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Additional leads joined to the metallisation on the insulating substrate

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  • CPC
  • H01L23/49811
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49811Additional leads joined to the metallisation on the insulating substrate
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