Claims
- 1. A moulding apparatus for moulding a chip on a flat carrier, comprising:
- a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, one of said mould parts being provided with a mould cavity having peripheral edges against which the carrier can be pressed;
- means for exerting pressure in at least one cavity on moulding material arranged in the mould and connected to the mould cavity by a runner;
- at least one compensation element is arranged such that in a closed position of the two mould parts one side of the carrier is held sealinqly against the peripheral edge of the mould cavity;
- said compensation element being an elastic strip; and
- said elastic strip being connected to the carrier.
- 2. A moulding apparatus for moulding a chip on a flat carrier, comprising:
- a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, one of said mould parts being provided with a mould cavity having peripheral edges against which the carrier can be pressed;
- means for exerting pressure in at least one cavity on moulding material arranged in the mould and connected to the mould cavity by a runner;
- at least one compensation element arranged such that in a closed position of the two mould parts one side of the carrier is held sealinqly against the peripheral edge of the mould cavity; and
- said compensation element being a spring ring.
- 3. A moulding apparatus for moulding a chip on a flat carrier, comprising:
- a mould formed by two mould parts which are movable relative to each other and between which the carrier can be received, one of said mould parts being provided with a mould cavity having peripheral edges against which the carrier can be pressed;
- means for exerting pressure in at least one cavity on moulding material arranged in the mould and connected to the mould cavity by a runner;
- at least one compensation element arranged such that in a closed position of the two mould parts one side of the carrier is held sealingly against the peripheral edge of the mould cavity;
- said two mould parts being urged against each other under a predetermined force when said two mould parts are in the closed position;
- said force being a spring force exerted by an adjustable spring; and
- said compensation element being a spring ring.
Priority Claims (1)
Number |
Date |
Country |
Kind |
95.00238 |
Feb 1995 |
NLX |
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CROSS REFERENCE TO RELATED APPLICATION
This application is a divisional of U.S. application Ser. No. 08/598,000 entitled "Moulding Apparatus With Compensation Element" filed on Feb. 7, 1996 and now U.S Pat. No. 5,766,650.
US Referenced Citations (16)
Foreign Referenced Citations (6)
Number |
Date |
Country |
60-97815 |
May 1985 |
JPX |
2-160518 |
Jun 1990 |
JPX |
4-179130 |
Jun 1992 |
JPX |
5-218508 |
Aug 1993 |
JPX |
6-29339 |
Feb 1994 |
JPX |
6-71685 |
Mar 1994 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
598000 |
Feb 1996 |
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