Claims
- 1. An apparatus for preparing a platen for performing lapping operations, comprising:a base; a platter rotatably mounted on the base; a main drive motor attached to the base and operatively coupled to the platter; a pressure arm disposed on the base, the pressure arm including a tool receiving portion capable of being positioned in alignment with a lapping surface of a platen; an actuator coupled to the pressure arm; and a mechanism for slowing the pressure arm to reduce an impact force resulting from touching a tool to the lapping surface of the platen.
- 2. The apparatus of claim 1, wherein the mechanism for slowing the pressure arm comprises an arm height sensing device.
- 3. The apparatus of claim 2, wherein the arm height sensing device comprises:a metal proximity sensor; and a mounting structure for holding the metal proximity sensor above the lapping surface of the platen.
- 4. The apparatus of claim 3, wherein the mounting structure adjustably holds the metal proximity sensor at varying heights above the lapping surface of the platen.
- 5. The apparatus of claim 2, wherein the arm height sensing device comprises:an optical sensor; and a mounting structure for holding the metal proximity sensor above the lapping surface of the platen.
- 6. The apparatus of claim 5, wherein the mounting structure adjustably holds the optical sensor at varying heights above the lapping surface of the platen.
- 7. The apparatus of claim 1, wherein the mechanism for slowing the pressure arm comprises a descent control device.
- 8. The apparatus of claim 7, wherein the descent control device comprises:a spindle shaft slidably contained within the pressure arm and adapted to be connected to a tool; and a switch triggered by vertical movement of the spindle shaft.
- 9. The apparatus of claim 8, wherein the descent control device further comprises:a hollow portion in the spindle shaft; and a rod slidably mounted within the hollow portion of the spindle shaft and configured to contact a tool; wherein the switch is triggered by vertical movement of the rod in relation to the spindle shaft.
- 10. An apparatus for preparing a platen for performing lapping operations, comprising:a base; means for rotating a platen mounted on the base; means disposed on the base for applying a tool to a lapping surface of a platen; and means for slowing the means for applying a tool to a lapping surface of a platen to reduce an impact force resulting from touching a tool to the lapping surface of the platen.
RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 09/542,049 filed Mar. 31, 2000. U.S. patent application Ser. No. 09/542,049 claims priority of: U.S. Provisional Application Ser. No. 60/127,517 filed Apr. 2, 1999; U.S. Provisional Application Ser. No. 60/127,476 filed Apr. 2, 1999; and U.S. Provisional Application Ser. No. 60/127,475 filed Apr. 2, 1999; all of which are hereby incorporated by reference.
US Referenced Citations (25)
Provisional Applications (3)
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Number |
Date |
Country |
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60/127517 |
Apr 1999 |
US |
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60/127476 |
Apr 1999 |
US |
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60/127475 |
Apr 1999 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/542049 |
Mar 2000 |
US |
Child |
10/147357 |
|
US |