Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944

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B81C1/00952

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00952Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming MEMS cavity structure
- Patent number 11,332,364
- Issue date May 17, 2022
- AAC Technologies Pte. Ltd.
- Wooicheang Goh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with patterned contact area
- Patent number 11,230,470
- Issue date Jan 25, 2022
- Invensense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin film material transfer method
- Patent number 11,180,367
- Issue date Nov 23, 2021
- The University of Manchester
- Aravind Vijayaraghavan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) structure to prevent stiction...
- Patent number 11,167,979
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for reducing in-process and in-use stiction fo...
- Patent number 10,870,574
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of cleaning and drying semiconductor substrate
- Patent number 10,811,247
- Issue date Oct 20, 2020
- Shin-Etsu Chemical Co., Ltd.
- Tsutomu Ogihara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 10,562,763
- Issue date Feb 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for preventing solder flow into a MEMS pressur...
- Patent number 10,544,040
- Issue date Jan 28, 2020
- DunAn Microstaq, Inc.
- Wayne C. Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectromechanical systems (MEMS) structure to prevent stiction...
- Patent number 10,508,021
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming photoresist pattern and method of fabricating sem...
- Patent number 10,438,810
- Issue date Oct 8, 2019
- Samsung Electronics Co., Ltd.
- Cha-Won Koh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for treating pattern structure, method for manufacturing ele...
- Patent number 10,403,491
- Issue date Sep 3, 2019
- FUJIFILM Corporation
- Atsushi Mizutani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device including micromechanical components in cavities having diff...
- Patent number 10,384,932
- Issue date Aug 20, 2019
- Robert Bosch GmbH
- Achim Breitling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for reducing in-process and in-use stiction fo...
- Patent number 10,273,143
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of treating semiconductor substrate
- Patent number 10,229,828
- Issue date Mar 12, 2019
- SK Hynix Inc.
- Yong Soo Choi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 10,112,822
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for producing an electromechanical device
- Patent number 10,112,827
- Issue date Oct 30, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Vincent Agache
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) structure to prevent stiction...
- Patent number 9,676,606
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Etch release residue removal using anhydrous solution
- Patent number 9,663,356
- Issue date May 30, 2017
- NXP USA, INC.
- Srivatsa G. Kundalgurki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by introduction of a carbon barrier
- Patent number 9,463,973
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor pressure sensor and fabrication method thereof
- Patent number 9,395,258
- Issue date Jul 19, 2016
- Mitsubishi Electric Corporation
- Kimitoshi Sato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Passivated microelectromechanical structures and methods
- Patent number 9,395,533
- Issue date Jul 19, 2016
- Pixtronix, Inc.
- Teruo Sasagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicide micromechanical device and methods to fabricate same
- Patent number 8,993,907
- Issue date Mar 31, 2015
- International Business Machines Corporation
- Michael A Guillorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by introduction of a carbon barrier
- Patent number 8,895,339
- Issue date Nov 25, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods to fabricate silicide micromechanical device
- Patent number 8,470,628
- Issue date Jun 25, 2013
- International Business Machines Corporation
- Michael A Guillorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of wafer-level fabrication of MEMS devices
- Patent number 8,445,324
- Issue date May 21, 2013
- Oakland University
- Hongwei Qu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Surface roughening process
- Patent number 8,268,703
- Issue date Sep 18, 2012
- S.O.I. Tec Silicon on Insulator Technologies
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonded wafer substrate utilizing roughened surfaces for use in MEMS...
- Patent number 8,253,243
- Issue date Aug 28, 2012
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a bonded wafer substrate for use in MEMS stru...
- Patent number 8,030,133
- Issue date Oct 4, 2011
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing micro electro mechanical systems device
- Patent number 7,972,886
- Issue date Jul 5, 2011
- Hitachi, Ltd.
- Heewon Jeong
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING MIRROR DEVICE
- Publication number 20240092634
- Publication date Mar 21, 2024
- Hamamatsu Photonics K.K.
- Daiki SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MEMS DEVICE AND METHOD FOR MANUFACTURING THE MEMS DEVICE
- Publication number 20240067520
- Publication date Feb 29, 2024
- INFINEON TECHNOLOGIES AG
- Fabian Streb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FENCE STRUCTURE TO PREVENT STICTION IN A MEMS MOTION SENSOR
- Publication number 20200140265
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...
- Publication number 20200079642
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN FILM MATERIAL TRANSFER METHOD
- Publication number 20200048082
- Publication date Feb 13, 2020
- The University of Manchester
- Aravind VIJAYARAGHAVAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR REDUCING IN-PROCESS AND IN-USE STICTION FO...
- Publication number 20190241425
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH PATTERNED CONTACT AREA
- Publication number 20190071308
- Publication date Mar 7, 2019
- InvenSense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND STRUCTURE FOR PREVENTING SOLDER FLOW INTO A MEMS PRESSUR...
- Publication number 20180319656
- Publication date Nov 8, 2018
- DunAn Microstaq, Inc.
- Wayne C. Long
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...
- Publication number 20170267516
- Publication date Sep 21, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SILANE MODIFIED FLUID FOR MEMS STICTION REDUCTION
- Publication number 20170003499
- Publication date Jan 5, 2017
- Pixtronix, Inc.
- Ji Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...
- Publication number 20160318753
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Yen Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PASSIVATED MICROELECTROMECHANICAL STRUCTURES AND METHODS
- Publication number 20160091713
- Publication date Mar 31, 2016
- Pixtronix, Inc.
- Teruo Sasagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR AND FABRICATION METHOD THEREOF
- Publication number 20140319585
- Publication date Oct 30, 2014
- Mitsubishi Electric Corporation
- Kimitoshi SATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEPOSITION TECHNIQUE FOR DEPOSITING A COATING ON A DEVICE
- Publication number 20140308822
- Publication date Oct 16, 2014
- MEMSSTAR LIMITED
- Anthony O'Hara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140211920
- Publication date Jul 31, 2014
- Canon Kabushiki Kaisha
- Yutaka Setomoto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER
- Publication number 20140167188
- Publication date Jun 19, 2014
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND FABRICATION METHOD...
- Publication number 20140077317
- Publication date Mar 20, 2014
- SOLID STATE SYSTEM CO., LTD.
- Tsung-Min Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicide Micromechanical Device and Methods to Fabricate Same
- Publication number 20130020183
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Michael A. Guillorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicide Micromechanical Device and Methods to Fabricate Same
- Publication number 20120318649
- Publication date Dec 20, 2012
- International Business Machines Corporation
- Michael A. Guillorn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEM DEVICE AND SEMI-MANUFACTURE AND MANUF...
- Publication number 20120146452
- Publication date Jun 14, 2012
- Miradia, Inc.
- HUA-SHU WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED WAFER SUBSTRATE FOR USE IN MEMS STRUCTURES
- Publication number 20110260265
- Publication date Oct 27, 2011
- Icemos Technology Ltd.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of wafer-level fabrication of MEMS devices
- Publication number 20110140216
- Publication date Jun 16, 2011
- Oakland University
- Hongwei Qu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Bonded Wafer Substrate for Use in MEMS Structures
- Publication number 20100065946
- Publication date Mar 18, 2010
- ICEMOS TECHNOLOGY LTD.
- Robin Wilson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING MICRO ELECTRO MECHANICAL SYSTEMS DEVICE
- Publication number 20090017579
- Publication date Jan 15, 2009
- Hitachi, Ltd.
- Heewon JEONG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Surface roughening process
- Publication number 20080176381
- Publication date Jul 24, 2008
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Process of forming and controlling rough interfaces
- Publication number 20080176382
- Publication date Jul 24, 2008
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Bernard Aspar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro-Mechanical Structure and Method for Manufacturing the Same
- Publication number 20070215965
- Publication date Sep 20, 2007
- Woo Seok Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Vertically spaced plural microsprings
- Publication number 20070125486
- Publication date Jun 7, 2007
- Palo Alto Research Center Incorporated
- Thomas Hantschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing method of a MEMS structure, a cantilever-type MEMS st...
- Publication number 20060166393
- Publication date Jul 27, 2006
- SAMSUNG ELECTRONICS CO., LTD.
- Byeoung-ju Ha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor physical quantity sensor and method for manufacturing...
- Publication number 20060057758
- Publication date Mar 16, 2006
- DENSO Corporation
- Kenichi Yokoyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Treatments or methods for avoiding stiction during the manufacturing process not provided for in groups B81C1/00928 - B81C1/00944

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming MEMS cavity structure

Fence structure to prevent stiction in a MEMS motion sensor

Semiconductor device with patterned contact area

Thin film material transfer method

Microelectromechanical systems (MEMS) structure to prevent stiction...

Method and apparatus for reducing in-process and in-use stiction fo...

Method of cleaning and drying semiconductor substrate

Fence structure to prevent stiction in a MEMS motion sensor

Method and structure for preventing solder flow into a MEMS pressur...

Microelectromechanical systems (MEMS) structure to prevent stiction...

Method of forming photoresist pattern and method of fabricating sem...

Method for treating pattern structure, method for manufacturing ele...

Device including micromechanical components in cavities having diff...

Method and apparatus for reducing in-process and in-use stiction fo...

Method of treating semiconductor substrate

Semiconductor device

Process for producing an electromechanical device

Microelectromechanical systems (MEMS) structure to prevent stiction...

Etch release residue removal using anhydrous solution

Reducing MEMS stiction by introduction of a carbon barrier

Semiconductor pressure sensor and fabrication method thereof

Passivated microelectromechanical structures and methods

Silicide micromechanical device and methods to fabricate same

Reducing MEMS stiction by introduction of a carbon barrier

Methods to fabricate silicide micromechanical device

Method of wafer-level fabrication of MEMS devices

Surface roughening process

Bonded wafer substrate utilizing roughened surfaces for use in MEMS...

Method of fabricating a bonded wafer substrate for use in MEMS stru...

Method of manufacturing micro electro mechanical systems device

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING MIRROR DEVICE

ENCAPSULATED MEMS DEVICE AND METHOD FOR MANUFACTURING THE MEMS DEVICE

FENCE STRUCTURE TO PREVENT STICTION IN A MEMS MOTION SENSOR

MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...

THIN FILM MATERIAL TRANSFER METHOD

METHOD AND APPARATUS FOR REDUCING IN-PROCESS AND IN-USE STICTION FO...

SEMICONDUCTOR DEVICE WITH PATTERNED CONTACT AREA

METHOD AND STRUCTURE FOR PREVENTING SOLDER FLOW INTO A MEMS PRESSUR...

MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...

SILANE MODIFIED FLUID FOR MEMS STICTION REDUCTION

MICROELECTROMECHANICAL SYSTEMS (MEMS) STRUCTURE TO PREVENT STICTION...

PASSIVATED MICROELECTROMECHANICAL STRUCTURES AND METHODS

SEMICONDUCTOR PRESSURE SENSOR AND FABRICATION METHOD THEREOF

DEPOSITION TECHNIQUE FOR DEPOSITING A COATING ON A DEVICE

STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER

MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICE AND FABRICATION METHOD...

Silicide Micromechanical Device and Methods to Fabricate Same

Silicide Micromechanical Device and Methods to Fabricate Same

MICROELECTROMECHANICAL SYSTEM DEVICE AND SEMI-MANUFACTURE AND MANUF...

BONDED WAFER SUBSTRATE FOR USE IN MEMS STRUCTURES

Method of wafer-level fabrication of MEMS devices

Bonded Wafer Substrate for Use in MEMS Structures

METHOD OF MANUFACTURING MICRO ELECTRO MECHANICAL SYSTEMS DEVICE

Surface roughening process

Process of forming and controlling rough interfaces

Micro-Mechanical Structure and Method for Manufacturing the Same

Vertically spaced plural microsprings

Manufacturing method of a MEMS structure, a cantilever-type MEMS st...

Semiconductor physical quantity sensor and method for manufacturing...