Metallic layers on lead frames

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CPC
H01L23/49582

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49582Metallic layers on lead frames

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,362,266
- Issue date Jul 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with a metal oxide coating and method of forming the same
- Patent number 12,362,195
- Issue date Jul 15, 2025
- STMICROELECTRONICS INTERNATIONAL N.V.
- Luca Maria Carlo Di Dio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress asymmetric dual side module
- Patent number 12,347,755
- Issue date Jul 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,334,420
- Issue date Jun 17, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an intermetallic phase layer with a plurality of...
- Patent number 12,330,243
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of forming a packaged semiconductor device having enhanced w...
- Patent number 12,300,582
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wettable lead flanks and tie bars and...
- Patent number 12,261,101
- Issue date Mar 25, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a wettable surface for improved reliability in...
- Patent number 12,255,077
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 12,255,168
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,249,560
- Issue date Mar 11, 2025
- Rohm Co., Ltd
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic structure for optical semiconductor device, method for pro...
- Patent number 12,237,450
- Issue date Feb 25, 2025
- Nichia Corporation
- Yasuo Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 12,237,293
- Issue date Feb 25, 2025
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,165,880
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a semiconductor chip
- Patent number 12,154,865
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi Kawashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding appara...
- Patent number 12,125,803
- Issue date Oct 22, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,125,774
- Issue date Oct 22, 2024
- Sumitomo Electric Device Innovations, Inc.
- Hisashi Shimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239558
- Publication date Jul 24, 2025
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING STRUCTURE AND SEMICONDUCTOR DEVICE
- Publication number 20250233057
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Oji SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL
- Publication number 20250226297
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Kok Yau CHUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...
- Publication number 20250218794
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sadia Naseem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250192006
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jungmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layered Metal Frame Power Package
- Publication number 20250183130
- Publication date Jun 5, 2025
- Ferric Inc.
- Noah Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...
- Publication number 20250183132
- Publication date Jun 5, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250183125
- Publication date Jun 5, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20250174530
- Publication date May 29, 2025
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT
- Publication number 20250174525
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174526
- Publication date May 29, 2025
- NEXPERIA B.V.
- Wai Hung William Hor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174527
- Publication date May 29, 2025
- ROHM CO., LTD.
- Ryuta YAGINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250174529
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20250167080
- Publication date May 22, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE
- Publication number 20250157898
- Publication date May 15, 2025
- STMicroelectronics International N.V.
- Venero SANTAMARIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...
- Publication number 20250149412
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250149410
- Publication date May 8, 2025
- RENESAS ELECTRONICS CORPORATION
- Seiya ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250140661
- Publication date May 1, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250132212
- Publication date Apr 24, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multifunctional Adhesion Promoter for Semiconductor Device Packages
- Publication number 20250122413
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Direct Bonded Semiconductor Die Package
- Publication number 20250125231
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WETTABLE METALIZATION MULTILAYER WITH INCREASED ADHESION ENERGY, IN...
- Publication number 20250125232
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Brunella CAFRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
- Publication number 20250112133
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250112129
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS
- Publication number 20250112130
- Publication date Apr 3, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250105024
- Publication date Mar 27, 2025
- STMicroelectronics S.r.l
- Fulvio Vittorio FONTANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT
- Publication number 20250096082
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Mei Yih Goh
- H01 - BASIC ELECTRIC ELEMENTS

Metallic layers on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low stress asymmetric dual side module

Leadframe with a metal oxide coating and method of forming the same

Semiconductor device and method for manufacturing the same

Low stress asymmetric dual side module

Semiconductor devices and methods of manufacturing semiconductor de...

Method of forming an intermetallic phase layer with a plurality of...

Method of forming a packaged semiconductor device having enhanced w...

Semiconductor device and method for manufacturing the same

Semiconductor package having wettable lead flanks and tie bars and...

Method for creating a wettable surface for improved reliability in...

Electronic device with multi-layer contact and system

Electronic device and method for manufacturing electronic device

Lead frame and manufacturing method thereof

Substrates with solder barriers on leads

Metallic structure for optical semiconductor device, method for pro...

Palladium-coated copper bonding wire, manufacturing method of palla...

Semiconductor package having side wall plating

Semiconductor device having cavities at an interface of an encapsul...

Semiconductor device and method of manufacturing the same

Semiconductor package having side wall plating

Semiconductor device

Semiconductor device

Semiconductor device

Method of manufacturing semiconductor devices and corresponding sem...

Power semiconductor device including a semiconductor chip

Semiconductor package with nickel-silver pre-plated leadframe

Lead frame for a package for a semiconductor device, semiconductor...

Method of manufacturing semiconductor devices, corresponding appara...

Semiconductor device and method of manufacturing the same

Methods and apparatus for an improved integrated circuit package

Patents Applicationslast 30 patents

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

JOINING STRUCTURE AND SEMICONDUCTOR DEVICE

PACKAGE WITH CARRIER HAVING PLATED BOTTOM SURFACE AND SIDEWALL

METHOD FOR CREATING A WETTABLE SURFACE FOR IMPROVED RELIABILITY IN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Multi-Layered Metal Frame Power Package

SEMICONDUCTOR PACKAGE HAVING WETTABLE LEAD FLANKS AND TIE BARS AND...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

FLIP CHIP QUAD FLAT NO LEADS (QFN) PACKAGE

LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS O...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

QFN PACKAGED SEMICONDUCTOR DEVICE AND METHOD

Multifunctional Adhesion Promoter for Semiconductor Device Packages

Direct Bonded Semiconductor Die Package

WETTABLE METALIZATION MULTILAYER WITH INCREASED ADHESION ENERGY, IN...

SEMICONDUCTOR PACKAGE

PACKAGES WITH STEPPED CONDUCTIVE TERMINALS

SEMICONDUCTOR MODULE

FLAT SEMICONDUCTOR PACKAGE WITH COPLANAR LEADS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

INTERCONNECT CLIP FOR VERTICALLY STACKED DIE ARRANGEMENT