Flat leads

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CPC
H01L21/4821

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4821Flat leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 12,362,195
- Issue date Jul 15, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 12,255,077
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,224,180
- Issue date Feb 11, 2025
- Nexperia B.V.
- Ricardo Yandoc
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having integrated passive device(s) between leads
- Patent number 12,218,036
- Issue date Feb 4, 2025
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal dissipation in flip-chip semiconductor devices usi...
- Patent number 12,211,763
- Issue date Jan 28, 2025
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure thereof
- Patent number 12,087,675
- Issue date Sep 10, 2024
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package with shielded die-to-pad contacts
- Patent number 12,068,228
- Issue date Aug 20, 2024
- NXP USA, INC.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with stepped side surface
- Patent number 12,062,596
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder surface features for integrated circuit packages
- Patent number 12,021,011
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing of a semicondu...
- Patent number 11,990,394
- Issue date May 21, 2024
- Nexperia B.V.
- Kim Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and electronic module with new routing possibi...
- Patent number RE49970
- Issue date May 14, 2024
- IMBERATEK, LLC
- Antti Kivikero
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 11,929,259
- Issue date Mar 12, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame assembly, semiconductor package and methods for improved...
- Patent number 11,923,275
- Issue date Mar 5, 2024
- NXP USA, INC.
- Allen Marfil Descartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing same
- Patent number 11,901,253
- Issue date Feb 13, 2024
- Denso Corporation
- Wataru Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
- Patent number 11,901,268
- Issue date Feb 13, 2024
- NGK Electronics Devices, Inc.
- Yoshio Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage semiconductor device lead frame and method of fabrication
- Patent number 11,881,445
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package component
- Patent number 11,869,857
- Issue date Jan 9, 2024
- AMOSENSE CO., LTD
- Ji-Hyung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package using selectively pre-plated leadframe
- Patent number 11,869,832
- Issue date Jan 9, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for improving heat dissipation and mounting st...
- Patent number 11,842,951
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Ippei Yasutake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board, COF module and electronic device including...
- Patent number 11,800,639
- Issue date Oct 24, 2023
- LG Innotek Co., Ltd
- Jun Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor device, and lead frame manufacturing method
- Patent number 11,791,250
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 11,791,168
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming the same
- Patent number 11,769,716
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frames having rounded corners and related packages and methods
- Patent number 11,769,713
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple exposed pads
- Patent number 11,735,506
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Hung-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20250218794
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...
- Publication number 20250167058
- Publication date May 22, 2025
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250140661
- Publication date May 1, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING
- Publication number 20250140573
- Publication date May 1, 2025
- PANJIT INTERNATIONAL INC.
- Chung Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...
- Publication number 20250087576
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Sachiko FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional Stack Package Structure And Method Making The Same
- Publication number 20250006702
- Publication date Jan 2, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240395675
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS
- Publication number 20240371732
- Publication date Nov 7, 2024
- NXP USA, Inc.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Subtractive Metal Structuring on Surface of Semiconductor Package
- Publication number 20240312956
- Publication date Sep 19, 2024
- INFINEON TECHNOLOGIES AG
- Pei Luan Pok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF
- Publication number 20240290631
- Publication date Aug 29, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
- Publication number 20240274514
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...
- Publication number 20240178006
- Publication date May 30, 2024
- STMICROELECTRONICS, INC.
- Ian Harvey ARELLANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240112994
- Publication date Apr 4, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240096769
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Haibo Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
- Publication number 20240096763
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION
- Publication number 20240044946
- Publication date Feb 8, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20240047226
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF
- Publication number 20240030107
- Publication date Jan 25, 2024
- Rohm Co., Ltd.
- Ippei YASUTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240014105
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH STAR-CONNECTED LEAD
- Publication number 20240006273
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kumar Anurag SHRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERDIGITAL CAPACITOR
- Publication number 20230402356
- Publication date Dec 14, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE EXPOSED PADS
- Publication number 20230395472
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hung-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...
- Publication number 20230352372
- Publication date Nov 2, 2023
- McMaster University
- Yuhang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230352313
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe with a metal oxide coating and method of forming the same

Leadless current sensor package with high isolation

Method for manufacturing leadless semiconductor package with wettab...

Method for creating a wettable surface for improved reliability in...

Semiconductor device and a method of manufacturing a semiconductor...

Package substrate having integrated passive device(s) between leads

Enhanced thermal dissipation in flip-chip semiconductor devices usi...

Semiconductor device and mounting structure thereof

Leadless semiconductor package with shielded die-to-pad contacts

Semiconductor packages and related methods

Semiconductor die with stepped side surface

Solder surface features for integrated circuit packages

Semiconductor package and a method for manufacturing of a semicondu...

Manufacturing method and electronic module with new routing possibi...

Method for manufacturing leadless semiconductor package with wettab...

Lead-frame assembly, semiconductor package and methods for improved...

Electronic device and method for manufacturing same

Package with an electrode-attached frame supported by a heat sink,...

High voltage semiconductor device lead frame and method of fabrication

Semiconductor package component

Leadframe package using selectively pre-plated leadframe

Semiconductor device for improving heat dissipation and mounting st...

Flexible circuit board, COF module and electronic device including...

Coated semiconductor devices

Lead frame, semiconductor device, and lead frame manufacturing method

Universal semiconductor package molds

Method for creating a wettable surface for improved reliability in...

Semiconductor device and methods of forming the same

Lead frames having rounded corners and related packages and methods

Packages with multiple exposed pads

Patents Applicationslast 30 patents

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

INTELLIGENT POWER MODULE

ENHANCHED THERMAL DISSIPATION IN FLIP-CHIP SEMICONDUCTOR DEVICES US...

LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

METHOD OF MANUFACTURING PRE-MOLDED LEAD FRAME FOR PACKAGING

BONDED BODY, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHO...

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Three-dimensional Stack Package Structure And Method Making The Same

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS

SEMICONDUCTOR PACKAGES AND RELATED METHODS

Subtractive Metal Structuring on Surface of Semiconductor Package

METHOD FOR MANUFACTURING A LEAD FRAME AND STRUCTURE THEREOF

Electroless Die-Attach Process for Semiconductor Packaging

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

LEADLESS SEMICONDUCTOR PACKAGE WITH WETTABLE FLANKS AND METHOD FOR...

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR

LEADLESS CURRENT SENSOR PACKAGE WITH HIGH ISOLATION

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGE WITH STAR-CONNECTED LEAD

INTERDIGITAL CAPACITOR

PACKAGES WITH MULTIPLE EXPOSED PADS

SILVER SINTERED MOLYBDENUM (SSM) PACKAGING FOR POWER SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE