Currently, most chip components of electronics are cooled by forced air convection, but this cooling will not be sufficient for next generation, higher powered electronics which require efficient and compact cooling solutions to maintain acceptable operating temperatures. Liquid cooling of those electronic components, such as a central processing unit (CPU), by microchannel cold plates, also known as direct to chip cooling, has been increasingly adapted as an efficient cooling solution for the thermal management of servers in data centers. Efficient cooling performance can be achieved for the microchannel based cold plate by reducing the channel size. However, a reduction in channel size can result in a high pressure drop, which is a disadvantage for the microchannel based cooling solutions.
A first multichannel manifold cold plate includes a cold plate and microchannels on the cold plate. A plurality of inlets on the microchannels deliver a cooling fluid to the microchannels, and a plurality of outlets on the microchannels receive the cooling fluid from the microchannels. The inlets are interleaved with the outlets.
A second multichannel manifold cold plate includes a cold plate and microchannels on the cold plate. A main inlet is on a side of the microchannels opposite the cold plate and includes inlet channels in fluid communication with the main inlet with nozzles on the inlet channels adjacent the microchannels. A main outlet is on a side of the microchannels opposite the cold plate and includes outlet channels in fluid communication with the main inlet with nozzles on the outlet channels adjacent the microchannels.
The inlet channels are interleaved with the outlet channels. The main inlet delivers a cooling fluid to the cold plate microchannels via the manifold inlet channels and nozzles, and the main outlet receives the cooling fluid from the microchannels via the outlet channels and nozzles.
Embodiments include manifold designs for high power density electronics thermal management. The designs achieve low thermal resistance as well as a low pressure drop. The manifolds can be attached to or integrated with microchannel cooling devices. The manifold designs can include a multichannel manifold having multiple inlets and outlets for delivering a cooling fluid to the microchannels or having a single main inlet and outlet with multiple distribution channels for delivering the cooling fluid. Alternatively, the designs can be used without microchannels. The ratio of the inlets to the outlets and the number of distribution channels can be configured to deliver high cooling performance while maintaining relatively low pressure drop. Varying distribution channel sizes also helps to deliver uniform flow across the microchannels.
Also, inlets 20 are interleaved with outlets 22, meaning that the inlets alternate with the outlets. The inlets and outlets can be interleaved on a one-to-one basis such that one inlet alternates with one outlet or interleaved on other bases, for example two inlets alternating with one outlet or one inlet alternating with two outlets. The type of interleaving of inlets and outlets can be determined, for example, based upon a desired coolant flow and distribution among the microchannels. This configuration of inlets and outlets provides for an effective reduction of coolant flow length from inlet to outlet and direct introduction of coolant flow at the location of inlet.
The configuration of
Inlet channels 29 are interleaved with outlet channels 32, meaning that the inlet channels alternate with the outlet channels. The interleaving can be on, for example, a one-to-one basis or other bases as described for
As shown, main inlet 54 and main outlet 56 are located at, for example, a 90° angle to microchannels 64 or substantially perpendicular to microchannels 64 to achieve a desired flow length and distribution of the coolant. Inlet channels 66 are interleaved with outlet channels 74, meaning that the inlet channels alternate with the outlet channels. The interleaving can be on, for example, a one-to-one basis or other bases as described for
The following configurations for the multichannel manifolds of
The manifold distribution inlet and outlet channels can have different sizes. The center inlet channel can be smaller, having a width less than the width of the outer inlet channels, for better flow distribution uniformity. The spray nozzles or snouts of the center inlet channel can also have a varying size for better fluid distribution uniformity. The outlet channels can be configured in a similar or different manner than the inlet channels depending upon, for example, a desired coolant flow and distribution pattern.
Table 1 provides parameters for two exemplary designs based upon the configuration shown in
The following are exemplary materials and configurations for the manifolds described herein.
The inlets, outlets, main inlet, main outlet, channels, and nozzles can be composed of, for example, a variety of materials having low-thermal conductance such as injection molded plastic, composite materials, or low thermal conductive metals. For example, those components can be composed of copper for high thermal conductivity. The copper can be treated to reduce risk of oxidation (e.g., nickel plating, passivation, etc.). Other possible materials are aluminum, silvers, and eutectic alloy of silver and copper.
The cold plate can be composed of, for example, copper or other metals having a high thermal conductivity.
The cold plate microchannels can be formed integrally with the cold plate through machining or can be formed on the cold plate through additive manufacturing (3D printing) or electroplating. Alternatively, the cold plate microchannels can be in a separate component on the cold plate. The cold plate microchannels can comprise fins, for example the fins as shown for microchannels 30 in
Filing Document | Filing Date | Country | Kind |
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PCT/IB2022/051480 | 2/18/2022 | WO |
Number | Date | Country | |
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63162196 | Mar 2021 | US |