Micro heat flux sensor array

Information

  • Patent Application
  • 20070181650
  • Publication Number
    20070181650
  • Date Filed
    February 01, 2007
    19 years ago
  • Date Published
    August 09, 2007
    19 years ago
Abstract
Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.
Description

BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a disassembled perspective view illustrating a micro heat flux sensor array according to an example embodiment;



FIG. 2 is an assembled perspective view illustrating the micro heat flux sensor array of FIG. 1;



FIG. 3 is a sectional view taken along a line III-III′ of FIG. 2;



FIGS. 4A through 4E are sectional view sequentially illustrating a method of fabricating a micro heat flux sensor array according to an example embodiment;



FIG. 5 is a perspective view illustrating a micro heat flux sensor array according to another example embodiment;



FIG. 6 is a disassembled perspective view illustrating a micro heat flux sensor array according to another example embodiment;



FIG. 7 is an assembled perspective view illustrating the micro heat flux sensor array of FIG. 6;



FIG. 8 is a sectional view taken along a line VIII-VIII′ of FIG. 7;



FIGS. 9A through 9C are sectional view sequentially illustrating a method of fabricating a micro heat flux sensor array according to another example embodiment.


Claims
  • 1. A micro heat flux sensor array, comprising: a substrate;a plurality of first sensors formed on a first side of the substrate; anda plurality of second sensors formed on a second side of the substrate, wherein each of the plurality of first and second sensors include, a first wiring pattern layer of a first conductive material,a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, andan insulating layer, interposed between the first and second wiring pattern layers, having via holes therein through which the first and second wiring pattern layers make contact, respectively.
  • 2. The micro heat flux sensor array of claim 1, wherein the first wiring pattern layer includes a plurality of first measuring patterns disposed on respective temperature measuring regions, and a plurality of first routing wires configured to connect the plurality of first measuring pattern to an external heat flux measuring apparatus.
  • 3. The micro heat flux sensor array of claim 2, wherein the second wiring pattern layer includes a plurality of second measuring patterns disposed on locations corresponding to the first measuring pattern, a plurality of connection patterns disposed on the respective via holes formed on the insulating layer to connect the plurality of second measuring patterns to the respective plurality of first measuring pattern, and a plurality of second routing wires configured to connect the respective plurality of second measuring patterns to the external heat flux measuring apparatus.
  • 4. The micro heat flux sensor array of claim 1, wherein the first wiring pattern layer and the second wiring pattern layer are of different materials.
  • 5. The micro heat flux sensor array of claim 1, wherein the first wiring pattern layer and the second wiring pattern layer are of the same material.
  • 6. The micro heat flux sensor array of claim 1, wherein the substrate includes a flexible film.
  • 7. The micro heat flux sensor array of claim 1, wherein the substrate includes conductive metal balls.
  • 8. A micro heat flux sensor array, comprising: a substrate;a plurality of first sensors formed on a first side of the substrate; anda plurality of second sensors formed on a second side of the substrate,wherein each of the plurality of first and second sensors include, a first wiring pattern layer of a first conductive material,a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer,an insulating layer, interposed between the first and second wiring pattern layers, having via holes therein through which the first and second wiring pattern layers make contact, respectively, anda plurality of grooves formed at desired intervals on the insulating layer.
  • 9. The micro heat flux sensor array of claim 8, wherein the first wiring pattern layer includes a plurality of first measuring patterns disposed on respective temperature measuring regions, and a plurality of first routing wires configured to connect the plurality of first measuring pattern to an external heat flux measuring apparatus.
  • 10. The micro heat flux sensor array of claim 9, wherein the second wiring pattern layer includes a plurality of second measuring patterns disposed on locations corresponding to the first measuring pattern, a plurality of connection patterns disposed on the respective via holes formed on the insulating layer to connect the plurality of second measuring patterns to respective plurality of first measuring pattern, and a plurality of second routing wires configured to connect the respective plurality of second measuring patterns to the external heat flux measuring apparatus.
  • 11. The micro heat flux sensor array of claim 8, wherein the first wiring pattern layer and the second wiring pattern layer are of different materials.
  • 12. The micro heat flux sensor array of claim 8, wherein the first wiring pattern layer and the second wiring pattern layer are of the same material.
  • 13. The micro heat flux sensor array of claim 8, wherein the substrate includes a flexible film.
  • 14. The micro heat flux sensor array of claim 8, wherein the substrate includes conductive metal balls.
  • 15. A micro heat flux sensor array, comprising: a substrate;a plurality of first sensors formed on a first side of the substrate; anda plurality of second sensors formed on a second side of the substrate,wherein each of the plurality of first and second sensors include, a first wiring pattern layer of a first conductive material,a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer,an embossed insulating layer having a plurality of protrusions at desired intervals and in contact with the first and second wiring pattern layers, anda plurality of grooves formed between adjacent protrusions on the insulating layer.
  • 16. The micro heat flux sensor array of claim 15, wherein the first wiring pattern layer and the second wiring pattern layer contact each other on the respective plurality of protrusion.
  • 17. The micro heat flux sensor array of claim 15, wherein the first wiring pattern layer includes a plurality of first measuring patterns disposed on respective temperature measuring regions, and a plurality of first routing wires configured to connect the plurality of first measuring pattern to an external heat flux measuring apparatus.
  • 18. The micro heat flux sensor array of claim 17, wherein the second wiring pattern layer includes a plurality of second measuring patterns disposed on locations corresponding to the plurality of first measuring pattern, and a plurality of second routing wires configured to connect the respective plurality of second measuring patterns to the external heat flux measuring apparatus.
  • 19. The micro heat flux sensor array of claim 15, wherein the first wiring pattern layer and the second wiring pattern layer are of different materials.
  • 20. The micro heat flux sensor array of claim 15, wherein the first wiring pattern layer and the second wiring pattern layer are of the same material.
  • 21. The micro heat flux sensor array of claim 15, wherein the substrate includes a flexible film.
  • 22. The micro heat flux sensor array of claim 15, wherein the substrate includes conductive metal balls.
Priority Claims (1)
Number Date Country Kind
10-2006-0010716 Feb 2006 KR national