Claims
- 1. A method for fabricating a multi-dimensional, micro-electromechanical assembly comprising the steps of:
providing a surface; mounting at least one substantially planar structure on said surface in a first orientation; providing a phase change material on said structure; and inducing a phase change in said phase change material whereby said phase change material changes from a first state, in which said structure is disposed in said first orientation, to a second state, in which said structure is disposed in a second orientation.
- 2. The invention of claim 1 wherein said phase change material is solder.
- 3. The invention of claim 2 wherein said step of inducing a phase change in said phase change material includes the step up applying heat.
- 4. The invention of claim 1 wherein the step of mounting at least one substantially planar structure includes the step of mounting plural substantially planar structures in said substantially parallel orientation.
- 5. The invention of claim 1 wherein said first orientation is substantially parallel with respect to at least one axis relative to said surface and said second orientation is substantially nonparallel with respect to said axis relative to said surface.
- 6. The invention of claim 1 wherein said surface is a substrate.
- 7. The invention of claim 1 wherein said surface is a structure.
- 8. A method for fabricating a multi-dimensional, micro-electromechanical assembly comprising the steps of:
providing a surface; providing a phase change material on said surface; mounting at least one substantially planar structure on said surface and at least partially on said phase change material in a first orientation; and inducing a phase change in said phase change material whereby said phase change material changes from a first state, in which said structure is disposed in said first orientation, to a second state, in which said structure is disposed in a second orientation.
- 9. A multi-dimensional, micro-electromechanical assembly comprising:
a surface; at least one substantially planar structure mounted on said surface in a first orientation; and a phase change material disposed on said structure; whereby when said phase change material changes from a first state to a second state, the orientation of said structure is changed from said first orientation to a second orientation.
- 10. The invention of claim 9 wherein said phase change material is solder.
- 11. The invention of claim 9 including plural planar structures mounted in said substantially parallel orientation.
- 12. The invention of claim 11 further including a hinge connecting each of said planar structures to said surface.
- 13. The invention of claim 12 further including a mechanical rotation limiter.
- 14. The invention of claim 13 wherein said mechanical rotation limiter is a kickstand.
- 15. The invention of claim 13 wherein said mechanical rotation limiter is a lock.
- 16. The invention of claim 9 wherein said first orientation is substantially parallel with respect to at least one axis relative to said surface and said second orientation is substantially nonparallel with respect to said axis relative to said surface.
- 17. The invention of claim 9 wherein said surface is a substrate.
- 18. The invention of claim 9 wherein said surface is a structure.
- 19. A multi-dimensional, micro-electromechanical assembly comprising:
a surface; a phase change material disposed on said surface; and at least one substantially planar structure mounted on said surface and at least partially on said phase change material in a first orientation; whereby when said phase change material changes from a first state to a second state, the orientation of said structure is changed from said first orientation to a second orientation.
- 20. A multi-dimensional, micro-electromechanical assembly comprising:
a substrate; plural substantially planar structures mounted at least partially on said substrate in a first orientation; and solder disposed in predetermined positions on said structures; whereby when said solder changes from a first state to a second state, the orientation of said structures are changed from said first orientation to a second orientation, said first orientation being substantially parallel with respect to at least one axis relative to said substrate and said second orientation being substantially nonparallel with respect to said axis relative to said substrate.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of a U.S. Provisional Application filed May 18, 2001, Serial No. 60/292,137 by Kevin Harsh, et al. for Controlled Surface Tension or Shrinkage Assembly of 3D MEMS.
RIGHTS IN INVENTION
[0002] This invention is believed to have been made with U.S. Government support under the Department of Defense (MDA904-97-C-0320), the Defense Advanced Research Projects Agency (DARPA), the Air Force Research Laboratory, Air Force Materiel Command, USAF, agreement number F30602-98-1-0219.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60292137 |
May 2001 |
US |