1. Field of the Invention
The present invention relates to a MEMS device and the semi-manufacture and manufacturing method thereof, and more particularly to a MEMS device and the semi-manufacture and manufacturing method thereof that prevent electrostatic damages to the elements during the manufacturing process.
2. Description of the Prior Art
A Microelectromechanical System (MEMS) device including a movable element achieves various functions of the MEMS device by sensing or controlling the physical quantity of the movement of the movable element. However, in a manufacturing process of the MEMS device, such as dry etching, ion implantation, and mechanical grinding, etc., the elements of the MEMS device may be charged, and the electrostatic forces may cause stiction between the elements and/or distortion of the elements. It is therefore highly desirable to prevent the elements of the MEMS device from being damaged by electrostatic forces during the manufacturing process.
The present invention is directed to a MEMS device and the semi-manufacture and manufacturing method thereof that maintain various elements of the MEMS to be equi-potential by using a conductive circuit, thereby preventing electrostatic damages to the elements of the MEMS during the manufacturing process.
According to an embodiment, the semi-manufacture of the MEMS device includes a substrate, a MEMS and a conductive circuit. The MEMS is disposed on the substrate and includes a movable element and a functional element. The functional element is coupled with the movable element for sensing a physical quantity of movement of the movable element and outputting a corresponding sensed signal, or controlling the movable element to generate the desired physical quantity of movement. The conductive circuit is disposed on the substrate and electrically connected with the movable element and the functional element so that the movable element and the functional element are equi-potential.
According to another embodiment, the manufacturing method of the MEMS device includes: providing a substrate; disposing a MEMS and a conductive circuit on the substrate, wherein the MEMS includes a movable element and a functional element, wherein the functional element is coupled with the movable element for sensing the physical quantity of movement of the movable element and outputting a corresponding sensed signal, or controlling the movable element to generate a desired physical quantity of movement, and the conductive circuit is electrically connected with the movable element and the functional element so that the movable element and the functional element are equi-potential; and disconnecting the conductive circuit.
According to another embodiment, the MEMS device includes: a substrate, a movable element, a functional element and a conductive circuit. The movable element is disposed on the substrate. The functional element is disposed on the substrate, coupled with the movable element for sensing a physical quantity of movement of the movable element and outputting a corresponding sensed signal, or controlling the movable element to generate the desired physical quantity of movement. The conductive circuit is disposed on the substrate and includes a switch circuit. The conductive circuit is electrically connected with the movable element and the functional element so that when the switch circuit is conductive or cutoff the movable element and the functional element are equi-potential or electrically isolated.
The objective, technologies, features and advantages of the present invention will become apparent from the following description in conjunction with the accompanying drawings wherein certain embodiments of the present invention are set forth by way of illustration and example.
The foregoing conceptions and their accompanying advantages of this invention will become more readily appreciated after being better understood by referring to the following detailed description, in conjunction with the accompanying drawings, wherein:
The detailed explanation of the present invention is described as follows. The described preferred embodiments are presented for purposes of illustrations and description, and they are not intended to limit the scope of the present invention.
Referring to
The MEMS 12 includes a movable element 121 and a functional element. As illustrated in
Referring still to
According to an embodiment, the MEMS 12 may include a guard ring 123 surrounding the movable element 121 and the functional element. Normally speaking, the guard ring 123 is grounded. By the same token, the conductive circuit 13 may also be connected with the guard ring 123 to maintain the guard ring 123, the movable element 121 and the functional element equi-potential during the manufacturing process.
Referring to
Referring to
It is noted that partial sawing (i.e. without cutting the substrate completely) or using the laser to destroy the conductive circuit 13, or employing the switch circuit to disconnect the conductive circuit may also be able to isolate the movable element and the functional element electrically. This way, a wafer-level test of the MEMS may be conducted (S34). Thereafter, the processes of substrate sawing (S35) and packaging of the MEMS (S36) may be performed.
To summarize the foregoing description, according to the present invention, the MEMS device and the semi-manufacture and the manufacturing method thereof exploits the existing processes, by disposing a conductive circuit to maintain various elements of the MEMS equi-potential during the manufacturing process, to prevent stiction and distortion damages to various elements of the MEMS due to electrostatic forces.
While the invention is susceptible to various modifications and alternative forms, a specific example thereof has been shown in the drawings and is herein described in detail. It should be understood, however, that the invention is not to be limited to the particular form disclosed, but to the contrary, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the appended claims.
This application claims the benefit of the U.S. Provisional Patent Application Ser. No. 61/421,786, filed Dec. 10, 2010, currently pending, entitled “Microelectromechanical System Device and Semi-manufacture and Manufacturing Method thereof”; the contents of which are hereby incorporated by reference.
Number | Date | Country | |
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61421786 | Dec 2010 | US |