Patent Application
20240304532
The present disclosure relates to a module and an electronic device.
From the viewpoint of miniaturization of the electronic device, the demand for high-density arrangement in a module included in an electronic device has been rising. As one of structures that realize the high-density arrangement, a three-dimensional mounting structure formed by stacking a plurality of wiring boards into multiple layers is known. As the three-dimensional mounting structure, Japanese Patent Laid-Open No. 2022-82426 discloses a module. The module disclosed in Japanese Patent Laid-Open No. 2022-82426 includes two wiring boards opposing each other and a wiring member interconnecting the two wiring boards.
An electronic component disposed on either one of the two wiring boards generates heat in response to power supply thereto. The heat generated in the electronic component is radiated from the electronic component to a space therearound, or is conducted to the wiring board on which the electronic component is disposed and then radiated to the space therearound, but the heat radiated to the space between the two wiring boards from the electronic component or the wiring board on which the electronic component is disposed is likely to remain between the two wiring boards. In addition, if the distance between the two wiring boards is small, One of the two wiring boards is likely to be affected by the heat from the other. Therefore, there is a demand for improvement in the structure between the two wiring boards.
According to a first aspect of the present disclosure, a module includes a first wiring board having a main surface, a second wiring board disposed at an interval from the first wiring board and configured to overlap with the first wiring board in a direction orthogonal to the main surface, an electronic component mounted on the first wiring board or the second wiring board, and a connecting unit configured to interconnect the first wiring board and the second wiring board. The connecting unit includes a first wiring member disposed on the first wiring board side with respect to a first virtual plane between the first wiring board and the second wiring board, a second wiring member disposed on the second wiring board side with respect to the first virtual plane, and a conductive bonding member configured to bond the first wiring member and the second wiring member to each other. A first space continuous from the first wiring board to the first virtual plane and a second space continuous from the second wiring board to the first virtual plane are continuous with each other at the first virtual plane between the first wiring board and the second wiring board. At least one of a first condition and a second condition is satisfied. The first condition is a condition that a third space on an opposite side to the first space with respect to the first wiring member is continuous with the first space in a second virtual plane parallel to the first virtual plane and including the first wiring member and the first space. The second condition is a condition that a fourth space on an opposite side to the second space with respect to the second wiring member is continuous with the second space in a third virtual plane parallel to the first virtual plane and including the second wiring member and the second space.
According to a second aspect of the present disclosure, a module includes a first wiring board having a main surface, a second wiring board disposed at an interval from the first wiring board and configured to overlap with the first wiring board in a direction orthogonal to the main surface, an electronic component disposed between the first wiring board and the second wiring board, and a connecting unit configured to interconnect the first wiring board and the second wiring board. The connecting unit includes a first wiring member configured to overlap with the first wiring board in the direction orthogonal to the main surface and not overlap with the electronic component in the direction orthogonal to the main surface, a second wiring member configured to overlap with the second wiring board and the first wiring member in the direction orthogonal to the main surface and not overlap with the electronic component in the direction orthogonal to the main surface, and a conductive bonding member configured to bond the first wiring member and the second wiring member to each other. At least one of the first wiring member and the second wiring member does not continuously surround a space between the first wiring board and the second wiring board.
According to a third aspect of the present disclosure, a module includes a first wiring board having a main surface, a second wiring board disposed at an interval from the first wiring board and configured to overlap with the first wiring board in a direction orthogonal to the main surface, an electronic component disposed between the first wiring board and the second wiring board, and a connecting unit configured to interconnect the first wiring board and the second wiring board. The connecting unit includes a first wiring member configured to overlap with the first wiring board in the direction orthogonal to the main surface and not overlap with the electronic component in the direction orthogonal to the main surface, a second wiring member configured to overlap with the second wiring board and the first wiring member in the direction orthogonal to the main surface and not overlap with the electronic component in the direction orthogonal to the main surface, and a conductive bonding member configured to bond the first wiring member and the second wiring member to each other. One of the first wiring member and the second wiring member has a region that does not overlap with another of the first wiring member and the second wiring member in the direction orthogonal to the main surface of the first wiring board, the region intersects with the direction, and a driven component is mounted on the region.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
Exemplary embodiments of the present disclosure will be described in detail below with reference to drawings.
The module 100 is an example of an electronic module, and has a three-dimensional mounting structure. The module 100 includes a wiring board 101 serving as an example of a first wiring board, a wiring board 201 serving as an example of a second wiring board, and a plurality of connecting units 300. As a result of the wiring boards 101 and 201 being laminated via the plurality of connecting units 300, the size of the module 100 can be reduced. In the first embodiment, the plurality of connecting units 300 are two connecting units 3001 and 3002. The connecting unit 3001 is an example of a first connecting unit. The connecting unit 3002 is an example of a second connecting unit.
The wiring boards 101 and 201 are arranged at an interval in a Z direction serving as a lamination direction. The plurality of connecting units 300 are disposed between the wiring boards 101 and 201. That is, in the Z direction, the plurality of connecting units 300 are each disposed at a position overlapping with the wiring boards 101 and 201. The interval between the wiring boards 101 and 201 can be, for example, equal to or larger than 0.5 mm, or equal to or larger than 1.0 mm. In addition, the interval between the wiring boards 101 and 201 can be, for example, equal to or smaller than 10 mm, or equal to or smaller than 5 mm.
The plurality of connecting units 300 each electrically and mechanically interconnect the wiring boards 101 and 201. The plurality of connecting units 300 electrically interconnect, for example, a power supply line, a grounding line, and a signal line of the wiring board 101 and a power supply line, a grounding line, and a signal line of the wiring board 201.
In addition, the module 100 includes electronic components 102, 221, and 222. The electronic component 102 is disposed between the wiring boards 101 and 201. The electronic component 102 is an example of a first electronic component, and the electronic components 221 and 222 are each an example of a second electronic component. The electronic components 102, 211, and 222 are each a semiconductor device, that is, an integrated circuit component such as a semiconductor package. The electronic components 102, 211, and 222 are each an electronic component that is mounted on the surface such as a ball grid array (BGA) or a land grid array (LGA). In the first embodiment, the electronic component 102 is mounted on the wiring board 101, and the electronic components 221 and 222 are mounted on the wiring board 201.
The wiring boards 101 and 201 are each a printed wiring board. In addition, the wiring boards 101 and 201 are each a rigid wiring board. The wiring board 101 has two main surfaces 111 and 112. The wiring board 201 has two main surfaces 211 and 212.
In the Z direction, at least part of the wiring board 201 overlaps with the wiring board 101. That is, in the Z direction, at least part of the main surface 211 of the wiring board 201 faces the main surface 111 of the wiring board 101. In the first embodiment, the entirety of the wiring board 201 overlaps with the wiring board 101 in the Z direction.
Here, “A” facing “B” includes “A” directly facing “B” and “A” facing “B” with a different member therebetween, the different member including neither a member including “A” nor a member including “B”. In addition, “A” directly facing “B” includes “A” facing “B” with a space therebetween. In the example of
The main surface 112 of the wiring board 101 is a main surface on the opposite side to the main surface 111. The main surface 212 of the wiring board 201 is a main surface on the opposite side to the main surface 211. In the first embodiment, the main surface 111 is an example of a first main surface, the main surface 211 is an example of a second main surface, and the main surface 212 is an example of a third main surface.
The Z direction is a direction orthogonal to the main surface 111, that is, an out-of-plane direction of the main surface 111. In other words, the Z direction is a normal direction of the main surface 111. Directions orthogonal to the Z direction will be referred to as an X direction and a Y direction. The X direction and the Y direction are orthogonal to each other. The X direction and the Y direction are directions parallel to the main surface 111, that is, in-plane directions of the main surface 111.
To be noted, in the first embodiment, the main surfaces 112, 211, and 212 are substantially parallel to the main surface 111. In addition, the main surface 111 is a substantially flat surface. The main surface 111 may have small unevenness and distortion.
The electronic component 102 is disposed between the main surface 111 of the wiring board 101 and the main surface 211 of the wiring board 201. In the first embodiment, the electronic component 102 is mounted on the main surface 111 of the wiring board 101. The electronic components 221 and 222 are mounted on the main surface 212 of the wiring board 201.
The connecting units 300 are disposed between the main surface 111 of the wiring board 101 and the main surface 211 of the wiring board 201 such that the interval between the wiring boards 101 and 201 is such a value that the the electronic component 102 does not interfere (come into contact) with the wiring board 201. That is, the connecting units 300 electronically and mechanically interconnect the main surface 111 of the wiring board 101 and the main surface 211 of the wiring board 201, and also play a role as a spacer. The height of the connecting units 300 in the Z direction is larger than the height of the electronic component 102 in the Z direction.
The connecting units 300 are disposed at positions not overlapping with the electronic component 102 in the Z direction. In the first embodiment, the connecting units 3001 and 3002 are apart from the electronic component 102 in the X direction.
The electronic component 102 approximately has a quadrangular shape as viewed in the Z direction, and has four side surfaces 121, 122, 123, and 124. The side surface 122 is a side surface on the opposite side to the side surface 121, and the side surface 124 is a side surface on the opposite side to the side surface 123. In the first embodiment, the side surfaces 121 and 122 are parallel to each other, and the side surfaces 123 and 124 are parallel to each other. The side surfaces 121 and 122 are each a side surface intersecting with the side surfaces 123 and 124. The side surface 121 is an example of a first side surface, and the side surface 122 is an example of a second side surface. The side surface 123 is an example of a third side surface, and the side surface 124 is an example of a fourth side surface.
The connecting unit 3001 is disposed to face the side surface 121 of the electronic component 102 in the X direction. The connecting unit 3002 is disposed to face the side surface 122 of the electronic component 102 in the X direction. In the first embodiment, at least part of the connecting unit 3001 faces the side surface 121 of the electronic component 102 in the X direction. In addition, at least part of the connecting unit 3002 faces the side surface 122 of the electronic component 102 in the X direction.
Comparative Examples 1 and 2 will be described below.
The module 100X includes a wiring board 101X, a wiring board 201X, and electronic components 102, 221, and 222. The electronic component 102 is mounted on the wiring board 101X, and the electronic components 221 and 222 are mounted on the wiring board 201X. The module 100X includes a plurality of connecting units 300X. The configuration of the connecting units 300X is different from the configuration of the connecting units 300.
The module 100Y includes a wiring board 101Y, a wiring board 201Y, and electronic components 102, 221, and 222. The electronic component 102 is mounted on the wiring board 101Y, and the electronic components 221 and 222 are mounted on the wiring board 201Y. The module 100Y includes a plurality of connecting units 300Y. The configuration of the connecting units 300Y is different from the configurations of the connecting units 300 and 300X.
The connecting unit 300X of the module 100X of Comparative Example 1 includes a wiring member 301X. The wiring member 301X is a rigid wiring board. The wiring member 301X includes an insulating substrate 310X and conductive members 320X. The insulating substrate 310X has through holes 311X extending in the Z direction, and the conductive members 320X each include a solid or hollow columnar portion provided in corresponding one of the through holes 311X and a pair of pads disposed on the two sides of the columnar portion in the Z direction. That is, the wiring member 301X is a two-layer printed wiring board that is easy to manufacture. The insulating substrate 310X is formed from an insulating member, for example, FR-4. In the pair of pads of the conductive member 320X, one pad is bonded to a pad of the wiring board 101X via solder, and the other pad is bonded to a pad of the wiring board 201X via solder.
The electronic component 102 is a component that generates heat in response to power supply thereto. Accompanied by the improvement in the functionality and performance of the electronic component 102, there is an increasing tendency in the amount of power consumption of the electronic component 102, and there is an increasing tendency in the amount of heat generation in the electronic component 102. If the interval between the electronic component 102 and the wiring board 201X is small, the heat dissipation efficiency of the electronic component 102 is low, and therefore the processing speed of the electronic component 102 needs to be lowered such that the temperature of the electronic component 102 does not exceed a prescribed temperature.
Therefore, to improve the processing speed of the electronic component 102, that is, to improve the heat dissipation efficiency, increasing the interval between the electronic component 102 and the wiring board 201Y by, as in the module 100Y of Comparative Example 2, setting the height of the connecting unit 300Y in the Z direction to be larger than the height of the connecting unit 300X in the Z direction can be considered.
The connecting unit 300Y includes a wiring member 301Y longer than the wiring member 301X in the Z direction. The wiring member 301Y is a rigid wiring board. The wiring member 301Y includes an insulating substrate 310Y and conductive members 320Y. The insulating substrate 310Y has through holes 311Y extending in the Z direction, and the conductive members 320Y each include a solid or hollow columnar portion provided in corresponding one of the through holes 311Y and a pair of pads disposed on the two sides of the columnar portion in the Z direction. That is, the wiring member 301Y is a two-layer printed wiring board that is easy to manufacture. The insulating substrate 310Y is formed from an insulating member, for example, FR-4. In the pair of pads of the conductive member 320Y, one pad is bonded to a pad of the wiring board 101Y via solder, and the other pad is bonded to a pad of the wiring board 201Y via solder.
As described above, by setting the height of the wiring member 301Y in the Z direction to be larger than the height of the wiring member 301X in the Z direction, the interval between the wiring board 201Y and the electronic component 102 can be increased. However, by setting the height of the wiring member 301Y in the Z direction to be larger than the height of the wiring member 301X in the Z direction, the wiring member 301Y becomes large in the X direction and the Y direction, and as a result, the module 100Y becomes large and the electronic device including the module 100Y also becomes large.
Here, a manufacturing method for the wiring member 301X will be described. First, an insulating parent material is prepared, and the insulating substrate 310X is manufactured by boring the through holes 311X in the insulating parent material by using a drill. Next, the conductive members 320X are formed in the through holes 311X of the insulating substrate 310X by using metal plating, metal paste, or the like. The wiring member 301X is manufactured in this manner. Next, by bonding the wiring member 301X to the wiring boards 101X and 201X by soldering, the module 100X is manufactured. Since the wiring member 301X is a two-layer printed wiring board, the wiring member 301X can be manufactured in a simple process, and the wiring member 301X can be manufactured at a low cost.
A case of manufacturing a wiring member of Comparative Example 3 different from Comparative Examples 1 and 2 that is taller in the Z direction than the wiring member 301X will be described. An end surface of the wiring member of Comparative Example 3 in the Z direction is set to have the same area as an end surface of the wiring member 301X in the Z direction.
If it is attempted to bore a through hole having the same diameter as Comparative Example 1 in the insulating parent material to manufacture the wiring member of Comparative Example 3, since the insulating parent material is taller, the hole boring length of the drill is larger, and as a result, the drill is more likely to be broken or deformed, which shortens the lifetime of the drill. Therefore, increasing the diameter of the through hole 311Y as in Comparative Example 2 can be considered as a measure for this. In the case of boring a plurality of through holes 311Y in the insulating parent material, the distance between the plurality of through holes 311Y also needs to be increased. As a result, the area of an end surface of the wiring member 301Y in the Z direction becomes larger than the area of an end surface of the wiring member 301X in the Z direction. Since the area of the end surface of the wiring member 301Y is increased, the wiring boards 101Y and 201Y also increase in size, the module 100Y also increases in size, and the electronic device including the module 100Y also increases in size.
The connecting units 300 of the first embodiment have different configurations than the connecting units 300X and 300Y of Comparative Examples 1 and 2. To be noted, the configuration of the connecting unit 3001 is the same as the configuration of the connecting unit 3002, and the configuration of only one of the connecting units 300 will be described below.
The plurality of wiring members are the two wiring members 3011 and 3012 in the first embodiment. The wiring member 3011 is an example of a first wiring member, and the wiring member 3012 is an example of a second wiring member. In the Z direction, the wiring members 3011 and 3012 do not overlap with the electronic component 102. In the Z direction, at least part of the wiring member 3011 overlaps with the wiring boards 101 and 201. In the first embodiment, the entirety of the wiring member 3011 overlaps with the wiring boards 101 and 201. In addition, in the Z direction, at least part of the wiring member 3012 overlaps with the wiring boards 101 and 201. In the first embodiment, the entirety of the wiring member 3012 overlaps with the wiring boards 101 and 201. In the Z direction, at least part of the wiring member 3011 overlaps with the wiring member 3012. In the first embodiment, the entirety of the wiring member 3011 overlaps with the wiring member 3012. In addition, in the Z direction, at least part of the wiring member 3012 overlaps with the wiring member 3011. In the first embodiment, the entirety of the wiring member 3012 overlaps with the wiring member 3011.
In addition, the connecting unit 300 includes a plurality of bonding members 350 bonding the wiring member 3011 and the wiring member 3012 to each other, a plurality of bonding members 351 bonding the wiring member 3011 to the wiring board 101, and a plurality of bonding members 352 bonding the wiring member 3012 to the wiring board 201. The bonding members 350 to 352 are members serving as part of the wiring electrically and mechanically interconnecting the wiring boards 101 and 201. The bonding members 350 to 352 are each, for example, a conductive member including solder. The solder is preferably solder of Sn—Ag—Cu or solder of Sn—Bi. That is, the wiring member 3011 and the wiring member 3012 are soldered to each other, the wiring member 3011 and the wiring board 101 are soldered to each other, and the wiring member 3012 and the wiring board 201 are soldered to each other. That is, the bonding via the bonding members 350 to 352 is typically soldering. The distance between the wiring member 3011 and the wiring member 3012 can be equal to or smaller than 1.0 mm, or equal to or smaller than 0.5 mm. In addition, the distance between the wiring member 3011 and the wiring member 3012 can be equal to or larger than 0.01 mm, or equal to or larger than 0.05 mm. Similarly, the distance between the wiring member 3011 and the wiring board 101 and the distance between the wiring member 3012 and the wiring board 201 each can be equal to or smaller than 1.0 mm, or equal to or smaller than 0.5 mm. In addition, the distance between the wiring member 3011 and the wiring board 101 and the distance between the wiring member 3012 and the wiring board 201 each can be equal to or larger than 0.01 mm, or equal to or larger than 0.05 mm.
To be noted, although the bonding members 350, 351, and 352 preferably include solder, the configuration is not limited to this. For example, the bonding members 350, 351, and 352 may include an inorganic material such as copper, silver, gold, or aluminum, or may include an organic material such as conductive rubber. In addition, the bonding members 350, 351, and 352 each may be, for example, a cured product of an organic conductive adhesive. In addition, the bonding members 350, 351, and 352 each may be an anisotropic conductive film (ACF).
The wiring member 3011 includes an insulating substrate 3101 and a plurality of conductive members 3201 provided on the insulating substrate 3101. The insulating substrate 3101 is a substrate having a rectangular parallelepiped shape having through holes 3111 of the same number as the conductive members 3201. The plurality of through holes 3111 each extend from a first end to a second end of the insulating substrate 3101 in the Z direction. The insulating substrate 3101 is an example of a first insulating substrate. The insulating substrate 3101 is constituted by an insulating member. For example, the insulating substrate 3101 is preferably a member based on resin such as FR-4, but may be based on an inorganic material such as ceramics.
The through holes 3111 are each an example of a first through hole. The through holes 3111 each have a columnar shape extending from the first end to the second end of the insulating substrate 3101 in the Z direction. The through holes 3111 may be each bored by using, for example, a laser, but is preferably bored by using a drill similarly to Comparative Example 1 described above from the viewpoint of easy manufacture.
The conductive members 3201 are respectively provided in the through holes 3111. The conductive members 3201 are each an example of a first conductive member. The conductive members 3201 are each a metal member. The material of the metal member is not limited, but is preferably, for example, copper, silver, gold, aluminum, or the like. The manufacturing method of each conductive member 3201 is not limited, and possible examples thereof include a method of plating the insulating substrate 3101 with metal, and a method of supplying a metal paste to the insulating substrate 3101 and curing the metal paste.
The wiring member 3012 includes an insulating substrate 3102 and a plurality of conductive members 3202 provided on the insulating substrate 3102. The insulating substrate 3102 is a substrate having a rectangular parallelepiped shape having through holes 3112 of the same number as the conductive members 3202. The plurality of through holes 3112 each extend from a first end to a second end of the insulating substrate 3102 in the Z direction. The insulating substrate 3102 is an example of a second insulating substrate. The insulating substrate 3102 is constituted by an insulating member. For example, the insulating substrate 3102 is preferably a member based on resin such as FR-4, but may be based on an inorganic material such as ceramics.
The through holes 3112 are each an example of a second through hole. The through holes 3112 each have a columnar shape extending from the first end to the second end of the insulating substrate 3102 in the Z direction. The through holes 3112 may be each bored by using, for example, a laser, but is preferably bored by using a drill similarly to Comparative Example 1 described above from the viewpoint of easy manufacture.
The conductive members 3202 are respectively provided in the through holes 3112. The conductive members 3202 are each an example of a second conductive member. The conductive members 3202 are each a metal member. The material of the metal member is not limited, but is preferably, for example, copper, silver, gold, aluminum, or the like. The manufacturing method of each conductive member 3202 is not limited, and possible examples thereof include a method of plating the insulating substrate 3102 with metal, and a method of supplying a metal paste to the insulating substrate 3102 and curing the metal paste.
In the first embodiment, the configuration of the wiring member 3012 is similar to the configuration of the wiring member 3011. In the description below, description will be given focusing on one conductive member 3201, one through hole 3111, one conductive member 3202, and one through hole 3112 corresponding to each other.
At least part of the conductive member 3201 is provided in the through hole 3111. In the first embodiment, the conductive member 3201 includes a solid or hollow columnar portion 3301 provided in the through hole 3111, a pad 3311 provided at a first end of the columnar portion 3301 in the Z direction, and a pad 3321 provided at a second end of the columnar portion 3301 in the Z direction.
In the case where the columnar portion 3301 is a hollow columnar portion in which conductor is not provided inside, the inside of the conductive member 3201 may be empty, or the inside of the columnar portion 3301 may be filled with an insulator such as resin. In addition, the hollow or solid columnar portion 3301 may include, for example, an outer conductor obtained by plating the insulating substrate 3101 with copper, and an inner conductor such as solder disposed inside the outer conductor.
At least part of the conductive member 3202 is provided in the through hole 3112. In the first embodiment, the conductive member 3202 includes a solid or hollow columnar portion 3302 provided in the through hole 3112, a pad 3312 provided at a first end of the columnar portion 3302 in the Z direction, and a pad 3322 provided at a second end of the columnar portion 3302 in the Z direction.
In the case where the columnar portion 3302 is a hollow columnar portion in which conductor is not provided inside, the inside of the columnar portion 3302 may be empty, or the inside of the conductive member 3202 may be filled with insulator such as resin. In addition, the hollow or solid columnar portion 3302 may include, for example, an outer conductor obtained by plating the insulating substrate 3102 with copper, and an inner conductor such as solder disposed inside the outer conductor.
The pad 3311 of the wiring member 3011 and the pad 3312 of the wiring member 3012 are bonded to each other via a corresponding bonding member 350 among the plurality of bonding members 350.
Here, the wiring board 101 includes, on the main surface 111, a plurality of pads 110 of the same number as the plurality of pads 3321 of the wiring member 3011. The wiring board 201 includes, on the main surface 211, a plurality of pads 210 of the same number as the plurality of pads 3322 of the wiring member 3012.
The plurality of pads 110 of the wiring board 101 are each bonded to a corresponding pad 3321 among the plurality of pads 3321 of the wiring member 3011 via a corresponding bonding member 351 among the plurality of bonding members 351.
The plurality of pads 210 of the wiring board 201 are each bonded to a corresponding pad 3322 among the plurality of pads 3322 of the wiring member 3012 via a corresponding bonding member 352 among the plurality of bonding members 352.
As a result of the connecting unit 300 configured as described above, the pads 210 of the wiring board 201 are electrically connected to the pads 110 of the wiring board 101 via the bonding members 352, the conductive members 3202 of the wiring member 3012, the bonding members 350, the conductive members 3201 of the wiring member 3011, and the bonding members 351.
Here, as illustrated in
The wiring board 101 is disposed on one side with respect to the virtual plane V1, and the wiring board 201 is disposed on the other side that is opposite to the one side with respect to the virtual plane V1. In the Z direction, at least part of the wiring board 201 overlaps with the wiring board 101. In the first embodiment, the entirety of the wiring board 201 overlaps with the wiring board 101. The wiring members 3011 are disposed on the wiring board 101 side with respect to the virtual plane V1 in the Z direction, that is, between the wiring board 101 and the virtual plane V1. The wiring members 3012 are disposed on the wiring board 201 side with respect to the virtual plane V1 in the Z direction, that is, between the wiring board 201 and the virtual plane V1. The wiring members 3011 and the wiring members 3012 are electrically and mechanically connected to each other via the plurality of bonding members 350 arranged at intervals in the X direction and the Y direction.
An open space S0 is defined between the wiring boards 101 and 201 by the wiring boards 101 and 201. As viewed in the Z direction, when the outer shape of the wiring board 201 is defined as an outline, the space S0 is an inner space that is inside the outline as viewed in the Z direction and that is interposed between the plurality of connecting units 300.
The space S0 includes a space S1 and a space S2. The space S1 is an example of a first space, and the space S2 is an example of a second space. The space S1 is a space continuous from the main surface 111 of the wiring board 101 to the virtual plane V1. The space S2 is a space continuous from the main surface 211 of the wiring board 201 to the virtual plane V1.
In the space between the wiring boards 101 and 201, the spaces S1 and S2 are continuous with each other at the virtual plane V1. That is, the continuous spaces S1 and S2 constitute an open space. The spaces S1 and S2 may be any of vacuum spaces, pressure-reduced spaces, spaces in which a fluid is present, and spaces in which the same medium is present. Examples of the fluid include gas and/or liquid. In the case where a member including a mounted component mounted on the wiring board 101 or the wiring board 201 is present between the wiring boards 101 and 201, the spaces S1 and S2 are a space excluding members between the wiring boards 101 and 201. A flow path for a fluid such as air including the continuous spaces S1 and S2 may be formed between the wiring boards 101 and 201. As a result of the fluid in the flow path including the spaces S1 and S2 coming into contact with the electronic component 102 mounted on the wiring board 101, the heat dissipation of the electronic component 102 can be efficiently performed.
In the first embodiment, the insulating substrate 3101 is manufactured by boring the through holes 3111 in the insulating parent material by using a drill. Then, by forming the conductive members 3201 in the through holes 3111, the wiring member 3011 is manufactured. The wiring member 3012 is also manufactured by a manufacturing method similar to that of the wiring member 3011. As described above, each of the wiring members 3011 and 3012 is a two-layer printed wiring board, and since these are manufactured through a simple process, the wiring members 3011 and 3012 can be manufactured at a low cost.
In addition, since the connecting unit 300 includes a plurality of wiring members, that is, the two wiring members 3011 and 3012 in the first embodiment, the interval between the wiring boards 101 and 201 in the Z direction can be adjusted by the two wiring members 3011 and 3012. Typically, the interval in the Z direction between the wiring boards 101 and 201, that is, the interval in the Z direction between the electronic component 102 and the wiring board 201 is increased. In other words, the volume of a space A1 between the electronic component 102 and the wiring board 201 is increased. As a result, the heat dissipation efficiency of the electronic component 102 is improved. Since the space A1 is expanded, temperature rise in the space A1 can be suppressed. As described above, the module 100 advantageous for improving the structure between the two wiring boards 101 and 201 can be provided.
In addition, although this increases the height of the connecting unit 300 in the Z direction, the height of each of the wiring members 3011 and 3012 in the Z direction can be set to be equal to or smaller than a half of the height of the connecting unit 300. Since the height of the insulating parent material in the Z direction can be set to be small when manufacturing the wiring member 3011, the through holes 3111 can be easily bored in the insulating parent material with a thin drill. In addition, the pitch between the plurality of through holes 3111 does not need to be increased as in Comparative Example 2. Therefore, in the wiring member 3011, the plurality of through holes 3111 are arranged at a small pitch, and the bored through holes 3111 are all thin, that is, the columnar portions 3301 of the conductive members 3201 are formed to be thin, and therefore the area of the end surface of the wiring member 3011 in the Z direction is small, and thus the wiring member 3011 is miniaturized. The wiring member 3012 is also miniaturized similarly to the wiring member 3011. Since the connecting unit 300 is miniaturized, the module 100 is miniaturized. Further, the electronic device incorporating the module 100 is also miniaturized.
In addition, since the wiring members 3011 and 3012 arranged at an interval in the Z direction are bonded to each other via the plurality of bonding members 350 arranged at intervals in the X direction or the Y direction, a flow of air is generated between the space S0 between the wiring boards 101 and 201 and a space outside the space S0 via the gaps between the plurality of bonding members 350, and thus the heat dissipation efficiency of the electronic component 102 is further improved.
The configuration of the wiring member 3012 may be the same as the configuration of the wiring member 3011, and the dimensions of the wiring member 3012 may be the same as the dimensions of the wiring member 3011. The wiring member 3011 will be described below. In
That is, both sides of the electronic component 102 in the X direction respectively face the connecting units 3001 and 3002. That is, the side surface 121 of the electronic component 102 faces the connecting unit 3001 in the X direction, and the side surface 122 of the electronic component 102 faces the connecting unit 3002 in the X direction. Further, the gap between the plurality of bonding members 350, the gap between the plurality of bonding members 351, and the gap between the plurality of bonding members 352 can function as a flow path for a fluid such as air.
Further, at least one of the wiring members 3011 and the wiring members 3012, both in the first embodiment, do not continuously surround the space S0 (spaces S1 and S2). In the example of
To be noted, although description has been given above on the premise that the module 100 includes the plurality of connecting units 300, this can be also referred to as a case where the module 100 includes one connecting unit 300 and the connecting unit 300 includes a plurality of wiring members 3011 and a plurality of wiring members 3012. In the description with reference to
At least one of the following conditions (i) and (ii) is preferably satisfied.
The space S3 is an example of a third space. The space S4 is an example of a fourth space. In the example of
As descried above, according to the configuration illustrated in
To be noted, one of the wiring members 3011 and the wiring members 3012 in the connecting unit 300 may be configured to continuously surround the space S0. For example, one of the wiring members 3011 and the wiring members 3012 in the connecting unit 300 may be a wiring member having a frame shape.
Next, as illustrated in
The number of lines in the connecting unit 300 is determined in accordance with the components mounted on the wiring board 201. In the case where a large number of lines are needed, it is preferable that lines included in each of the wiring members 3011 and 3012, that is, the columnar portions 3301 and 3302 of the conductive members 3201 and 3202 are made to be as thin as possible so as to make the area of the main surface of each of the wiring boards 101 and 201 smaller.
In the first embodiment, the height of the wiring member 3011 in the Z direction is smaller than the height of the electronic component 102 in the Z direction. That is, the dimension H1 of the wiring member 3011 in the height direction is smaller than the dimension H0 of the electronic component 102 in the height direction. In addition, the height of the wiring member 3012 in the Z direction is smaller than the height of the electronic component 102 in the Z direction. That is, the dimension H2 of the wiring member 3012 in the height direction is smaller than the dimension H0 of the electronic component 102 in the height direction.
That is, by making the wiring members 3011 and 3012 thinner than the electronic component 102, the lines in the wiring members 3011 and 3012 can be made thinner, and thus the lines can be highly densely arranged in the wiring members 3011 and 3012. Therefore, the dimensions of the wiring members 3011 and 3012 in the lengthwise direction and the width direction can be reduced. Further, by laminating the wiring members thinner than the electronic component 102 into a plurality of layers, the distance between the two wiring boards 101 and 201 can be adjusted. As a result of this, for example, the number of layers of the wiring members can be adjusted in accordance with the height of the electronic component 102 in the Z direction, and therefore the module 100 can be miniaturized. In addition, the interval between the electronic component 102 and the wiring board 101 can be increased, and thus the heat dissipation efficiency of the electronic component 102 can be improved.
To be noted, although a case where the heat of the electronic component 102 is dissipated by natural convection has been described in the first embodiment, the configuration is not limited to this, and an unillustrated fan may be disposed. The heat of the electronic component 102 may be dissipated by forced convection caused by the fan.
Example 1 corresponding to the first embodiment will be described. In Example 1, the module 100 was manufactured by using the wiring members 3011 and 3012. The configuration of the wiring member 3012 was the same as the configuration of the wiring member 3011, and the dimensions of the wiring member 3012 were also the same as the dimensions of the wiring member 3011. The wiring member 3011 will be described below.
First, the wiring member 3011 was prepared. The dimension of the insulating substrate 3101 of the wiring member 3011 in the lengthwise direction was set to 20.00 mm. The dimension of the insulating substrate 3101 in the width direction was set to 3.00 mm. The dimension of the insulating substrate 3101 in the height direction was set to 0.60 mm. The diameter of the through hole 3111 of the insulating substrate 3101 was set to 0.15 mm. The diameter of the pads 3311 and 3321 was set to 0.325 mm. The pitch of the through holes 3111, that is, the pitch of the conductive members 3201 was set to 0.40 mm. The number of the through holes 3111, that is, the number of the conductive members 3201 was set to 272. As the wiring member 3012, the same thing as the wiring member 3011 was prepared.
To bond the wiring member 3011 to the wiring member 3012, solder balls of φ250 μm were used. The pads 3311 of the wiring member 3011 and the pads 3312 of the wiring member 3012 were bonded via solder by reflow. The interval between the pads 3311 and 3312 bonded to each other via the bonding members 350 that were solder was about 0.2 mm. That is, the interval between the wiring member 3011 and the wiring member 3012 was about 0.2 mm.
Next, solder paste was applied, by printing, on the pads 210 of the wiring board 201 on which the electronic components 221 and 222 were mounted, thus a laminate structure obtained by laminating the wiring member 3012 on the wiring member 3011 was mounted on the wiring board 201. The wiring board 201 on which the laminate structure was mounted was conveyed to a reflow furnace, and the pads 210 of the wiring board 201 and the pads 3322 of the wiring member 3012 were bonded to each other via solder by reflow.
Then, solder paste was applied, by printing, on the pads 110 of the wiring board 101 on which the electronic component 102 was mounted, thus a structure formed from the above-described laminate structure and the wiring board 201 was mounted on the wiring board 101. The wiring board 101 on which the structure was mounted was conveyed to a reflow furnace, and the pads 110 of the wiring board 101 and the pads 3321 of the wiring member 3011 were bonded to each other via solder by reflow. As a result of this, the module 100 of Example 1 was obtained.
The interval between the wiring boards 101 and 201 in the module 100 was about 1.5 mm. The height of the electronic component 102 was about 0.9 mm, and the interval between the electronic component 102 and the wiring board 201 was about 0.6 mm.
As described above, since the interval between the electronic component 102 and the wiring board 201, that is, the volume of the space A1 is set to be larger by an amount corresponding to the height of the wiring member 3012, and therefore the heat dissipation efficiency of the electronic component 102 is improved.
A first modification example, a second modification example, and a third modification example will be described as modification examples of the first embodiment.
The electronic component 102 illustrated in
The connecting unit 300C includes a plurality of wiring members arranged in the Z direction. The wiring members are each a wiring board. Each wiring member is preferably a rigid wiring board. In addition, each wiring member is preferably a two-layer printed wiring board that is easy to manufacture.
The plurality of wiring members are two wiring members 301C1 and 301C2 in the third modification example. The wiring member 301C1 is an example of a first wiring member, and the wiring member 301C2 is an example of a second wiring member. In the Z direction, at least part of the wiring member 301C2 overlaps with the wiring member 301C1.
In addition, the connecting unit 300C includes a plurality of bonding members 350C bonding the wiring member 301C1 and the wiring member 301C2 to each other, a plurality of bonding members 351C bonding the wiring member 301C1 to the wiring board 101, and a plurality of bonding members 352C bonding the wiring member 301C2 to the wiring board 201.
The bonding members 350C to 352C are members serving as part of the wiring electrically and mechanically interconnecting the wiring boards 101 and 201. The bonding members 350C to 352C are each, for example, a conductive member including solder. The solder is preferably solder of Sn—Ag—Cu or solder of Sn—Bi.
To be noted, although the bonding members 350C, 351C, and 352C preferably include solder, the configuration is not limited to this. For example, the bonding members 350C, 351C, and 352C may include an inorganic material such as copper, silver, gold, or aluminum, or may may include an organic material such as conductive rubber. In addition, the bonding members 350C, 351C, and 352C each may be, for example, a cured product of an organic conductive adhesive. In addition, the bonding members 350C, 351C, and 352C each may be an ACF.
The wiring member 301C1 includes an insulating substrate 310C1 and a plurality of conductive members 320C1 provided on the insulating substrate 310C1. The insulating substrate 310C1 is a substrate having a rectangular parallelepiped shape. The insulating substrate 310C1 is an example of a first insulating substrate. The insulating substrate 310C1 is constituted by an insulating member. For example, the insulating substrate 310C1 is preferably a member based on resin such as FR-4, but may be a member based on an inorganic material such as ceramics.
The conductive members 320C1 are each an example of a first conductive member. The conductive members 320C1 are each a metal member. The material of the metal member is not limited, but is preferably, for example, copper, silver, gold, aluminum, or the like. The manufacturing method of each conductive member 320C1 is not limited, and possible examples thereof include a method of plating the insulating substrate 310C1 with metal, a method of supplying a metal paste to the insulating substrate 310C1 and curing the metal paste, and a method of compression-bonding a metal foil.
The wiring member 301C2 includes an insulating substrate 310C2 and a plurality of conductive members 320C2 provided on the insulating substrate 310C2. The insulating substrate 310C2 is a substrate having a rectangular parallelepiped shape. The insulating substrate 310C2 is an example of a second insulating substrate. The insulating substrate 310C2 is constituted by an insulating member. For example, the insulating substrate 310C2 is preferably a member based on resin such as FR-4, but may be a member based on an inorganic material such as ceramics.
The conductive members 320C2 are each an example of a second conductive member. The conductive members 320C2 are each a metal member. The material of the metal member is not limited, but is preferably, for example, copper, silver, gold, aluminum, or the like. The manufacturing method of each conductive member 320C2 is not limited, and possible examples thereof include a method of plating the insulating substrate 310C2 with metal, a method of supplying a metal paste to the insulating substrate 310C2 and curing the metal paste, and a method of compression-bonding a metal foil.
In the third modification example, the configuration of the wiring member 301C2 is substantially the same as the configuration of the wiring member 301C1. The wiring member 301C1 will be described in detail.
The insulating substrate 310C1 has two side surfaces 311C and 312C formed at an interval in the X direction serving as a width direction. Among the plurality of conductive members 320C1, two or more conductive members 320C1 are provided on the side surface 311C of the insulating substrate 310C1 at an interval from each other in the Y direction. Among the plurality of conductive members 320C1, other two or more conductive members 320C1 are provided on the side surface 312C of the insulating substrate 310C1 at an interval from each other in the Y direction. In the third modification example, the conductive members 320C1 are each provided to extend from a first end to a second end in the Z direction serving as the height direction of the insulating substrate 310C1.
The connection relationship of each member in the connecting unit 300C will be described. Description will be given below focusing on one conductive member 320C1, one conductive member 320C2, one bonding member 350C, one bonding member 351C, one bonding member 352C, one pad 110, and one pad 210 corresponding to each other. As illustrated in
According to the connecting unit 300C of the configuration described above, the pad 210 of the wiring board 201 is electrically connected to the pad 110 of the wiring board 101 via the bonding member 352C, the conductive member 320C2 of the wiring member 301C2, the bonding member 350C, the conductive member 320C1 of the wiring member 301C1, and the bonding member 351C. As described above, the connecting unit 300C may be disposed between the wiring boards 101 and 201 instead of the connecting unit 300.
In addition, although the illustration thereof is omitted, the electronic component 102 may be mounted on the main surface 112 of the wiring board 101. There is a case where the heat generated in the electronic component 102 is conducted to the wiring board 101 and is dissipated to the space S0 between the wiring boards 101 and 201 from the wiring board 101. Since the interval between the two wiring boards 101 and 201 is increased by the connecting unit 300 or 300C, the influence of the heat dissipated to the space S0 can be reduced. Therefore, a module advantageous for improvement of the structure between the two wiring boards 101 and 201 can be provided.
In addition, although the illustration thereof is omitted, in the connecting unit 300, the wiring member 3012 may be displaced in a direction parallel to the main surface 111 with respect to the wiring member 3011. In this case, in a direction orthogonal to the main surface 111, part of the wiring member 3012 may overlap with part of the wiring member 3011. The wiring member 3012 may have a part that overlaps with the wiring board 201 and a part that does not overlap with the wiring board 201 (part projecting from the wiring board 201 in plan view of the main surface 111) in the direction orthogonal to the main surface 111. The part of the wiring member 3012 overlapping with the wiring board 201 may be bonded to the wiring board 201, and the part not overlapping with the wiring board 201 of the wiring member 3012 may be bonded to the wiring member 3011. In this case, the bonding member 350 bonding the wiring member 3011 and the wiring member 3012 to each other does not have to be disposed between the wiring boards 101 and 201 in the direction orthogonal to the main surface 111.
Similarly, although the illustration thereof is omitted, in the connecting unit 300C, the wiring member 301C2 may be displaced in the direction parallel to the main surface 111 with respect to the wiring member 301C1. In this case, in the direction orthogonal to the main surface 111, part of the wiring member 301C2 may overlap with part of the wiring member 301C1.
Next, a module of a second embodiment will be described.
The module 100G is an example of an electronic module, and has a three-dimensional mounting structure. The module 100G is different from the module 100 of the first embodiment in that electronic components 400 are mounted on the connecting unit 300. The thickness T2 of the wiring board 201 in the Z direction is smaller than the thickness T1 of the wiring board 101 in the Z direction. Therefore, the stiffness of the wiring board 201 is lower than the stiffness of the wiring board 101.
In the second embodiment, the wiring member 3012 is larger than the wiring member 3011 in plan view, that is, as viewed in the Z direction. Further, in the Z direction, a part of the wiring member 3012 overlaps with the wiring member 3011, and another part of the wiring member 3012 does not overlap with the wiring member 3011. To be noted, the relationship between the dimension H0 of the electronic component 102 in the height direction, the dimension H1 of the wiring member 3011 in the height direction, and the dimension H2 of the wiring member 3012 in the height direction are as described in the first embodiment.
As described above, since the wiring board 201 is thinner than the wiring board 101, the stiffness of the wiring board 201 is lower than the stiffness of the wiring board 101. In the second embodiment, in the Z direction, the area A12 of a part surrounded by the outer shape of the wiring member 3012 is larger than the area A11 of a part surrounded by the outer shape of the wiring member 3011. Further, the number of the plurality of bonding members 352 is larger than the number of the plurality of bonding members 351. To be noted, the area A12 is equal to the area of a projection region obtained by projecting the wiring member 3012 onto the virtual plane V1, and the area A11 is equal to the area of a projection region obtained by projecting the wiring member 3011 onto the virtual plane V1.
Since heat generated in the electronic component 102 and the electronic components 221 and 222 can be conducted to the wiring board 201, the wiring board 201 having a lower stiffness than the wiring board 101 is more likely to be deformed by heat. Since the wiring board 201 having a lower stiffness than the wiring board 101 is bonded to the wiring member 3012 having the area A12 larger than the area A11 via the plurality of bonding members 352, stress generated by thermal deformation of the wiring board 201 is distributed to the plurality of bonding members 352, and thus the reliability of the bonding between the wiring board 201 and the wiring member 3012 is improved.
A surface 3422 of the wiring member 3012 on the wiring member 3011 side includes a region 3432 that does not overlap with the wiring member 3011 in the Z direction. The surface 3422, that is, the region 3432 intersects with the Z direction (at a right angle in the present embodiment). A plurality of pads 3312 not connected to the wiring member 3011 via the bonding members 350 are disposed in the region 3432. The module 100G includes electronic components 400 mounted on the region 3432 of the surface 3422. The electronic components 400 are each an example of a third electronic component. In the second embodiment, the electronic components 400 are each a capacitor serving as an example of a driven component. The electronic components 400 are each a chip component, and are surface-mounted on the region 3432. The electronic components 400 are disposed on the side opposite to the side of the spaces S1 and S2 interposed between the plurality of connecting units 300. That is, the wiring member 3012 projects more than the wiring member 3011 to the side opposite to the side of the spaces S1 and S2, and the electronic components 400 are mounted on the part of the wiring member 3012 projecting more than the wiring member 3011.
Specifically, the number of the conductive members 3202 of the wiring member 3012 is larger than the number of the conductive members 3201 of the wiring member 3011. The electronic components 400 each include two electrodes 401. The two electrodes 401 are respectively bonded to two pads 3312 of two conductive members 3202 in the region 3432 via bonding members such as solder. That is, the electronic components 400 are each electrically and mechanically connected to two conductive members 3202 in the region 3432.
One of the two conductive members 3202 in the region 3432 is part of the power supply line, and is electrically connected to power supply terminals of the electronic components 221 and 222 via the bonding members 352 and the wiring board 201. The other of the two conductive members 3202 in the region 3432 is part of the grounding line, and is electrically connected to the ground terminals of the electronic components 221 and 222 via the bonding members 352 and the wiring board 201. As a result of this, the electronic component 400 functions as a bypass capacitor for the electronic components 221 and 222. That is, the electronic component 400 is used for addressing the noises of the electronic components 221 and 222 or stabilizing the power supply.
As described above, according to the second embodiment, the wiring member 3011 and the wiring member 3012 are laminated between the wiring boards 101 and 201 so as to electrically interconnect the wiring boards 101 and 201. Therefore, the wiring members 3011 and 3012 can be respectively manufactured by using thin insulating substrates 3101 and 3102. Since through holes are bored in the insulating substrates 3101 and 3102 by using a drill of a small outer diameter, the diameter of the through holes can be set to be small to arrange the through holes at a small pitch. As a result, increase in the size of the wiring members 3011 and 3012 can be suppressed even when the number of lines in the wiring members 3011 and 3012 increases, and thus increase in the size of the module 100G can be suppressed.
In addition, since the area A12 of the wiring member 3012 as viewed in the Z direction is larger than the area A11 of the wiring member 3011 as viewed in the Z direction, the number of the bonding members 352 bonding the wiring board 201 to the wiring member 3012 can be set to be larger than the number of the bonding members 351, that is, the number of the bonding members 350. As a result of this, the reliability of the bonding between the wiring board 201 that has a low stiffness and a large thermal deformation amount and the wiring member 3012 can be improved.
In addition, the wiring member 3012 can include wiring in the region 3432 on the outside of the wiring member 3011. Therefore, the electronic components 400 such as bypass capacitors can be mounted on the region 3432, thus the noises of the electronic components 221 and 222 mounted on the wiring board 201 can be addressed, and power supply to the electronic components 221 and 222 can be stabilized.
Example 2 corresponding to the second embodiment will be described. In Example 2, the module 100G was manufactured by preparing the wiring members 3011 and 3012 and the electronic components 400. The configuration of the wiring members 3011 and 3012 and the electronic components 400 and the manufacturing method for the module 100G in Example 2 will be described below.
The dimension of the insulating substrate 3102 of the wiring member 3012 in the lengthwise direction was set to 20.00 mm. The dimension of the insulating substrate 3102 in the width direction was set to 3.60 mm. The dimension of the insulating substrate 3102 in the height direction was set to 0.60 mm. The diameter of the through holes 3112 of the insulating substrate 3102 was set to 0.15 mm. The diameter of the pads 3312 and 3322 was set to 0.325 mm. The pitch of the through holes 3112 was set to 0.40 mm in a staggered layout. The total number of the through holes 3112 per wiring member 3012 was set to 306.
The length of a diagonal line connecting two through holes in the through holes 3112 was set to 0.57 mm. Since the distance between the two pads 3312 was also 0.57 mm, the electronic component 400 that is a capacitor was mounted on the two pads 3312 by using a solder paste. The size of the electronic component 400 in plan view was a 0603 size that is a size of 0.6 mm×0.3 mm. To be noted, the description of the 0603 size conforms to the size description method (mm-based) of electronic components in Japanese Industrial Standards (JIS).
The dimension of the insulating substrate 3101 of the wiring member 3011 in the lengthwise direction was set to 20.00 mm. The dimension of the insulating substrate 3101 in the width direction was set to 3.00 mm. The dimension of the insulating substrate 3101 in the height direction was set to 0.60 mm. The diameter of the through holes 3111 of the insulating substrate 3101 was set to 0.15 mm. The diameter of the pads 3311 and 3321 was set to 0.325 mm. The pitch of the through holes 3111 was set to 0.40 mm in a staggered layout. The total number of the through holes 3111 per wiring member 3011 was set to 272.
To bond the wiring member 3011 to the wiring member 3012, solder balls of φ250 μm were used. The pads 3311 of the wiring member 3011 and the pads 3312 of the wiring member 3012 were bonded to each other via solder by reflow. The solder balls served as the bonding members 350 after bonding. The distance between the pads 3311 of the wiring member 3011 and the pads 3312 of the wiring member 3012 after the bonding was about 0.2 mm.
Next, solder paste was applied, by printing, on the pads of the wiring board 201 on which the electronic components 221 and 222 were mounted, thus a laminate structure obtained by laminating the wiring member 3012 on the wiring member 3011 was mounted on the wiring board 201. The wiring board 201 on which the laminate structure was mounted was conveyed to a reflow furnace, and the pads of the wiring board 201 and the pads 3322 of the wiring member 3012 were bonded to each other via solder by reflow.
Then, solder paste was applied, by printing, on the pads of the wiring board 101 on which the electronic component 102 was mounted, thus a structure formed from the above-described laminate structure and the wiring board 201 was mounted on the wiring board 101. The wiring board 101 on which the structure was mounted was conveyed to a reflow furnace, and the pads of the wiring board 101 and the pads 3321 of the wiring member 3011 were bonded to each other via solder by reflow. As a result of this, the module 100G of Example 2 was obtained.
As a result of laminating the wiring members 3011 and 3012, the pitch of the through holes 3111 and the pitch of the through holes 3112 were set to 0.40 mm, which was a small pitch.
In contrast, in the case where the wiring member 301Y of Comparative Example 2 illustrated in
In addition, a module in which only the pads 3322 in the wiring member 3012 were bonded to the wiring board 201 via solder and the module 100G of Example 2 were prepared, and a thermal fatigue test was repeatedly performed. In the module in which only the pads 3322 in the wiring member 3012 were bonded to the wiring board 201 via solder, breakage of the solder was recognized before the 100-th cycle, but in the module 100G of Example 2, the solder did not break even when the thermal fatigue test was repeated by 100 cycles or more. As described above, it was confirmed that the reliability of the bonding is improved in the case where the wiring member 3012 includes the pads 3322 and the pads 3322 are bonded to the wiring board 201 via solder. Therefore, by applying the module 100G of Example 2 to an electronic device, high reliability can be secured for the electronic device.
Further, since capacitors serving as the electronic components 400 are mounted on the pads 3312 of the wiring member 3012, the electronic components 400 are disposed in the vicinity of the electronic components 221 and 222, and thus the noises of the electronic components 221 and 222 can be efficiently reduced.
To be noted, although a case where the electronic components 400 are mounted on the part of the wiring member 3012 projecting to the side (outer side) opposite to the side of the spaces S1 and S2 (inner side) has been described in the second embodiment, the configuration is not limited to this. For example, the wiring member 3012 may project inward with respect to the wiring member 3011, and the electronic components 400 may be mounted on the projecting part. In addition, for example, the wiring member 3011 may project inward or outward with respect to the wiring member 3012, and the electronic components 400 may be mounted on the projecting part.
Next, a module of a third embodiment will be described.
The module 100D has a configuration in which a heat dissipation member 250 is further added to the module 100 of the first embodiment. The heat dissipation member 250 is provided on the electronic component 102. That is, since the interval between the electronic component 102 and the wiring board 201 is large, the heat dissipation member 250 can be disposed on the electronic component 102.
The heat dissipation member 250 includes, for example, a heat dissipation sheet such as a metal sheet, or a heat dissipation grease. Heat generated in the electronic component 102 is conducted to the heat dissipation member 250. The heat dissipation member 250 preferably extends to the outside from the open space between the wiring boards 101 and 201, that is, from the spaces S1 and S2 of
To be noted, although heat is dissipated from the heat dissipation member 250, that is, from the electronic component 102 by natural convection has been described in the third embodiment, the configuration is not limited to this, and an unillustrated fan may be provided. The heat of the heat dissipation member 250, that is, the heat of the electronic component 102 may be dissipated by forced convection caused by the fan. In addition, the module 100D may be modified as in the plurality of modification examples of the first embodiment described above.
Next, a module of a fourth embodiment will be described.
The module 100E has a configuration in which connecting units 3003 and 3004 are further added to the module 100 of the first embodiment. That is, the module 100E includes four connecting units 3001, 3002, 3003, and 3004 as the plurality of connecting units 300. The configuration of the connecting units 3003 and 3004 is substantially the same as the configuration of the connecting units 300 described in the first embodiment, that is, the configuration of the connecting units 3001 and 3002.
The connecting unit 3003 is an example of a third connecting unit. The connecting unit 3004 is an example of a fourth connecting unit. The connecting unit 3003 is disposed to face the side surface 123 of the electronic component 102 in the Y direction. The connecting unit 3004 is disposed to face the side surface 124 of the electronic component 102 in the Y direction. In the fourth embodiment, at least part of the connecting unit 3003 faces the side surface 123 of the electronic component 102 in the Y direction. In addition, at least part of the connecting unit 3004 faces the side surface 124 of the electronic component 102 in the Y direction.
At least one of the wiring members 3011 and the wiring members 3012, both in the fourth embodiment, do not continuously surround the space S0 (spaces S1 and S2). In the example of
In the fourth embodiment, there is a gap G1 between the connecting units 3001 and 3003, there is a gap G2 between the connecting units 3003 and 3002, there is a gap G3 between the connecting units 3002 and 3004, and there is a gap G4 between the connecting units 3001 and 3004. Further, the space S0 communicates with the outside space via the gaps G1 to G4. Here, the outside space is a space on the opposite side to the side of the space S0 with respect to the connecting units 300.
In addition to the gaps between the plurality of bonding members 350, the gaps G1 to G4 secure the flow of a fluid such as air between the space discontinuously surrounded by the plurality of connecting units 3001 to 3004 (that is, the spaces S1 and S2 of
To be noted, although description has been given above on the premise that the module 100E includes the plurality of connecting units 300, this can be also referred to as a case where the module 100E includes one connecting unit 300 and the connecting unit 300 includes a plurality of wiring members 3011 and a plurality of wiring members 3012. In the description with reference to
At least one of the following conditions (i) and (ii) is preferably satisfied.
In the example of
The plurality of wiring members 3011 having rectangular shapes are arranged apart from each other in a frame shape. In addition, the plurality of wiring members 3012 having rectangular shapes are arranged apart from each other in a frame shape. Since the plurality of wiring members 3011 corresponding to sides of the frame shape are apart from each other and the plurality of wiring members 3012 corresponding to sides of the frame shape are apart from each other, the gaps G1 to G4, that is, a flow path for the fluid such as air is formed.
According to the configuration illustrated in
To be noted, the wiring members 3011 or the wiring members 3012 in the connecting units 300 may be configured to continuously surround the space S0. For example, the wiring members 3011 or the wiring members 3012 in the connecting units 300 may be a wiring member of a frame shape.
To be noted, in the module 100E, the connecting unit 3004 may be omitted. In addition, although a case where the heat of the electronic component 102 is dissipated by natural convection has been described in the fourth embodiment, the configuration is not limited to this, and an unillustrated fan may be disposed on the outside of the module 100E. The heat of the electronic component 102 may be dissipated by forced convection caused by the fan. In addition, the module 100E can be modified as in any of the plurality of modification examples of the first embodiment described above. In addition, in the module 100E of the fourth embodiment or a module of a modification example thereof, a heat dissipation member may be disposed on the electronic component 102 as in the third embodiment.
In the fifth embodiment, a case where one of the first to fourth embodiments or a modification example thereof is applied to an electronic device will be described.
The camera body 601 includes a casing 611, and an image pickup module 100F and an image processing module 700 that are disposed inside the casing 611. The image pickup module 100F and the image processing module 700 are electrically connected to each other via a flexible printed wiring board 800 such that data can be communicated therebetween. A signal indicating image data generated in the image pickup module 100F is transmitted to the image processing module 700 via the flexible printed wiring board 800. The signal indicating image data is a digital signal.
The image pickup module 100F is an example of a module, and has a three-dimensional mounting structure. The image pickup module 100F includes an image sensor 221F, a memory device 102F, wiring boards 101F and 201F, and a plurality of connecting units 300F. The image sensor 221F is mounted on the wiring board 201F, and the memory device 102F is mounted on the wiring board 101F. The image sensor 221F is, for example, a complementary metal oxide semiconductor (CMOS) image sensor, or a charge coupled device (CCD) image sensor.
The wiring board 101F is an example of a first wiring board, and the memory device 102F is an example of a first electronic component. The wiring board 201F is an example of a second wiring board, and the image sensor 221F is an example of a second electronic component. The connecting unit 300F has a configuration substantially the same as the connecting unit of any of the first to fourth embodiments or modification examples thereof.
The image processing module 700 includes a wiring board 701, and an image processing device 702 mounted on the wiring board 701. The image processing device 702 is, for example, a digital signal processor, and processes image data obtained from the image pickup module 100F.
As described above, according to the fifth embodiment, since the connecting units 300F of the image pickup module 100F have substantially the same configuration as the connecting units of a module of any of the first to fourth embodiments or a modification example thereof, the heat dissipation efficiency in the image pickup module 100F is improved, and also the image pickup module 100F can be miniaturized. Therefore, the camera body 601 can be miniaturized. To be noted, also the image processing module 700 may have a three-dimensional mounting structure similar to the first to fourth embodiments or a modification example thereof.
A fourth modification example that is a modification example of the image processing module 700 in the fifth embodiment will be described below.
The present disclosure is not limited to the embodiments described above, and the embodiments can be modified in many ways within the technical concept of the present disclosure. In addition, the effects described in the embodiments are merely enumeration of the most preferable effects that can be obtained from the embodiments of the present disclosure, and the effects of the embodiments of the present disclosure are not limited to those described in the embodiments.
Although a case where the plurality of wiring members included in a connecting unit are two wiring members has been described as an example, the configuration is not limited to this. That is, the connecting unit may include three or more wiring members.
Although a case where the module described above is applied to an electronic device such as an image pickup apparatus has been described, the configuration is not limited to this. The module described above is also applicable to, for example, mobile devices and wearable devices such as smartphones, tablet computers, laptop computers, and portable gaming devices. In addition, the module described above is also appliable to electronic devices, for example, image processing apparatuses such as printers, copiers, facsimile machines, and multi-functional apparatuses having functions of these. In addition, the module described above is also applicable to communication devices such as modems and routers, medical devices such as X-ray imaging devices and endoscopes, industrial devices such as robots and semiconductor manufacturing apparatuses, and transportation devices such as cars, airplanes, and ships.
Further, the disclosure of the present specification is not limited to what is explicitly described in the present specification, and includes all matters that can be grasped from the present specification and drawings attached to the present specification. In addition, the disclosure of the present specification includes a complementary set of each individual concept described in the present specification. That is, for example, if the present specification includes a description of “A is B”, it can be said that the present disclosure also discloses a case of “A is not B” even if description of “A is not B” is omitted. This is because a case of “A is B” is described on the premise that a case of “A is not B” is considered.
As described above, according to the present disclosure, a module advantageous for improving the structure between two wiring boards can be provided.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2023-034354, filed Mar. 7, 2023, and Japanese Patent Application No. 2024-011234 filed Jan. 29, 2024, which are hereby incorporated by reference herein in their entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2023-034354 | Mar 2023 | JP | national |
| 2024-011234 | Jan 2024 | JP | national |
