Patent Application
20140241062
Flash memory cards are becoming more densely packed. As memory capacity increases and physical size remains relatively constant, heat dissipation becomes a significant issue. Furthermore, waste heat from one component impacts the performance of other components; for example, waste heat from flash memory elements has an adverse impact on flash memory controllers.
Consequently, it would be advantageous if an apparatus existed that is suitable for use in a flash memory card to organize and distribute components within the existing footprint while providing superior heat dissipation.
Accordingly, the present invention is directed to a novel apparatus for use in a memory card to organize and distribute components within the existing footprint while providing superior heat dissipation.
In one embodiment of the present invention, a memory card includes a board with memory elements connected by a flexible connector to a board with a NAND flash controller. The flexible connector allows the memory elements to be separated from the NAND flash controller.
In another embodiment of the present invention, memory elements are organized on a NAND flash board and the NAND flash board is connected to a controller board to create an airflow channel for enhanced cooling.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention claimed. The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate an embodiment of the invention and together with the general description, serve to explain the principles.
The numerous advantages of the present invention may be better understood by those skilled in the art by reference to the accompanying figures in which:
Reference will now be made in detail to the subject matter disclosed, which is illustrated in the accompanying drawings. The scope of the invention is limited only by the claims; numerous alternatives, modifications and equivalents are encompassed. For the purpose of clarity, technical material that is known in the technical fields related to the embodiments has not been described in detail to avoid unnecessarily obscuring the description.
Referring to
In at least one embodiment of the present invention, the NAND flash board 106 and controller board 114 define an airflow channel 116. In one embodiment, the airflow channel 116 directs airflow produced by a separate airflow device such as a fan. In another embodiment, heat from the memory elements 108 produces air circulation, and such air circulation is directed by the airflow channel 116. The airflow channel 116 enhances cooling by increasing air circulation locally with regards to the memory elements 108 and the NAND flash controller 104. In at least one embodiment, the NAND flash controller 104 on a portion of the controller board 114 opposite the portion defining the airflow channel 116 to further enhance cooling.
In at least one embodiment of the present invention, a memory card having a flexible connector 110 includes one or more support elements 118 to maintain physical separation between a NAND flash board 106 and a controller board 114 or host bus adapter 100. The support element 118 should not obstruct the airflow channel 116 more than necessary to maintain a desired separation. In at least one embodiment, support elements 118 include plastic engaging the entire peripheral surface or edge of the controller board 114 and the NAND flash board 106.
Referring to
Where the controller board 204 and NAND flash board 202 are connected by a flexible connector 208, the controller board 204 and NAND flash board 202 are positionable for enhanced heat dissipation. Furthermore, physical separation of memory elements 210 from the NAND flash controller 212 enhances performance by diminishing the effects of waste heat from one component to another.
Referring to
In at least one embodiment, NAND flash boards 302 are physically separate from each other. In another embodiment, the NAND flash boards 302 are logically separated such that all of the NAND flash boards 302 comprise a single physical element without any common circuitry. Where the NAND flash boards 302 are physically separated, each NAND flash board 302 can be positioned or oriented to change the shape of an airflow channel defined by the NAND flash boards 302 and a controller board. Alternatively, each NAND flash board 302 can be positioned or oriented to further enhance heat dissipation.
It is believed that the present invention and many of its attendant advantages will be understood by the foregoing description of embodiments of the present invention, and it will be apparent that various changes may be made in the form, construction, and arrangement of the components thereof without departing from the scope and spirit of the invention or without sacrificing all of its material advantages. The form herein before described being merely an explanatory embodiment thereof, it is the intention of the following claims to encompass and include such changes.
The present application claims the benefit under 35 U.S.C. §119(e) of U.S. Provisional Application Ser. No. 61/769,850, filed Feb. 27, 2013, which is incorporated herein by reference.
| Number | Date | Country | |
|---|---|---|---|
| 61769850 | Feb 2013 | US |
