Claims
- 1. A microelectric mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer and is transparent to electromagnetic signals or waves; a moveable electrode disposed adjacent said fixed electrode; and a first and second electrically conductive regions which are isolated from one another by said fixed electrode, said moveable electrode being electrically coupled to said first conductive region, wherein said moveable electrode moves to cover said fixed electrode and to electrically couple to said second conductive region, thus electrically coupling said first and second conductive regions, in response to a potential being applied across said fixed and moveable electrodes.
- 2. The device of claim 1, wherein said fixed and moveable electrodes are configured within an array of similar devices.
- 3. The device of claim 2, wherein each device or groups of devices in said array are individually addressable to actuate said moveable electrodes.
- 4. The device of claim 1, wherein said potential is applied directly to said fixed and moveable electrodes.
- 5. The device of claim 1, wherein said potential is applied directly to said fixed electrode and capacitively to said moveable electrode via a second fixed electrode.
- 6. The device of claim 5, wherein said second fixed electrode comprises a transparent, high resistance layer.
- 7. The device of claim 1, wherein the electrical coupling between said moveable electrode and said second conductive region comprises a low resistance contact.
- 8. The device of claim 1, wherein said moveable electrode impedes transmission of electromagnetic signals or waves.
- 9. A microelectro-mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; a moveable electrode disposed adjacent said fixed electrode; and at least one insulating layer between said fixed electrode and said moveable electrode.
- 10. A microelectro-mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and a moveable electrode disposed adjacent said fixed electrode, wherein said moveable electrode and said fixed electrode are isolated from each other by an insulating layer.
- 11. A microelectro-mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and a moveable electrode disposed adjacent said fixed electrode, wherein said high resistance layer has a resistance higher than 1000 ohms per square.
- 12. A microelectro-mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and a moveable electrode disposed adjacent said fixed electrode, wherein said fixed electrode is configured on an insulating layer,.
- 13. A microelectro-mechanical device comprising:a fixed electrode formed on a substrate, said fixed electrode including an electrically conducting transparent, high resistance layer that is transparent to electromagnetic waves; and a moveable electrode disposed adjacent said fixed electrode and, wherein a layer of molybdenum is utilized as a release layer to configure said moveable electrode.
- 14. A microelectro-mechanical device in which a layer of molybdenum is utilized as a release layer to configure a moveable member, said layer of molybdenum has a thickness less than or equal to 3000 Å and is etched away using hydrogen peroxide to form said release layer.
- 15. A method of fabricating a microelectro-mechanical device comprising:providing a first layer of molybdenum on a substrate; providing a second layer on said first layer; and removing said first layer using hydrogen peroxide in a manner such that at least a portion of said second layer is moveable relative to said substrate.
- 16. The method of claim 15, wherein said first layer is patterned.
- 17. The method of claim 15, wherein said second layer is patterned.
PRIORITY INFORMATION
This application is a continuation application of Ser. No. 09/624,795 filed Jul. 25, 2000, now abandoned, which is a continuation application of Ser. No. 08/972,224 filed Nov. 17, 1997 now U.S. Pat. No. 6,127,90
SPONSORSHIP INFORMATION
This invention was made with government support under Contract No. F19628-95-C-002 awarded by the U.S. Air Force. The government has certain rights in the invention.
US Referenced Citations (19)
Foreign Referenced Citations (6)
Number |
Date |
Country |
4421980 |
Apr 1995 |
DE |
0 637 042 |
Feb 1995 |
EP |
0 654 802 |
May 1995 |
EP |
0 709 911 |
May 1996 |
EP |
05235282 |
Oct 1993 |
JP |
WO 9501624 |
Jan 1995 |
WO |
Non-Patent Literature Citations (1)
Entry |
“Micromechanical Membrane Switches on Silicon”, K.E. Peterson vol. 23, No. 4, Jul. 1979, pp. 376-385, IBM Journal of Research and Development. |
Continuations (2)
|
Number |
Date |
Country |
Parent |
09/624795 |
Jul 2000 |
US |
Child |
09/885713 |
|
US |
Parent |
08/972224 |
Nov 1997 |
US |
Child |
09/624795 |
|
US |