Additional leads joined to the metallisation on the insulating substrate

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H01L23/49811

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49811Additional leads joined to the metallisation on the insulating substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure including auxiliary dielectric portion
- Patent number 12,322,688
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
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Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
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Information Patent Grant
Semiconductor package using a coreless signal distribution structure
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- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,322,684
- Issue date Jun 3, 2025
- STMicroelectronics S.r.l.
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Information Patent Grant
Semiconductor device package
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- Issue date May 27, 2025
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- Yu-Ying Lee
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Information Patent Grant
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Semiconductor device package and method of manufacturing the same
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- Issue date May 20, 2025
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Information Patent Grant
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- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Solder stop feature for electronic devices
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Information Patent Grant
Electronic device, package structure and electronic manufacturing m...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Display device having connection unit
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- Myongsoo Oh
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Fan-out semiconductor package and electronic device including the same
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Information Patent Grant
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- Issue date May 6, 2025
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- Hailin Wang
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Information Patent Grant
Flip chip and chip packaging structure
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- Issue date May 6, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Yong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic device
- Patent number 12,293,963
- Issue date May 6, 2025
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- Yoshiki Kawazu
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Semiconductor package with hybrid mold layers
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- Intel Corporation
- Bok Eng Cheah
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Sensor package, article comprising the same and manufacturing metho...
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Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
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- Analog Devices International Unlimited Company
- Bilge Bayrakci
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Information Patent Grant
Semiconductor package and method of fabricating same
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Information Patent Grant
Ultra high-bandwidth artificial intelligence (AI) processor with DR...
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Information Patent Grant
Semiconductor package with conductive adhesive that overflows for r...
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- Airoha Technology (HK) Limited
- Chun-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure thereof
- Patent number 12,278,173
- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for high-frequency package
- Patent number 12,272,567
- Issue date Apr 8, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
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- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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SEMICONDUCTOR PACKAGE STRUCTURE
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- MEDIATEK INC.
- Yih-Ting SHEN
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SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
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- Samsung Electronics Co., Ltd.
- Jing Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE STRUCTURE
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- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
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INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...
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- Sungwoo PARK
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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- Samsung Electronics Co., LTD
- Kyoungok Jung
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ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...
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- Amkor Technology Singapore Holding Pte. Ltd.
- Devarajan Balaraman
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PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
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STACKED ELECTRONIC PACKAGES
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- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
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Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...
- Publication number 20250167186
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- Google LLC
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REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...
- Publication number 20250167081
- Publication date May 22, 2025
- Wolfspeed, Inc.
- Ajit R. Kanale
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ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250167162
- Publication date May 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Wei-Hsin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20250167099
- Publication date May 22, 2025
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250157899
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- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR
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- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
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MANUFACTURING METHOD OF PACKAGE DEVICE
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- InnoLux Corporation
- Hsueh-Hsuan Chou
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- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
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MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION
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- Kaleb A. WILSON
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SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME
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- Hao Zheng
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- Jung-Li CHEN
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- Publication number 20250157901
- Publication date May 15, 2025
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- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
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Packaging module and manufacturing method therefor
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- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
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- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
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- Unimicron Technology Corp.
- An-Sheng Lee
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SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
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- Samsung Electronics Co., Ltd.
- Jongyoun KIM
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- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS

Additional leads joined to the metallisation on the insulating substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure including auxiliary dielectric portion

Device and method for UBM/RDL routing

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor package using a coreless signal distribution structure

Method of manufacturing electronic devices and corresponding electr...

Semiconductor device package

Wiring structure and semiconductor module

Semiconductor device package and method of manufacturing the same

Power semiconductor device

Semiconductor package system and related methods

Power electronics module

Solder stop feature for electronic devices

Electronic device, package structure and electronic manufacturing m...

Electronic component module

Semiconductor module and method for fabricating the same

Display device having connection unit

Fan-out semiconductor package and electronic device including the same

Package substrate and semiconductor structure with package substrate

Flip chip and chip packaging structure

Wiring substrate and electronic device

Semiconductor package with hybrid mold layers

Sensor package, article comprising the same and manufacturing metho...

Semiconductor packages

Semiconductor package and method of fabricating same

Ultra high-bandwidth artificial intelligence (AI) processor with DR...

Semiconductor package with conductive adhesive that overflows for r...

Electronic package and substrate structure thereof

Manufacturing method for high-frequency package

Semiconductor device and method for manufacturing the same

Semiconductor packages including antenna pattern

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRON...

POWER MODULE AND PHOTOVOLTAIC OPTIMIZER

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...

ELECTRONIC PACKAGE STRUCTURE

INTERPOSER, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKA...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE WITH TOP SIDE PIN ARRAY AND MANUFACTURING METHOD...

PACKAGES FORMED USING RDL-LAST PROCESS

STACKED ELECTRONIC PACKAGES

Efficient Fan-Out (FO) Space Utilization in Package-On-Package (POP...

REVERSIBLE POWER MODULE AND A PROCESS OF IMPLEMENTING A REVERSIBLE...

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A CONDUCTIVE PILLAR

MANUFACTURING METHOD OF PACKAGE DEVICE

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

MEMORY MODULE WITH EXTENDED CONDUCTIVE PLANE FOR HEAT DISSIPATION

SEMICONDUCTOR PACKAGING STRUCTURES AND METHODS FOR FORMING THE SAME

POWER MODULE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Packaging module and manufacturing method therefor

METHOD OF MANUFACTURING A PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PAC...

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...