This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2017-183980, filed on 25 Sep. 2017, the entire contents of which are incorporated herein by reference.
The present disclosure relates to a multilayer coil component.
Conventionally, a multilayer coil component has been known in which inner conductors having a layer shape and forming a part of a coil are laminated in an element body. Japanese Unexamined Patent Publication No. 2017-59749 (Patent Literature 1) discloses a multilayer coil component in which a stress relaxation part is provided to be in contact with a surface of an inner conductor.
In the multilayer coil component according to the above-described conventional technique, the inner conductor is even in its length related to a laminated direction (i.e. thickness), so that a shrinkage amount of the inner conductor due to change of heat environment (e.g., firing during manufacture of components) is also substantially even.
The inventors have continued to study about a structure of a coil having stepwise structure in which inner conductors are overlapped with each other in a stepwise manner and have acquired a knowledge that, in such a structure, there exists a thickness difference occurs between a portion where the inner conductors are overlapped and a portion where the inner conductors not overlapped, so that a crack is readily occurred in the element body near a portion where there is such a thickness difference in the inner conductors. The inventors have newly found, as a result of intensive studies, a technique capable of preventing occurrence of a crack even when the coil has a stepwise structure.
The present disclosure provides a multilayer coil component capable of preventing occurrence of a crack even when a coil has a stepwise structure.
A multilayer coil component according to an embodiment of the present disclosure has a laminated structure and includes a coil in an insulating element body, the multilayer coil component including a plurality of coil parts forming a part of the coil and extending in the plurality of layers that form the laminated structure, wherein the coil has a stepwise structure, the coil parts adjacent to each other in a laminated direction are overlapped with each other in a stepwise manner in the stepwise structure, there exist a first portion and second portion in the stepwise structure, two or more of the coil parts are overlapped as layers in the first portion, the second portion adjacent to the first portion in a direction perpendicular to the laminated direction, the second portion having the number of layers smaller than the number of the layers of the first portion, and a stress relaxation part overlapped with at least the first portion among the first portion and the second portion is provided.
The inventors have acquired a knowledge that, in a stepwise structure, a difference occurs in a shrinkage amount between a portion where the number of layers is large and a portion where the number of layers is small due to portions different in the number of layers of coil parts adjacent to each other, so that a crack is readily occurred by inner stress due to the difference of the shrinkage amount. Therefore, the inventors have found a technique for relaxing inner stress by providing a stress relaxation part overlapping with a portion where shrinkage amount is large. That is, the above multilayer coil component relaxes inner stress in the stepwise structure by the stress relaxation part overlapping with the first portion where the number of layers is large, making it possible to prevent occurrence of crack.
A multilayer coil component according to another embodiment is provided with the stress relaxation part overlapping only with the first portion among the first portion and the second portion. The stress relaxation part exerts a high stress relaxation effect at the first portion. This makes it possible to relax inner stress sufficient for practical use while reducing a formation area of the stress relaxation part by not providing the stress relaxation part on the second portion, making it possible to prevent occurrence of the crack efficiently.
In a multilayer coil component according to another embodiment, the coil has a plurality of turns, and the stress relaxation part is provided on only one of a pair of the turns adjacent to each other in the laminated direction. A crack that may be occurred between the pair of the turns adjacent to each other in the laminated direction can be prevented by providing the stress relaxation part only on one of the pair of the turns.
Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Note that same reference numerals are used to denote the same elements, and their overlapped description will be omitted.
First, the overall structure of a multilayer coil component 1 according to the embodiment will be described with reference to
As illustrated in
For convenience of description, XYZ coordinates are set as illustrated in the drawings. That is, a laminated direction of the multilayer coil component 1 is set as Z direction, an opposing direction of the end faces 10a, 10b on which the external terminal electrodes 12A, 12B are respectively provided is set as X direction, and a direction perpendicular to Z direction and X direction is set as Y direction.
The insulating element body 10 has insulation properties and is composed of an insulation-coated granular magnetic material. As the magnetic material, a metal magnetic material (Fe, FE—Si—Cr, Fe—Ni—Si, Fe—Ni—Si—Co, Fe—Si—Al alloy, or the like) can be employed. Among layers L1 to L20 forming the multilayer coil component 1, the cover layers that are the uppermost layer L1 and the lowermost layer L20 is wholly composed of the above-mentioned magnetic material. The other layers L2 to L19 are also composed of the above-mentioned magnetic material except a coil part and a stress relaxation part 40 described below.
The coil 20 is formed of a plurality of coil parts included in respective the layers L2 to L19 excluding the uppermost layer L1 and lowermost layer L20. Each coil part has a layer shape extending in a layer direction (X-Y plane direction) perpendicular to the laminated direction (Z direction) in the layers L1 to L20 forming the coil 20. Each coil part is a conductive layer forming a part of the coil 20. A metal such as Ag, Cu, Au, Al, or Pd, a Pd/Ag alloy, or the like can be used for the material of the conductive layer. A Ti compound, a Zr compound, a Si compound, or the like may be added to the conductive layer. Such a conductive layer can be formed by a printing method or a thin film growing method.
As shown in
The coil 20 also includes a plurality of coil conductive parts 22 each forming one turn of the coil as illustrated in
However, a position of the divided portion 25 in the upper coil part 23 and a position of the divided portion 25 in the lower coil part 24 are deviated in the opposing direction of the first end 22a and the second end 22b (that is, X direction). Accordingly, the coil conductive part 22 has a one-layer structure in which the upper coil part 23 and the lower coil part 24 are not overlapped near the divided portions 25, and has a two-layers structure in which the upper coil part 23 and the lower coil part 24 are overlapped except a vicinity of the divided portions 25.
The coil 20 also includes a connecting part 28 for connecting the coil conductive parts 22 with each other as a coil part forming the coil 20. In the embodiment, the coil conductive parts 22 having the same shape and the connecting parts 28 having the same shape are alternately aligned in the laminated direction. The connecting part 28 is arranged at the position corresponding to the position of the divided portion 25 of the coil conductive part 22, and has a rectangular shape extending along the opposing direction of the pair of ends 22a, 22b of the coil conductive part 22 (that is, along the shape of the divided portion 25).
The connecting part 28 connects the coil conductive parts 22 adjacent to each other in the up and down in the laminated direction. To be more specific, the connecting part 28 overlaps with the lower coil part 24 of the coil conductive part 22 located on its upper side in a stepwise manner and overlaps the upper coil part 23 of the coil conductive part 22 located on its lower side in a stepwise manner. This forms a stepwise structure around the connecting part 28.
Hereinafter, the stepwise structure around the connecting part 28 will be descried with reference to
As illustrated in
The stress relaxation part 40 is a space in which powder exists, and is in contact with the lower surface of the end 28a of the connecting part 28. The stress relaxation part 40 relaxes inner stress occurred in the insulating element body 10 by being interposed between an element body area of the insulating element body 10 and the coil part. The powder in the space of the stress relaxation part 40 is, for example, ZrO2 powder. The melting point of ZrO2 is, for example, not less than about 2700° C., and is considerably higher than the firing temperature of the metal magnetic material. The average particle diameter of the powder is, for example, not more than 0.1 μm.
Furthermore, as illustrated in
The inventors have acquired a knowledge that, in the stepwise structure as illustrated in
Note that, the stress relaxation part 40 may be filled with powder in its entirety, or a gap or the like may be formed between powders. That is, the powder may densely exist in the stress relaxation part 40 to be in contact with the coil part or the element body, or may exist to have a gap between with at least one of the coil parts 23, 24, 28 and the insulating element body 10. The gap or the like is formed due to, for example, disappearance of an organic solvent or the like included in the material for forming the stress relaxation part 40 during firing.
The stress relaxation part 40 can be formed by a known method. As an example, the stress relaxation part 40 can be formed by forming a powder pattern corresponding to the stress relaxation part 40 before forming conductive patterns corresponding to the coil parts 23, 24, and 28 on a green sheet that should be the insulating element body 10. Specifically, applying a paste such as ZrO2 on the above-mentioned green sheet by a screen printing or the like makes it possible to form a powder pattern that should be the stress relaxation part 40 after firing. The paste such as ZrO2 can be obtained by mixing ZrO2 powder, organic solvent, organic binder, and the like. Subsequently, by applying the above-mentioned conductive paste on the powder pattern formed on the green sheet by a screen printing or the like, conductive patterns that should be the coil parts 23, 24, 28 after firing are formed. The conductive paste can be manufactured by mixing conductive powder, organic solvent, organic binder, and the like. The conductive patterns are sintered by a predetermined firing treatment to become the coil parts 23, 24, 28. The powder pattern becomes the stress relaxation part 40 in which powder exists by firing. The powder exists in the stress relaxation part 40 has substantially the same average grain diameter as that of ZrO2 powder used for forming the powder pattern before firing.
Note that, besides the aspect in which the stress relaxation part 40 is provided only on the maximum film thickness portion 31A, 31B among the maximum film thickness portion 31A, 31B and the minimum film thickness portion 32 adjacent to each other in the laminated direction, an aspect may be employed in which the stress relaxation part 40 is provided on both the maximum film thickness portion 31A, 31B and the minimum film thickness portion 32. Also in this case, inner stress in the stepwise structure of the multilayer coil component 1 is relaxed to prevent occurrence of the crack C1. However, the stress relaxation part 40 exerts a high stress relaxation effect in the maximum film thickness portions 31A, 31B. This makes it possible to relax inner stress sufficient for practical use while reducing the formation area of the stress relaxation part 40 by not providing the stress relaxation part 40 on the minimum film thickness portion 32, making it possible to prevent occurrence of the crack C1 efficiently.
The stress relaxation part 40 can be wholly provided on the lower surface of the coil conductive part 22 forming one turn of the coil (that is, lower surface of the lower coil part 24). In this case, as illustrated in
One embodiment of the present disclosure is described above, but the present disclosure is not limited to the above embodiment, and may be modified or may be used for another application in a range without changing the gist described in each of the claims.
For example, in the stepwise structure of the coil part, instead of the aspect where the coil conductive parts 22 are connected by one connecting part like the above-mentioned embodiment, an aspect may be employed in which the coil conductive parts 22 are connected by a plurality of connecting parts.
Alternatively, the stress relaxation part need not necessarily be provided on the lower surface of the coil part, and may be provided on the upper surface. Alternatively, the stress relaxation part may be provided on both the lower surface and the upper surface of the coil part.
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