Multi-layered type piezoelectric device and process for production thereof

Abstract

A multi-layered piezoelectric device has, on a ceramic-made substrate, a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions, in layers, wherein a first piezoelectric portion is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), second and upper piezoelectric portions are made of a piezoelectric ceramic composition of higher Ni content than in the first piezoelectric portion, and an electrode is provided at least between the first piezoelectric portion and the second piezoelectric portion. This multi-layered piezoelectric device has a very high piezoelectric characteristic, is superior in transmission of oscillation between ceramic substrate and piezoelectric portions, and can be suitably used in actuators, sensors, etc.

Description

BACKGROUND OF THE INVENTION AND RELATED ART

[0001] The present invention relates to a multi-layered piezoelectric device. More particularly, the present invention relates to a multi-layered piezoelectric device which has a very high piezoelectric characteristic, which is superior in transmission of oscillation between ceramic substrate and piezoelectric portion, and which can give a small and high-integrated actuator or sensor; as well as to a process for production thereof.

[0002] In recent years, piezoelectric devices have been used in ink jet printer heads, speakers, microphones, etc.

[0003] As piezoelectric devices, there have hitherto been used generally those having, on a ceramic-made substrate, a piezoelectric portion made of a piezoelectric ceramic composition and electrodes electrically connected to the piezoelectric portion. Recently, there have come to be also used multi-layered piezoelectric devices having, on a substrate, piezoelectric portions and electrodes alternately in a large number of layers because they can produce a high output at a low voltage.

[0004] Meanwhile, various investigations have been made on the piezoelectric ceramic composition constituting the piezoelectric portion. For example, Pb(Mg1/3Nb2/3)O3—PbTiO3—PbZrO3 ternary solid solution system compositions, or piezoelectric ceramic compositions wherein in the above compositions, part of Pb is substituted with Sr, La or the like, are disclosed in JP-B-44-17103 and JP-B-45-8145. It is expected that such a composition can provide a piezoelectric device in which the piezoelectric portion as the most important element determining the piezoelectric characteristic of piezoelectric device has per se an excellent piezoelectric characteristic (for example, in piezoelectric d constant).

[0005] Conventional piezoelectric devices were produced by forming a piezoelectric material layer made of such a piezoelectric ceramic composition, on a ceramic substrate and then heat-treating the resulting laminate. As a result, the piezoelectric portion has a low density owing to the restraint of the substrate and there has been a problem in that the flexural displacement is low or, when a voltage has been applied, dielectric breakdown occurs at a low density moiety. This problem is striking particularly in multi-layered piezoelectric devices and an improvement therefor has been needed strongly.

[0006] Under such a situation, in JP-A-11-29357 is disclosed, as a conventional piezoelectric device, a piezoelectric device obtained by heat-treating a piezoelectric material made of an above-mentioned piezoelectric ceramic composition to form a piezoelectric portion, and attaching the piezoelectric portion to a ceramic-made substrate to attain the densification of piezoelectric portion.

[0007] In this piezoelectric device, however, an inorganic or organic adhesive need be used in attaching the piezoelectric portion to the substrate; as a result, there have been cases that the adhesive hinders the transmission of oscillation between substrate and piezoelectric portion, or the adhesive component deteriorates the characteristics of piezoelectric portion and substrate. Further in conventional multi-layered piezoelectric devices, no consideration has been made on use of piezoelectric ceramic compositions of different formulations in individual piezoelectric portion layers, and no sufficient piezoelectric characteristic has been obtained.

SUMMARY OF THE INVENTION

[0008] The present invention has been made in view of the above problems and aims at providing a piezoelectric device which has a very high piezoelectric characteristic, which is superior in transmission of oscillation between ceramic substrate and piezoelectric portion, and which is suitably used in actuator, sensor, etc., and a process for production thereof.

[0009] In order to achieve the above aim, the present inventor made an intensive study. As a result, the present inventor found first that when a Ni-containing piezoelectric ceramic composition is used as a piezoelectric material to form a piezoelectric portion, the piezoelectric portion is densified even when the heat-treatment of the piezoelectric material is conducted after its coating on a substrate. However, when individual piezoelectric portions were formed using the same piezoelectric material of particular piezoelectric ceramic composition containing Ni at a relatively high concentration, a heterogeneous phase composed mainly of ZrO2 generated in each piezoelectric portion, which incurred a new problem of hindering an improvement in piezoelectric characteristic. Hence, the present inventor formed, on a substrate, a first piezoelectric material layer of low Ni content, forming thereon an electrode as an obstacle to Ni migration to cover the first piezoelectric material layer, then forming a second piezoelectric material layer of high Ni content, and lastly heat-treating the laminate to produce a multi-layered piezoelectric device; this device was found to generate substantially no heterogeneous phase in each piezoelectric portion, be well densified, and have a very high piezoelectric characteristic as a whole. The present invention has been completed based on the above findings.

[0010] The present invention provides a multi-layered piezoelectric device having, on a ceramic-made substrate, a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions, in layers, characterized in that a first piezoelectric portion which is a first layer from the substrate, is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), second and upper piezoelectric portions are made of a piezoelectric ceramic composition of higher Ni content than in the first piezoelectric portion, and an electrode is provided at least between the first piezoelectric portion and the second piezoelectric portion. In the present specification, all expressions such as “first”, “second” and the like indicate an order of lamination starting from a substrate; for example, a first piezoelectric portion means a piezoelectric portion which is a first layer from a substrate.

[0011] In the present invention, it is preferred that the first piezoelectric portion is made of a piezoelectric ceramic composition containing, as a major component, a Pb(Mg, Ni)1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition represented by the following general formula (1) and the second and upper piezoelectric portions are made of a piezoelectric composition containing, as a major component, a PbMg1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition represented by the following general formula (2) and further containing NiO:

Pbx{(Mg1-yNiy)1/3xaNb2/3}bTicZrdO3  (1)

[0012] wherein x is 0.95≦x≦1.05; y is 0.05≦y≦0.50; a is 0.90≦a≦1.10; b, c and d are decimal fractions falling, in coordinates formed by three coordinate axes of b, c and d, in a range of (b, c, d)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200); and b+c+d=1.000.

Pbx(Mgy/3Nb2/3)aTibZrcO3  (2)

[0013] wherein x is 0.95≦x≦1.05; y is 0.95≦Y≦1.05; a, b and c are decimal fractions falling, in coordinates formed by three coordinate axes of a, b and c, in a range of (a, b, c)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200); and a+b+c=1.00.

[0014] In the present invention, it is also preferred that the Ni content ratio (first/second) of the first piezoelectric portion and the second piezoelectric portion is 0.1 to 0.2 (a mass ratio in terms of NiO). It is also preferred that third and upper piezoelectric portions are made of a piezoelectric ceramic composition of Ni content same as or larger than in the second piezoelectric portion.

[0015] In the present invention, it is also preferred that the first piezoelectric portion is solidly attached to the substrate directly or via an electrode.

[0016] The present invention also provides a process for producing a multi-layered piezoelectric device, characterized by comprising

[0017] a step of forming, on a ceramic-made substrate or on an electrode formed on the substrate, a first piezoelectric material layer containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO),

[0018] a step of forming an electrode on the first piezoelectric material layer and then forming, on the electrode, a second piezoelectric material layer of Ni content larger than in the first piezoelectric material layer, and

[0019] a step of forming a least required number of piezoelectric material layers and then heat-treating the resulting laminate.

[0020] In the process of the present invention, a multi-layered piezoelectric device having three or more piezoelectric layers can be produced by allowing the process to conduct at least once a step of forming an electrode on the second piezoelectric material layer and then forming thereon a third piezoelectric material layer of Ni content same as or larger than in the second piezoelectric material layer. Also in the present invention, it is preferred that the heat treatment is conducted in the presence of an atmosphere-controlling material of substantially the same Ni content as in a piezoelectric material layer formed last.

[0021] The multi-layered piezoelectric device according to the present invention can be used as a dense and small dielectric device or pyroelectric device, in capacitors and sensors.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG. 1 is a sectional view schematically showing an embodiment of the present invention.

[0023] FIG. 2 is a sectional view schematically showing other embodiment of the present invention.

[0024] FIG. 3 is a sectional view schematically showing other embodiment of the present invention.

[0025] FIG. 4(a) is a top view schematically showing other embodiment of the present invention, and FIG. 4(b) is a sectional view thereof.

[0026] FIG. 5 is a sectional view showing a more specific example of the embodiment shown in FIG. 2.

[0027] FIG. 6 is a sectional view showing other more specific example of the embodiment shown in FIG. 2.

[0028] FIG. 7 is a sectional view showing still other more specific example of the embodiment shown in FIG. 2.

[0029] FIG. 8 is a sectional view showing still other more specific example of the embodiment shown in FIG. 2.

[0030] FIG. 9 is a sectional view showing still other more specific example of the embodiment shown in FIG. 2.

[0031] FIG. 10 is a sectional view showing still other more specific example of the embodiment shown in FIG. 2.

[0032] FIG. 11(a) is a sectional view taken at X-X′ of FIG. 5, and FIG. 11(b) is a top view of FIG. 5.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0033] Modes for carrying out the present invention are specifically described below referring to the accompanying drawings. The following description is made mainly on piezoelectric devices having two piezoelectric layers; however, the same description applies also to piezoelectric devices having three or more piezoelectric layers as long as they fall in the features of the present invention.

[0034] The substrate 1 of the present invention, shown in FIG. 1, etc. may be made of a ceramic and has no particular restriction as to other respects. There is preferred, from the standpoint of heat resistance, chemical stability and insulation, a ceramic containing at least one kind selected from the group consisting of stabilized zirconium oxide, aluminum oxide, magnesium oxide, mullite, aluminum nitride, silicon nitride and glass. There is more preferred, from the standpoint of high mechanical strength and superior tenacity, a ceramic containing stabilized zirconium oxide.

[0035] In the present invention, the thickness of the substrate 1 is preferably 3 μm to 1 mm, more preferably 5 to 500 μm, particularly preferably 7 to 200 μm.

[0036] When the thickness of the substrate 1 is less than 3 μm, the mechanical strength of piezoelectric device may be low. When the thickness is more than 1 mm, the rigidity of substrate against the shrinkage stress of piezoelectric portions 2 and 3 is large when a voltage has been applied to the piezoelectric device, and the flexural displacement of the piezoelectric device may be small.

[0037] As shown in FIG. 2, the substrate 1 may have a thin part 1c which is formed so as to approximately correspond to piezoelectric portions (FIG. 2 shows a case in which an electrode is solidly attached) or to a surface area 1a of the substrate 1 to which an electrode 4 is solidly attached and which has the above-mentioned thickness, and a thick part 1b which is formed so as to approximately correspond to a surface area of the substrate other than the surface area 1a and which has a thickness larger than that of the thin part 1c.

[0038] Thereby, the flexural displacement and mechanical strength of piezoelectric device can be made large.

[0039] It is also possible to form, as shown in FIG. 3, a plurality of such structural units on one substrate 1 to form a plurality of multi-layered piezoelectric device units 10 on a common substrate 1.

[0040] In the present invention, there is no particular restriction as to the surface shape of the substrate 1. As the surface shape, there can be mentioned, for example, a rectangular shape, a square shape, a triangular shape, an oval shape, a truly circular shape, a rounded square shape, a rounded rectangular shape, a capsule shape and a composite shape which is a combination of the above shapes.

[0041] The thin part 1c is preferred to have a shape such as shown in FIG. 6, which is bent at the center toward the side opposite to the side having thereon piezoelectric portions 2 and 3, because in such a shape the linearity of flexural displacement to electric field is high; or a shape such as shown in FIG. 7, whose section in thickness direction has a W shape having three infection points. Incidentally, the bent shape shown in FIG. 6 can be formed by utilizing shrinkage occurring in each heat treatment step of piezoelectric portions 2 and 3, and the W shape shown in FIG. 7 can be formed by controlling the start timings and/or amounts of firing shrinkage of piezoelectric portions 2 and 3, and the shape of thin part 1c.

[0042] Next, as to the piezoelectric portions 2 and 3 of the present invention, the first piezoelectric portion 2 nearest to the substrate 1 is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO); and the second and upper piezoelectric portions 3 are made of a piezoelectric ceramic composition having a Ni content larger than in the first piezoelectric portion 2.

[0043] Thereby, in the first piezoelectric portion 2, there is no formation of heterogeneous phase containing ZrO2 as a major component and the proportion of perovskite phase contributing to flexural displacement is large; as a result, this characteristic of composition per se can give a piezoelectric device of improved piezoelectric characteristic. Moreover, in the second and upper piezoelectric portions 3, the restraint of substrate 1 associated with sintering shrinkage is small and the effect of high Ni content is striking. Therefore, the second and upper piezoelectric portions 3 are densified highly by the heat treatment of production process, which densifies even the adjacent first piezoelectric portion 2. This, coupled with the characteristic of ceramic composition per se, can give a piezoelectric device of high piezoelectric characteristic.

[0044] In the present invention, the first piezoelectric portion 2 is preferred to be made of a ceramic composition containing Ni in an amount of 0.15 to 0.28% by mass (in terms of NiO) and is more preferred to be made of a ceramic composition containing Ni in an amount of 0.18 to 0.25% by mass (in terms of NiO), in order to more densify the piezoelectric portion 2 and more prevent the formation of heterogeneous phase.

[0045] In the present invention, the Ni content ratio (first/second) of the first piezoelectric portion 2 and the second piezoelectric portion 3 is preferably 0.07 to 0.25 (mass ratio in terms of NiO), more preferably 0.10 to 0.20 (mass ratio in terms of NiO), particularly preferably 0.12 to 0.18 (mass ratio in terms of NiO).

[0046] When the Ni content ratio (first/second) is less than 0.07 (mass ratio in terms of NiO), the heterogeneous phase in the second piezoelectric portion 3 tends to be large and accordingly the whole piezoelectric characteristic tends to be small. Meanwhile, when the Ni content ratio (first/second) is more than 0.25 (mass ratio in terms of NiO), the densification in the second piezoelectric portion 3 tends to be small, and accordingly the first piezoelectric portion 2 is not densified, either, and the whole piezoelectric characteristic tends to be small.

[0047] Incidentally, also when three layers or more of piezoelectric portions are formed, the second piezoelectric portion 2 is preferred to have the above Ni content ratio relative to the first piezoelectric portion. In order to further promote the densification of individual piezoelectric portions, it is preferred that the third and upper piezoelectric portions have a Ni content same as or larger than in the second piezoelectric portion.

[0048] In the present invention, as the piezoelectric ceramic composition constituting each piezoelectric portion, there can be mentioned, for example, a PbTiO3—PbZrO3 binary solid solution system composition, a NiO-added Pb(Mg1/3Nb2/3)O3—PbTiO3—PbZrO3 ternary solid solution system composition, and a Pb(Mg, Ni)1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition obtained by substituting part of Mg with Ni in a ternary solid solution system composition. Of these, preferred are, for excellent piezoelectric characteristic, a NiO-added Pb(Mg1/3Nb2/3)O3—PbTiO3—PbZrO3 ternary solid solution system composition (hereinafter, this composition is referred to as “ternary and addition system composition” for convenience of description), and a Pb(Mg, Ni)1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition (hereinafter, this composition is referred to as “ternary and substitution system composition” for convenience of description).

[0049] In the present invention, the piezoelectric portions 2 and 3 may be constituted with any one of these piezoelectric ceramic compositions or with a combination of two or more of these piezoelectric ceramic compositions, as long as the Ni content requirement for each piezoelectric layer is satisfied. From the standpoint of improvement in piezoelectric characteristic, however, it is preferred that each of the piezoelectric portions 2 and 3 is constituted with a ternary and addition system composition, or the first piezoelectric portion 2 is constituted with a ternary and substitution system composition and the second and upper piezoelectric portions 3 are constituted with a ternary and addition system composition. The latter constitution is preferred.

[0050] In the present invention, the ternary and addition system composition is preferably one containing a composition represented by the following general formula (2) as a major component and further containing NiO, for the high piezoelectric characteristic.

Pbx(Mgy/3Nb2/3)aTibZrcO3  (2)

[0051] wherein x is 0.95≦x≦1.05; y is 0.95≦y≦1.05; a, b and c are decimal fractions falling, in coordinates formed by three coordinate axes of a, b and c, in a range of (a, b, c)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200); and a+b+c=1.00.

[0052] Similarly, the ternary and substitution system composition is preferably one represented by the following general formula (1), for the high piezoelectric characteristic.

Pbx{(Mg1-yNiy)1/3xaNb2/3}bTicZrdO3  (1)

[0053] wherein x is 0.95≦x≦1.05; y is 0.05≦y≦0.50; a is 0.90≦a≦1.10; b, c and d are decimal fractions falling, in coordinates formed by three coordinate axes of b, c and d, in a range of (b, c, d)=(0.550, 0.425, 0.025), (0.550, 0.325, 0.125), (0.375, 0.325, 0.300), (0.100, 0.425, 0.475), (0.100, 0.475, 0.425) and (0.375, 0.425, 0.200); and b+c+d=1.000.

[0054] Needless to say, in the formula (1), the preferred range of y varies dependently upon the preferred Ni content in each piezoelectric portion. For example, y is 0.05≦y≦0.20 in the first piezoelectric portion and is 0.10≦y≦0.50 in the second and upper piezoelectric portions.

[0055] In the present invention, the piezoelectric ceramic compositions constituting the piezoelectric portions 2 and 3 have the above-mentioned Ni contents. Therefore, the proportion of heterogeneous phase composed mainly of ZrO2, in total piezoelectric ceramic compositions of total piezoelectric portions is 2% by volume or less and, particularly when the Ni content is made low as a whole, the proportion of heterogeneous phase in total piezoelectric ceramic compositions of total piezoelectric portions is 1% by volume or less. Consequently, in the present invention, the proportion of perovskite phase (which contributes to flexural displacement) in total piezoelectric ceramic compositions of total piezoelectric portions can be controlled at 90% by volume or more and, when the Ni content is made low as a whole, at 95% by volume or more.

[0056] In the present invention, each piezoelectric ceramic composition has an average grain size of preferably 1 to 10 μm, more preferably 2 to 5 μm.

[0057] When the average grain size is less than 1 μm, domains do not develop sufficiently in each piezoelectric portion and accordingly flexural displacement tends to be small. Meanwhile, when the average grain size is more than 10 μm, domains in piezoelectric portion are large but move hardly and accordingly flexural displacement tends to be small as well.

[0058] In the present invention, the Pb in piezoelectric ceramic composition is preferably substituted with at least one kind selected from the group consisting of Sr, Ca, Ba ad La for improved piezoelectric characteristic.

[0059] Substitution of Pb in piezoelectric ceramic composition at a high ratio invites a reduction in flexural displacement and a large fluctuation of flexural displacement by temperature change. Hence, the substitution is preferably conducted in an appropriate ratio range for each substituting element.

[0060] Specifically explaining, the Pb in piezoelectric ceramic composition is substituted preferably by 2 to 10 mole %, more preferably by 4 to 8 mole % when the Pb in piezoelectric ceramic composition is substituted with at least one kind selected from the group consisting of Sr, Ca and Ba. When the Pb in piezoelectric ceramic composition is substituted with La, the Pb in piezoelectric ceramic composition is substituted preferably by 0.2 to 1.0 mole %, more preferably by 0.4 to 0.9 mole %.

[0061] In order for each piezoelectric portion 2 or 3 to secure a desired flexural displacement and a desired mechanical strength, the piezoelectric portion has a porosity of preferably 10% by volume or less, more preferably 5% by volume or less.

[0062] The thickness of each piezoelectric portion 2 or 3 is preferably 1 to 300 μm, more preferably 3 to 100 μm, particularly preferably 5 to 30 μm.

[0063] When the thickness of each piezoelectric portion is less than 1 μm, the piezoelectric portion tends to be insufficiently densified even though it is made of a particular piezoelectric ceramic composition mentioned above. Meanwhile, when the thickness of each piezoelectric portion is more than 300 μm, a ceramic substrate of higher thickness is required for prevention of substrate breakage, making it difficult to produce a small piezoelectric device.

[0064] The ratio (substrate/total piezoelectric portions) of thickness of substrate 1 to total thickness of piezoelectric portions 2 and 3 is preferably 0.1 to 30, more preferably 0.3 to 10, particularly preferably 0.5 to 5 from the standpoint of securement of mechanical strength of piezoelectric device and improvement of flexural displacement of piezoelectric device. In the present invention, there is no particular restriction as to the shape of piezoelectric portions 2 and 3. However, when they are formed by, for example, screen printing, the thickness of the piezoelectric portions becomes gradually smaller from the center to the ends as shown in FIGS. 5 to 10, owing to the fluidity of the paste (containing a piezoelectric material) used in the screen printing.

[0065] In the present invention, it is preferred that the first piezoelectric portion 2 is solidly attached to the substrate 1 directly or via an electrode 4 described later.

[0066] Thereby, it is possible to avoid a reduction in oscillation transmission between substrate 1 and first piezoelectric portion 2 due to the presence of adhesive or the like, and a deterioration of characteristic of first piezoelectric portion 2 or substrate 1 due to the influence of adhesive component or the like.

[0067] Incidentally, the expression “being solidly attached” means that the first piezoelectric portion 2 and the substrate 1 or the electrode 4 become a tightly integrated structure owing to their solid phase reaction, without using any organic or inorganic adhesive.

[0068] Next, in the present invention, the electrodes 4 to 6 are electrically connected to the piezoelectric portions 2 and 3 and are provided at least between the first piezoelectric portion 2 and the second piezoelectric portion 3.

[0069] Owing to such a constitution, the electrode 4 can function also as an obstacle to Ni migration and it is possible to prevent the formation of heterogeneous phase resulting from migration of Ni from second and upper piezoelectric portions to first piezoelectric portion of low Ni content.

[0070] Hence, in the present invention, it is preferred to form electrodes so as to correspond to those parts of piezoelectric portions 2 and 3 substantially contributing to flexural displacement. Specifically explaining, electrodes are preferably formed so as to correspond to a part of piezoelectric portion layer 2 or 3 which is 80% or more of the layer surface including the center of the layer.

[0071] In the present invention, there is no particular restriction as to the positions of other electrodes. However, a structure in which each electrode is formed between two piezoelectric portions and moreover piezoelectric portions and electrodes are laminated alternately, is preferred because with such a structure, the same electric field can be applied to all piezoelectric portions and thereby all these piezoelectric portions can be operated efficiently.

[0072] Also, when a substrate 1 is commonly used for a plurality of multi-layered piezoelectric device units 10a to 10c as shown in FIGS. 4(a) and 4(b), the lowermost electrode 14 and the uppermost electrode 16 in the multi-layered piezoelectric device units 10a to 10c may be an integrated electrode 14 which is jointly used by the multi-layered piezoelectric device units 10 and which is formed in areas corresponding to the piezoelectric portions 2a to 2c and 3a to 3c. In such an electrode, the shape need not correspond to the individual piezoelectric portions 2a to 2c and 3a to 3c, and positioning in electrode formation is easy.

[0073] As the material for electrodes 4 to 6, there can be mentioned at least one kind selected from the group consisting of platinum, palladium, rhodium, silver and alloys thereof. Of these, platinum or an alloy composed mainly of platinum is preferred for the high heat resistance shown in heat treatment of piezoelectric portion 1.

[0074] In the present invention, there is no particular restriction as to the dimensions of electrodes 4 to 6. For example, it is possible that, as shown in FIG. 5 and FIG. 11(a) and 11(b), the electrodes 4 to 6 have the same dimension and are formed in the same range in the thickness direction.

[0075] As shown in FIG. 8, it is also preferred that the electrodes 4 to 6 are formed so that the lowermost layer electrode 4 has the smallest range and each upper layer electrode has a larger range including the range of the lower layer electrode.

[0076] By allowing the ranges of the electrodes 4 to 6 to have such an inclination, a piezoelectric portion of upper layer can be strained more than a piezoelectric portion of lower layer; as a result, a higher bending efficiency is obtainable and flexural displacement can be exhibited more efficiently.

[0077] When, in the present invention, a larger flexural displacement is aimed at by enhancing the driving voltage of multi-layered piezoelectric device, it is preferred that, as shown in FIG. 9, the intermediate electrode 5 is formed in a wider range (including ranges corresponding to the lower and upper layer electrodes 4 and 6) than the lower and upper layer electrodes 4 and 6, or that, as shown in FIG. 10, the intermediate electrode 5 is formed in a narrower range (included in ranges corresponding to the lower and upper layer electrodes 4 and 6) than the lower and upper layer electrodes 4 and 6.

[0078] By allowing the ranges of the electrodes to have such an inclination, substantially no electric field is applied in the vicinity of each end of piezoelectric portions 2 and 3 where the layer thicknesses tend to be smaller, and the piezoelectric portions can be free from dielectric breakdown.

[0079] In the piezoelectric device having the above-mentioned inclination in the ranges of electrodes, the degree of the inclination is preferably optimized in view of the distribution of electric field. For example, the ratio of areas of two electrode layers 4 and 5 (or 5 and 6) adjacent to each other via piezoelectric portion 2 (or 3) is preferably 0.5 to 2, more preferably 0.67 to 1.5, further preferably 0.83 to 1.2.

[0080] In the present invention, each thickness of electrodes 4 to 6 is preferably 15 μm or less, more preferably 5 μm or less. When each thickness of electrodes 4 to 6 is more than 15 μm, the electrodes 4 to 6 function as a buffer layer, which may make flexural displacement small.

[0081] As such a multi-layered piezoelectric device, there can be mentioned, for example, one in which the thin part 1c has a length of 1.1 mm, a width of 0.16 mm and a thickness of 6 μm, the lower electrode has a width of 0.12 mm and a thickness of 3 μm, the lower piezoelectric portion 2 has a length of 1.1 mm, a width of 0.16 mm and a thickness of 9 μm, the intermediate electrode 5 has a width of 0.13 mm and a thickness of 2 μm, the upper layer piezoelectric portion 3 has a length of 1.1 mm, a width of 0.16 mm and a thickness of 8 μm, and the upper electrode has a width of 0.12 mm and a thickness of 0.3 μm.

[0082] Next, description is made on the process for producing the multi-layered piezoelectric device of the present invention.

[0083] In the present invention, first, a first piezoelectric material layer containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO) is formed on a ceramic-made substrate or on an electrode formed on the substrate.

[0084] The substrate used in the present invention can be produced by subjecting a material corresponding to the ceramic mentioned above with respect to the piezoelectric device of the present invention, to ordinary pressing, ordinary extrusion or the like to produce a molded material of desired shape and then firing the molded material under conditions ordinarily used. The shape, thickness, etc. of the substrate were mentioned previously and therefore are not explained here.

[0085] As the method for forming an electrode on the substrate, there can be mentioned, for example, ion beam, sputtering, vacuum deposition, PVD, ion plating, CVD, plating, screen printing, spraying and dipping. Of these, preferred are sputtering and screen printing for the bondability of electrode with substrate and piezoelectric portion.

[0086] The formed electrode can be made integral with the substrate and/or a piezoelectric portion by a heat treatment of about 1,000 to 1,400° C. In this case, the heat treatment may be conducted when the electrode has been formed and before formation of a piezoelectric material layer, or may be conducted after a desired laminate has been produced.

[0087] The piezoelectric material used in the present invention can be produced by mixing various raw materials so as to correspond to a desired piezoelectric ceramic composition, calcinating the mixed raw material and then grinding the calcinated material, or by calcinating the mixed raw material, adding NiO to the calcinated material, calcinating the resulting mixture, and grinding the resulting material. Below is specifically described a method for producing a piezoelectric material containing a ternary and addition system composition, which is a representative piezoelectric material.

[0088] First, there are mixed simple substances of elements (Pb, Ba, Ca, Sr, La, Mg, Nb, Zr and Ti), oxides of these elements (e.g. PbO, Pb3O4, La2O3, MgO, Nb2O5, TiO2 and ZrO2), carbonates of these elements (e.g. BaCO3, SrCO3, MgCO3 and CaCO3), compounds containing a plurality of such elements (e.g. MgNb2O), etc. so that the contents of these elements (Pb, Ba, Ca, Sr, La, Mg, Nb, Zr and Ti) can give a formulation of a desired piezoelectric ceramic composition, to produce a raw material which becomes a major component of the piezoelectric ceramic composition.

[0089] Next, this mixed raw material is calcinated at 750 to 1,300° C. to obtain a piezoelectric ceramic composition; it is calcinated; a desired amount of NiO is added thereto; and the mixture is calcinated again at 750 to 1,300° C. The resulting piezoelectric ceramic composition, when subjected to X-ray diffractometry, is preferred to give a ratio of the highest intensity of pyrochroite phase and the highest intensity of perovskite phase, of 5% or less and more preferred to give a ratio of 2% or less.

[0090] Then, the piezoelectric ceramic composition obtained is ground using an ordinary grinder such as ball mill, attritor, beads mill or the like to obtain a piezoelectric material powder having desired particle diameters. In this case, the average particle diameter of the piezoelectric material powder is preferably 0.1 to 1.0 μm, more preferably 0.3 to 0.7 μm. With such a particle diameter, piezoelectric portions having an average particle diameter of 1 to 10 μm can be obtained by a heat treatment mentioned later.

[0091] Incidentally, control of the particle diameters of the powder may also be made by heat-treating the piezoelectric material powder obtained by grinding, at 400 to 750° C. In this case, smaller particles adhere to other particles, a powder of uniform particle diameters is obtained, and a piezoelectric portion of uniform grain size can be provided; therefore, control in such a manner is preferred. The piezoelectric material may also be produced by, for example, alkoxide method or co-precipitation method.

[0092] A piezoelectric material containing a ternary and substitution system composition as a major component can be produced in the same manner as for the piezoelectric material containing a ternary and addition system composition as a major component, except that there are mixed simple substances of elements (Pb, Ba, Ca, Sr, La, Mg, Ni, Nb, Zr and Ti), oxides of these elements (e.g. PbO, Pb3O4, La2O3, MgO, NiO, Nb2O5, TiO2 and ZrO2), carbonates of these elements (e.g. BaCO3, SrCO3, MgCO3 and CaCO3), compounds containing a plurality of such elements (e.g. MgNb2O), etc. so that the contents of these elements (Pb, Ba, Ca, Sr, La, Mg, Ni, Nb, Zr and Ti) can give a formulation of a desired piezoelectric ceramic composition and then the resulting mixed raw material is calcinated at one time.

[0093] As the method for forming a layer of the piezoelectric material obtained, there can be mentioned, for example, screen printing, spraying and dipping. Of these, screen printing is preferred because a layer of desired shape and thickness can be formed easily and continuously at a high precision.

[0094] In the present invention, then, an electrode is formed on the first piezoelectric material layer formed above; on the electrode is formed a second piezoelectric material layer of higher Ni content than in the first piezoelectric material layer.

[0095] Thereby, the resulting multi-layered piezoelectric device can have dense piezoelectric portions substantially free from a heterogeneous phase composed mainly of ZrO2.

[0096] The method for formation of electrode and the method for formation of piezoelectric material layer are as mentioned previously, and the range of electrode formation is as mentioned previously with respect to the multi-layered piezoelectric device of the present invention. The method for production of piezoelectric material is also the same as mentioned previously except that the Ni content in the raw material is made higher than in the raw material for the first piezoelectric material layer.

[0097] In the present invention, when piezoelectric portions are formed in three or more layers, another electrode is formed on the second piezoelectric material layer; then, on the electrode is formed a third piezoelectric material layer of Ni content same as or higher than in the second piezoelectric material layer; this step is conducted required times. Incidentally, the expression “third piezoelectric material” does not exclude that the material is the same as the second piezoelectric material and, when piezoelectric portions are formed in four or more layers, does not exclude that materials of different compositions are used for the third piezoelectric material layer and the fourth and upper piezoelectric material layers.

[0098] In the present invention, lastly, a laminate obtained after piezoelectric material layers of required number have been formed, is heat-treated.

[0099] Thereby, the densification of second and upper piezoelectric portions favorably affect the first piezoelectric portion and it is possible to obtain a piezoelectric device wherein all the piezoelectric portions are densified. Further, the above heat treatment allows the first piezoelectric portion to solidly attach to the substrate directly or via an electrode. Incidentally, in the present invention, the electrodes connected to the third and upper piezoelectric portions need not be heat-treated when a final laminate has been obtained, and may be heat-treated separately after formation thereof. From the standpoint of production efficiency, however, the electrodes are preferred to be heat-treated when a final laminate has been obtained.

[0100] In the present invention, since piezoelectric material layers different in Ni content are formed, the necessity of using an atmosphere-controlling material is low. However, in order to form piezoelectric portions of desired Ni contents, it is preferred to conduct a heat treatment in the presence of an atmosphere-controlling material of substantially the same Ni content as in the lastly formed piezoelectric material layer.

[0101] The atmosphere-controlling material contains NiO in an amount of preferably 0.03 to 0.50 mg, more preferably 0.07 to 0.40 mg, further preferably 0.10 to 0.30 mg per cm3 of atmosphere.

[0102] When the Ni amount in terms of NiO is less than 0.03 mg per cm3 of atmosphere, it is difficult to obtain a piezoelectric portion of desired Ni content; therefore, the resulting piezoelectric device tends to be low in linearity of flexural displacement to electric field when exposed to a high electric field. Meanwhile, when the NiO amount is more than 0.50 mg per cm3 of atmosphere, particles composed mainly of NiO are present in excess and become a starting point of dielectric breakdown; therefore, dielectric breakdown tends to take place.

[0103] In order to prevent the vaporization of other components as well and reliably obtain piezoelectric portions of desired compositions, the atmosphere-controlling material is preferred to contain other components in about the same amounts as in the lastly formed piezoelectric material layer.

[0104] In the present invention, the temperature of heat treatment of laminate is preferably 1,000 to 1,400° C., more preferably 1,100 to 1,350° C. When the temperature is less than 1,000° C., the solid attachment between substrate or electrode and piezoelectric portion may be insufficient and the density of each piezoelectric portion may be insufficient. When the temperature is more than 1,400° C., the vaporization amount of Pb and Ni from piezoelectric material is large, making it difficult to obtain a piezoelectric portion of desired composition.

[0105] The holding time of maximum temperature during heat treatment is preferably 10 minutes to 10 hours, more preferably 1 hour to 4 hours.

[0106] When the holding time of maximum temperature is less than 10 minutes, the densification of each piezoelectric portion tends to be insufficient and it may be impossible to obtain desired characteristics. When the holding time of maximum temperature is more than 10 hours, the total vaporization amount of Pb and Ni is large even when atmosphere control is made, and there appear inconveniences of reduced characteristics and increased dielectric breakdown.

EXAMPLES

[0107] The present invention is specifically described below by way of Examples. However, the present invention is not restricted to these Examples. Incidentally, the multi-layered piezoelectric devices produced in Examples and Comparative examples were measured for flexural displacement as follows and evaluated.

[0108] (Flexural Displacement)

[0109] A voltage was applied between upper and lower electrodes so that the electric field generated became 3 kV/mm, and the resulting flexural displacement was measured using a laser displacement tester.

Example 1

[0110] A platinum-made lower electrode [dimensions: 1.2 mm×0.8 mm×3 μm (thickness)] was formed, by screen printing, on a Y2O3-stabilized ZrO2 substrate with a flat thin part [thin part dimensions: 1.6 mm×1.1 mm×10 μm (thickness)], and a heat treatment of 1,300° C. and 2 hours was applied for integration of the electrode with the substrate.

[0111] Thereon was formed, by screen printing, a first piezoelectric material layer composed of Pb1.00{(Mg0.97Ni0.03)1/3Nb2/3}0.20Ti0.43Zr0.37O3, in dimensions of 1.3 mm×0.9 mm×7 μm (thickness).

[0112] Thereon was formed, by screen printing, a platinum-made internal electrode [dimensions: 1.0 mm×1.1 mm×3 μm (thickness)].

[0113] Thereon was formed, by screen printing, a second piezoelectric material layer made of a ceramic composition containing 98.5% by mass of Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 and 1.5% by mass of NiO, in dimensions of 1.3 mm×0.9 mm×7 μm (thickness).

[0114] The resulting laminate was subjected to a heat treatment at 1,275° C. for 2 hours in a vessel with an atmosphere-controlling material having the same composition as the second piezoelectric material, being allowed to be present in the vessel in an amount of 0.15 mg (in terms of NiO) per cm3 of atmosphere. The thicknesses of the piezoelectric portions after the heat treatment were each 5 μm.

[0115] Lastly, thereon was formed, by screen printing, a gold-made upper electrode [dimensions: 1.2 mm×0.8 mm×0.5 μm (thickness)], followed by a heat treatment, whereby was produced a piezoelectric device having two piezoelectric portion layers. The compositions of the piezoelectric materials used are shown in Table 1.

Examples 2 and 3 and Comparative Examples 1 and 2

[0116] Piezoelectric devices each having two piezoelectric portion layers were produced in the same manner as in Example 1 except that there were used piezoelectric materials having formulations shown in Table 1.

	TABLE 1
	First piezoelectric material	Second piezoelectric material
		Ni content		Ni content
	Formulation	(%)	Formulation	(%)
Comparative Example 1	Pb1.00{(Mg0.97Ni0.03)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.05	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO)	1.50
Example 1	Pb1.00{(Mg0.95Ni0.05)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.08	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO)	1.50
Example 2	Pb1.00{(Mg0.87Ni0.13)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.20	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO)	1.50
Example 3	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO)	1.50
Comparative Example 2	Pb1.00{(Mg0.67Ni0.33)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.50	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO)	1.50

[0117] (Evaluation)

[0118] As shown in Table 2, flexural displacements were small at 2.45 μm and 2.41 μm respectively in the piezoelectric device of Comparative Example 1 in which the Ni content in first piezoelectric portion was small at 0.05% by mass and the piezoelectric device of Comparative Example 2 in which the Ni content in first piezoelectric portion was large at 0.50% by mass.

[0119] In contrast, flexural displacements were large at 2.69 to 2.75 μm in all of the piezoelectric devices of Examples 1 to 3 in which the Ni content in first piezoelectric portion was 0.08 to 0.31% by mass and the Ni content in second piezoelectric portion was 1.50% by mass.

[0120] In the piezoelectric devices of Examples 2 and 3 in which the ratio of NiO contents (first/second) were 0.13 and 0.21, respectively, flexural displacements were particularly large at 2.72 or more. The results are shown in Table 2.

	TABLE 2
	Ni content in piezoelectric	Ratio of NiO	Flexural
	portion (%)	contents	displacement
	First	Second	(first/second)	(μm)
Comparative	0.05	1.50	0.03	2.45
Example 1
Example 1	0.08	1.50	0.05	2.69
Example 2	0.20	1.50	0.13	2.75
Example 3	0.31	1.50	0.21	2.72
Comparative	0.50	1.50	0.33	2.41
Example 2

Examples 4 to 6 and Comparative Examples 3 and 4

[0121] Piezoelectric devices each having two piezoelectric portions layers were produced in the same manner as in Example 1 except that there were used piezoelectric materials having formulations shown in Table 3.

	TABLE 3
	First piezoelectric material	Second piezoelectric material
		Ni content		Ni content
	Formulation	(%)	Formulation	(%)
Comparative Example 3	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.10
Comparative Example 4	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.31
Example 4	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	1.00
Example 3	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	1.50
Example 5	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	3.00
Example 6	Pb1.00{(Mg0.80Ni0.20)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.31	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	5.00

[0122] (Evaluation)

[0123] As shown in Table 4, flexural displacements were very small at 2.33 μm or less in the piezoelectric devices of Comparative Examples 3 and 4 in which the Ni content in second piezoelectric portion was the same as or smaller than the Ni content in first piezoelectric portion.

[0124] In contrast, flexural displacements were large at 2.62. μm or more in all of the piezoelectric devices of Examples 3, 4, 5 and 6 in which the Ni content in second piezoelectric portion was larger than the Ni content in first piezoelectric portion. In the piezoelectric device of Example 5 in which the ratio of NiO contents (first/second) was 0.10, flexural displacement was particularly large at 2.70, similarly to the piezoelectric device of Example 3 in which the ratio was 0.21. The results are shown in Table 4.

	TABLE 4
	Ni content in piezoelectric	Ratio of NiO	Flexural
	portion (%)	contents	displacement
	First	Second	(first/second)	(μm)
Comparative	0.31	0.10	3.10	2.19
Example 3
Comparative	0.31	0.31	1.00	2.33
Example 4
Example 4	0.31	1.00	0.31	2.65
Example 3	0.31	1.50	0.21	2.72
Example 5	0.31	3.00	0.10	2.70
Example 6	0.31	5.00	0.06	2.62

[0125] Examples 7 to 10

[0126] Piezoelectric devices each having two piezoelectric portion layers were produced in the same manner as in Example 1 except that there were used piezoelectric materials having formulations shown in Table 5.

	TABLE 5
	First piezoelectric material	Second piezoelectric material
		Ni content		Ni content
	Formulation	(%)	Formulation	(%)
Example 7	Pb1.00{(Mg0.95Ni0.05)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.08	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.77
Example 8	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.08	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.77
Example 9	Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 + NiO	0.08	Pb1.00{(Mg0.50Ni0.50)1/3Nb2/3Ti0.43Zr0.37O3	0.77
Example 10	Pb1.00{(Mg0.95Ni0.05)1/3Nb2/3}0.20Ti0.43Zr0.37O3	0.08	Pb1.00{(Mg0.50Ni0.50)1/3Nb2/3Ti0.43Zr0.37O3	0.77

[0127] (Evaluation)

[0128] Flexural displacements were large at 2.64 μm or more in all the piezoelectric devices. Flexural displacement was largest at 2.69 μm in the piezoelectric device of Example 7 in which the first piezoelectric portion was formed with a piezoelectric material obtained by substituting part of Mg in ceramic composition, with Ni (the material is hereinafter referred to as “substitution system piezoelectric material”) and the second piezoelectric portion was formed with a piezoelectric material obtained by adding NiO to a ceramic composition (the material is hereinafter referred to as “addition system piezoelectric material”). In other piezoelectric devices, flexural displacements were large in the order of {circle over (2)} a piezoelectric device of a first piezoelectric portion made of an addition system piezoelectric material and a second piezoelectric portion made of an addition system piezoelectric material, {circle over (3)} a piezoelectric device of a first piezoelectric portion made of an addition system piezoelectric material and a second piezoelectric portion made of a substitution system piezoelectric material, and {circle over (4)} piezoelectric device of a first piezoelectric portion made of a substitution system piezoelectric material and a second piezoelectric portion made of a substitution system piezoelectric material. The results are shown in Table 6.

	TABLE 6
	Ratio of NiO		Flexural
	contents	State of Ni inclusion	displacement
	(first/second)	First	Second	(μm)
Example 7	0.10	Substitution	Addition	2.69
Example 8	0.10	Addition	Addition	2.67
Example 9	0.10	Addition	Substitution	2.66
Example 10	0.10	Substitution	Substitution	2.64

Example 11

[0129] A platinum-made lower electrode was formed on a ZrO2 substrate and they were made into an integral structure, in the same manner as in Example 1. Thereon was formed, by screen printing, a first piezoelectric material layer made of a ceramic composition of Pb1.00{(Mg0.87Ni0.13)1/3Nb2/3}0.20Ti0.43Zr0.37O3 (NiO content: 0.2% by mass), in dimensions of 1.3 mm×0.9 mm×7 μm (thickness).

[0130] Thereon was formed, by screen printing, a platinum-made internal electrode [dimensions: 1.0 mm×1.1 mm×3 μm (thickness)].

[0131] Thereon was formed, by screen printing, a second piezoelectric material layer made of a ceramic composition containing 99.5% by mass of Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 and 0.5% by mass of NiO, in dimensions of 1.3 mm×0.9 mm×7 μm (thickness).

[0132] Thereon was formed, by screen printing, a platinum-made internal electrode [dimensions; 1.0 mm×1.1 mm×3 μm (thickness)]. Thereon was formed, by screen printing, a third piezoelectric material layer made of a ceramic composition containing 98.5% by mass of Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 and 1.5% by mass of NiO, in dimensions of 1.3 mm×0.9 mm×7 μm (thickness).

[0133] The resulting laminate was subjected to a heat treatment at 1,275° C. for 2 hours in a vessel with an atmosphere-controlling material having the same composition as the uppermost piezoelectric material layer, being allowed to be present in the vessel in an amount of 0.15 mg (in terms of NiO) per cm3 of atmosphere. The thicknesses of the piezoelectric portions after the heat treatment were each 5 μm.

[0134] Lastly, thereon was formed, by screen printing, a gold-made upper electrode [dimensions: 1.2 mm×0.8 mm×0.5 μm (thickness)], followed by a heat treatment, whereby was produced a multi-layered piezoelectric device having three piezoelectric portion layers.

Example 12

[0135] A multi-layered piezoelectric device having three-piezoelectric portion layers was produced in the same manner as in Example 11 except that there was formed on an internal electrode, by screen printing, a second piezoelectric material layer made of a ceramic composition containing 98.5% by mass of Pb1.00(Mg1/3Nb2/3)0.20Ti0.43Zr0.37O3 and 1.5% by mass of NiO.

[0136] (Evaluation)

[0137] Flexural displacement was larger in the piezoelectric device of Example 12 in which Ni contents were the same in the second piezoelectric portion and the third piezoelectric portion and the ratio of NiO contents in first piezoelectric portion and second piezoelectric portion was small at 0.13, than in the piezoelectric device of Example 11 in which the Ni content was smaller in the second piezoelectric portion than in the third piezoelectric portion and the ratio of NiO contents in first piezoelectric portion and second piezoelectric portion was large at 0.40. Incidentally, when the Ni content in third piezoelectric portion is smaller than that in second piezoelectric portion, the densification in third piezoelectric portion is small; therefore, it is presumed that the densification in adjacent second piezoelectric portion, etc. tends to be suppressed and the flexural displacement of the resulting piezoelectric device is smaller than that of Example 12. The formulations of the piezoelectric materials used and the results of evaluation are shown in Table 7.

	TABLE 7
	Ni content (%)
	Second	Third	Ratio of NiO	Flexural
	piezoelectric	Piezoelectric	contents	displacement
	material	material	(first/second)	(μm)
Example 11	0.5	1.5	0.40	2.61
Example 12	1.5	1.5	0.13	2.68

[0138] As described above, the present invention can provide a multi-layered piezoelectric device which has a very high piezoelectric characteristic, is superior in transmission of oscillation between ceramic substrate and piezoelectric portions, and can be suitably used in actuators, sensors, etc.; and a process for production of such a piezoelectric device.

Claims

1. A multi-layered piezoelectric device having, on a ceramic-made substrate, a plurality of piezoelectric portions and a plurality of electrodes electrically connected to the piezoelectric portions, in layers, characterized in that a first piezoelectric portion is made of a piezoelectric ceramic composition containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), second and upper piezoelectric portions are made of a piezoelectric ceramic composition of higher Ni content than in the first piezoelectric portion, and an electrode is provided at least between the first piezoelectric portion and the second piezoelectric portion.

2. A multi-layered piezoelectric device according to claim 1, wherein the Ni content ratio (first/second) of the first piezoelectric portion and the second piezoelectric portion is 0.1 to 0.2 (a mass ratio in terms of NiO).

3. A multi-layered piezoelectric device according to claim 1, wherein third and upper piezoelectric portions are made of a piezoelectric ceramic composition of Ni content same as or larger than in the second piezoelectric portion.

4. A multi-layered piezoelectric device according to claim 1, wherein the first piezoelectric portion is solidly attached to the substrate directly or via the electrode.

5. A multi-layered piezoelectric device according to claim 1, wherein the first piezoelectric portion is made of a piezoelectric ceramic composition containing, as a major component, a Pb(Mg, Ni)1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition represented by the following general formula (1) and the second and upper piezoelectric portions are made of a piezoelectric composition containing, as a major component, a PbMg1/3Nb2/3O3—PbZrO3—PbTiO3 ternary solid solution system composition represented by the following general formula (2) and further containing NiO:

6. A multi-layered piezoelectric device according to claim 5, wherein the Ni content ratio (first/second) of the first piezoelectric portion and the second piezoelectric portion is 0.1 to 0.2 (a mass ratio in terms of NiO).

7. A multi-layered piezoelectric device according to claim 5, wherein third and upper piezoelectric portions are made of a piezoelectric ceramic composition of Ni content same as or larger than in the second piezoelectric portion.

8. A process for producing a multi-layered piezoelectric device, characterized by comprising a step of forming, on a ceramic-made substrate or on an electrode formed on the substrate, a first piezoelectric material layer containing Ni in an amount of 0.08 to 0.31% by mass (in terms of NiO), a step of forming an electrode on the first piezoelectric material layer and then forming, on the electrode, a second piezoelectric material layer of Ni content larger than in the first piezoelectric material layer, and a step of forming a least required number of piezoelectric material layers and then heat-treating the resulting laminate.

9. A process for producing a multi-layered piezoelectric device according to claim 8, which conducts at least once a step of forming an electrode on the second piezoelectric material layer and then forming thereon a third piezoelectric material layer of Ni content same as or larger than in the second piezoelectric material layer.

10. A process for producing a multi-layered piezoelectric device according to claim 8, wherein the heat treatment is conducted in the presence of an atmosphere-controlling material of substantially the same Ni content as in a piezoelectric material layer formed last.