Claims
- 1. A flexible circuit article comprising:
- (a) a closed cell, nonporous, non-foam microcellular polymeric article having a density of about 0.3 g/cc to about 1.5 g/cc in the shape of a film having a thickness of from about 1 mil to 20 mils, the polymeric article comprising a polymer selected from the group consisting of aromatic polyparabanic acids, aromatic polyhydantoins, aromatic polyamides, aromatic polyimides, aromatic polysulfones, aromatic polyimides-amides and combinations thereof; and
- (b) a conductive circuit adhered to said film in a prearranged configuration.
- 2. A flexible circuit according to claim 1 wherein said conductive material is copper.
- 3. An article according to claim 1 wherein said conductive material has been electrodeposited on said film-shaped article.
- 4. An article according to claim 1 wherein said metal is aluminum.
- 5. A flexible circuit article of claim 1 wherein said polymer is an aromatic polyparabanic acid.
- 6. A composite semi-conductor article comprising a closed cell, nonporous, non-foam microcellular polymeric film having a thickness of from about 1.0 mil to 20 mils and a density of from about 0.3 g/cc to about 1.5 g/cc, the polymeric film comprising a polymer selected from the group consisting of aromatic polyparabanic acids, aromatic polyhydantoins, aromatic polyamides, aromatic polyimides, aromatic sulfones, aromatic polyimides-amides and combinations thereof, which film has adhered to it a prearranged configuration of a metal oxide semi-conductor (MOS).
- 7. A composite semi-conductor article of claim 6 wherein said polymer is an aromatic polyparabanic acid.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation-in-part of copending application Ser. No. 643,062, filed Dec. 22, 1975 now abandoned, which in turn is a Rule 60 Divisional of Ser. No. 356,924, filed May 3, 1973 now abandoned.
US Referenced Citations (5)
Divisions (1)
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Number |
Date |
Country |
| Parent |
356924 |
May 1973 |
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Continuation in Parts (1)
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Number |
Date |
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643062 |
Dec 1975 |
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