Additional leads joined to the metallisation on the insulating substrate

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H01L23/49811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/49811Additional leads joined to the metallisation on the insulating substrate

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Patents Grantslast 30 patents

Information Patent Grant
Fan-out wafer level package structure
- Patent number 12,170,242
- Issue date Dec 17, 2024
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Information Patent Grant
Packaging structure of semiconductor chip and formation method thereof
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- Issue date Oct 15, 2024
- TONGFU MICROELECTRONICS CO., LTD.
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Electronic devices and methods of manufacturing electronic devices
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- Issue date Oct 15, 2024
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Semiconductor package with dual sides of metal routing
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Semiconductor device with a semiconductor die embedded between an e...
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Information Patent Grant
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Microelectronic assemblies having an integrated capacitor
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Information Patent Grant
Interposer and semiconductor package including the same
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- Junyoung Oh
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Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
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- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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WIRING BOARD
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PACKAGE STRUCTURE
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TERMINAL STRUCTURE AND WIRING SUBSTRATE
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PACKAGE STRUCTURE
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SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Multi-Die Package Structures Including Redistribution Layers
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- Yuta EBUKURO
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- Samsung Electronics Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS

Additional leads joined to the metallisation on the insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level package structure

Semiconductor package structure

Semiconductor device

Method of forming an artificial intelligence processor with three-d...

Semiconductor package and method of fabricating the same

Electronic package and manufacturing method thereof

Semiconductor package with front side and back side redistribution...

Method of forming a semiconductor device including vertical contact...

Semiconductor package

Methods for forming semiconductor devices bonded by interposer stru...

Semiconductor device comprising a capacitor

Power amplifier modules including semiconductor resistor and tantal...

Semiconductor device and method for producing the same

Biometric sensor module for a smart card and method for manufacturi...

Semiconductor device

Semiconductor package and method for manufacturing the same

Semiconductor package

Through-substrate via structure and method of manufacture

Press-fit power module and related methods

Packaging structure of semiconductor chip and formation method thereof

Electronic devices and methods of manufacturing electronic devices

Semiconductor package with dual sides of metal routing

Semiconductor chip package including lead frame and manufacturing m...

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor packages

Stretchable electronic device

Semiconductor device

Microelectronic assemblies having an integrated capacitor

Interposer and semiconductor package including the same

Semiconductor device and mounting structure thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Power Converter, Package Structure, and Heat Dissipation Structure

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

STACKED SEMICONDUCTOR PACKAGE AND LOWER SEMICONDUCTOR PACKAGE USED...

WIRING BOARD

PACKAGE STRUCTURE

TERMINAL STRUCTURE AND WIRING SUBSTRATE

PACKAGE STRUCTURE

ELECTRONIC DEVICE

SEMICONDUCTOR DIE SHIELDING STRUCTURE

SUBSTRATE AND MANUFACTURING METHOD THEREOF

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Multi-Die Package Structures Including Redistribution Layers

MICROELECTRONIC ASSEMBLIES HAVING AN INTEGRATED CAPACITOR

SEMICONDUCTOR DEVICE

DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES

STACKED STRUCTURE INCLUDING CONDUCTIVE PATTERN FOR SELF-ALIGNMENT

PACKAGE STRUCTURE AND RELATED MANUFACTURING METHOD THEREOF

REDISTRIBUTION LAYER METALLIC LAYOUT STRUCTURE AND METHOD WITH WARP...

POWER MODULE HAVING SEMICONDUCTOR COMPONENTS AND INCORPORATING A TE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

SEMICONDUCTOR PACKAGE