Claims
- 1. A leadframe for use in mounting and interconnecting an integrated circuit, said leadframe comprising a first layer of at least one of brass or other copper alloy, a second layer on the first layer comprising at least one of aluminum or an aluminum alloy, and a third layer atop the second layer comprising at least one of copper or a copper alloy, the first, second and third layers being formed into a multilayer clad strip, a portion of at least said third layer being selectively removed to expose a selected pattern of said second layer.
- 2. A leadframe for use in mounting and interconnecting an integrated circuit, said leadframe comprising:
- a housing having a plurality of external male connectors radially disposed therefrom, the connectors being oriented and configured for connection to the integrated circuit,
- the housing comprising a first layer of at least one of brass or other copper alloy, a second layer on the first layer being of at least one of aluminum or an aluminum alloy, and a third layer atop the second comprising at least one of copper or a copper alloy, the first, second and third layers being formed into a multilayer clad strip, a portion of at least said third layer being selectively removed to expose a selected pattern of said second layer.
Parent Case Info
This application is a continuation of application Ser. No. 08/257,546, filed Jun. 9, 1994, now abandoned, which is a divisional of application Ser. No. 08/203,448, filed Feb. 28, 1994, now U.S. Pat. No. 5,437,096 issued Aug. 1, 1995.
US Referenced Citations (7)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0128981A3 |
Dec 1984 |
EPX |
0205183A2 |
Dec 1986 |
EPX |
62-208654 |
Sep 1987 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
203448 |
Feb 1994 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
257546 |
Jun 1994 |
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