly,
It will be appreciated by those skilled in the art that a piezo-electric drive may also be used for actuation provided suitable piezoelectric materials (for example, lead zirconate titanate, or PZT) and electrodes are incorporated in the elastic suspension. Similarly, a magnetic drive may be used provided suitable magnetic materials (for example, permalloy) are incorporated in the stamper block and an external electrical coil is provided.
It will also be appreciated by those skilled in the art that a micro-contact-printing engine as described in the present invention may be formed in a variety of materials. Materials compatible with common micromachining processes include but are not restricted to single crystal silicon, and multilayer wafers containing single-crystal silicon layers. One example of a suitable multilayer material is bonded silicon-on-insulator (BSOI). This material consists of an oxidised silicon wafer, to which has been bonded a further silicon layer so that the oxide layer is sandwiched between two layers of silicon. The silicon layers may conveniently be structured by anisotropic etching down crystal planes, and also by deep reactive ion etching (DRIE), a method of near vertical etching that is carried out in a high density inductively-coupled plasma (Hynes et al. 1999). The oxide interlayer provides a convenient etch stop.
It will also be appreciated by those skilled in the art that a variety of different fabrication steps may be used and combined in a variety of different orders to form micro-contact-printing engines as described in the present invention. Here we give one example of a fabrication process that is illustrative and exemplary of the sequence steps that may be utilised to form a printing engine in accordance with the invention but is not intended to limit the invention to such steps.
The substrate is then turned over, and the bonded silicon layer 604 is patterned to define the stamp pattern in a layer of soft material 605, for example, using optical or electron beam lithography followed by reactive ion etching (steps 3 and 4). Alternative non-lithographic methods such as transfer moulding may also be used. Suitable soft materials include but are not restricted to PDMS and SU-8, an epoxy-based resist (Lorenz 1997).
The bonded silicon layer is then patterned with a second layer of thick resist 606 to define the suspension and alignment grooves (step 5), and this pattern is then transferred down to the buried oxide layer by DRIE (step 6). Remaining photoresist is then removed, together with exposed areas of oxide (step 7), and stamper dies are separated for use (step 8).
Provision of an electrical contact to the stamper block requires further process steps of patterning, etching, and metallisation that are obvious to those skilled in the art. Provision of a strain sensor to monitor the motion of the stamper block requires further process steps of patterning and etching of a deposited film or patterning and diffusion of a dopant to provide a strain-sensitive resistor that are again well-known in the art.
As mentioned above, the use of a print engine in accordance with the teachings of the present invention enables the provision of high density print patterns on a substrate. Depending on the ink used, such print patterns may be used for a variety of applications including the development of sensors. As the alignment achievable using the techniques of the invention enables highly accurate printing, it is possible to create different regions of sensitivity on a sensor substrate, or regions that are suited for one specific species vis a vis another. If the ink selected is a conductive ink it is possible to provide micro-circuits on the substrate. Such print arrays it will therefore be appreciated may have a myriad of different applications in fields as diverse as biosensors and electronics.
It will be appreciated that what has been described herein is a printing engine formed using MEMS technology, and as such is a MEMS device. The print engine includes a stamper block that is mountable on a flexible, elastic mounting arrangement that enables the stamper to be moved, on suitable actuation, from a first postion where it is not in contact with a substrate to a second position where it is in contact. The movement of the stamper block can be controlled to ensure that the block is firstly adequately dipped in an ink and secondly that the inked block is presented correctly to a substrate where it is used to print specific patterns. By incorporating one or more alignment features within the print engine and having the stamper moveable relative to the alignment features it is possible to self-align the stamper relative to its intended stamping location.
It will therefore be understood that although the invention has described a specific method of accurately aligned, multilevel micro-contact-printing without the need for dedicated inking, alignment and stamping equipment that this method is exemplary of the techniques of the invention. In accordance with the teachings of the invention die-sized micro-contact-printing engines are constructed from micromachined parts, which combine precision alignment features with stamper blocks supported on elastic suspensions. The stampers carry raised patterns, the alignment features mate with corresponding features on etched inkwells and substrates, and the pattern is transferred using a microactuator.
While the invention has been described with reference to specific embodiments it will be appreciated that these are exemplary embodiments only and that modifications to that illustrated will be apparent to those skilled in the art without departing from the spirit or scope of the invention. Where one or more integers or components are described with reference to one specific Figure it will be appreciated that these integers or components may be substituted with other integers or components. Furthermore, although the invention has been described with regard to an implementation in silicon, that the application of the MEMS techniques of the present invention are not intended to be limited to any one specific material.
Similarly, the words comprises/comprising when used in this specification are to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps, components or groups thereof.
Number | Date | Country | Kind |
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0510978.0 | May 2005 | GB | national |