the devices being of a type provided for in group H01L27/00

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H01L25/105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof

Current Industry

H01L25/105the devices being of a type provided for in group H01L27/00

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and multi-screen display apparatus including the...
- Patent number 12,284,864
- Issue date Apr 22, 2025
- LG Display Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including thermal interface material layer and se...
- Patent number 12,283,576
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,278,156
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,272,655
- Issue date Apr 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,261,156
- Issue date Mar 25, 2025
- Denso Corporation
- Hiroyoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,103
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Yonghwan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,106
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 12,255,160
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure semiconductor integration and method for making thereof
- Patent number 12,255,189
- Issue date Mar 18, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package type semiconductor package
- Patent number 12,255,197
- Issue date Mar 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,255,116
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 12,249,587
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-group package having a deep trench device
- Patent number 12,249,590
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,249,593
- Issue date Mar 11, 2025
- Nagase & Co., Ltd.
- Yoichiro Kurita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,249,550
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated substrate structure
- Patent number 12,249,567
- Issue date Mar 11, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132277
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Publication number 20250132262
- Publication date Apr 24, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250125298
- Publication date Apr 17, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Publication number 20250125234
- Publication date Apr 17, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125236
- Publication date Apr 17, 2025
- SAMUNG ELECTRONICS CO., LTD.
- Hyungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING
- Publication number 20250125244
- Publication date Apr 17, 2025
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...
- Publication number 20250125247
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250125280
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Taejun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING EL...
- Publication number 20250125226
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Ryuichiro TOMINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
- Publication number 20250125317
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Daeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250118631
- Publication date Apr 10, 2025
- WINBOND ELECTRONICS CORP.
- Jin-Neng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118650
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250118651
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungryong OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Publication number 20250112191
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112193
- Publication date Apr 3, 2025
- Samsung Electronics Co., Ltd.
- INHYUNG SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY
- Publication number 20250112202
- Publication date Apr 3, 2025
- Intel Corporation
- Abdallah BACHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...
- Publication number 20250112106
- Publication date Apr 3, 2025
- Intel Corporation
- Tarek Gebrael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...
- Publication number 20250105162
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER
- Publication number 20250105163
- Publication date Mar 27, 2025
- Global Unichip Corporation
- Liang-Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...
- Publication number 20250105223
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Sangwook HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRAL SEAL
- Publication number 20250105112
- Publication date Mar 27, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS
- Publication number 20250105234
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...
- Publication number 20250105210
- Publication date Mar 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS

the devices being of a type provided for in group H01L27/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density interconnection using fanout interposer chiplet

Display apparatus and multi-screen display apparatus including the...

Stacked semiconductor device test circuits and methods of use

Electronic device including thermal interface material layer and se...

Semiconductor packages having wiring patterns

Substrate frame design for three-dimensional stacked electronic ass...

Semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Heat-dissipating structures for semiconductor devices and methods o...

Integrated devices in semiconductor packages and methods of forming...

Method of fabricating semiconductor package

Semiconductor packages including antenna pattern

Semiconductor package having an encapulant comprising conductive fi...

Electronic device

Semiconductor package

Semiconductor package

Semiconductor device having package on package structure and method...

Semiconductor package and package-on-package including the same

Semiconductor package structure comprising via structure and redist...

Secure semiconductor integration and method for making thereof

Package-on-package type semiconductor package

Antenna modules employing three-dimensional (3D) build-up on mold p...

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Semiconductor structure and manufacturing method thereof

Semiconductor structure and forming method thereof

Die-group package having a deep trench device

Electronic device

Semiconductor package and method manufacturing the same

Manufacturing method of integrated substrate structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING

SEMICONDUCTOR PACKAGE

INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING

PANEL-LEVEL PACKAGED (PLP) INTEGRATED CIRCUITS AND METHODS OF MANUF...

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

ELECTRONIC COMPONENT EMBEDDED MODULE AND METHOD OF MANUFACTURING EL...

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS

SEMICONDUCTOR PACKAGE

THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

FLEXIBLE THERMAL INTERPOSER FOR BACKSIDE COOLING OF DOUBLE-SIDED PA...

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

Semiconductor Device and Method of Forming Fine-Pitch Interconnecti...

SEMICONDUCTOR CHIPLET DEVICE AND INTERPOSER

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

RADIO FREQUENCY COMMUNICATION DEVICE INCLUDING PACKAGE CONTAINING H...

ELECTRONIC PACKAGE WITH INTEGRAL SEAL

DIRECT-BONDED LED ARRAYS AND DRIVER CIRCUITS

ELECTRONIC DEVICE INCLUDING STACKED SEMICONDUCTOR CHIPS AND METHOD...