Claims
- 1. A method for retaining a substrate comprising the steps of:disposing the substrate adjacent a carrier plate; flowing a first fluid through a first port disposed on the carrier plate into a plenum at least partially bounded between the substrate and the carrier plate; and applying at least one of a second fluid or vacuum through a second port disposed on the carrier plate into the plenum between the substrate and the carrier plate.
- 2. The method of claim 1 further comprising the step of venting the flow between the carrier plate and the substrate.
- 3. The method of claim 1 further comprising the step of applying a force to the carrier plate that causes the substrate to engage a polishing media.
- 4. The method of claim 1 further comprising the step of applying a third fluid or vacuum through a third port disposed on the earner plate between the substrate and the carrier plate.
- 5. The method of claim 4, wherein the steps of applying the second fluid or vacuum through the second port and applying the third fluid or vacuum through the third port are separately controllable.
- 6. The method of claim 4, wherein air is applied to the first and second ports, and vacuum is applied to the third port.
- 7. The method of claim 4, wherein air is applied to the first and third ports, and vacuum is applied to the second port.
- 8. The method of claim 4, wherein air is applied to the first ports, and a fluid is applied to at least one of the second or the third ports.
- 9. The method of claim 8, wherein the fluid is ambient air, nitrogen, soluble polishing fluid, de-ionized water or clean dry air.
- 10. The method of claim 8, wherein the fluid is a combination of de-ionized water and ambient air, nitrogen, soluble polishing fluid or clean dry air.
- 11. A method for retaining a substrate comprising the steps of:disposing the substrate adjacent a carrier plate; flowing a first fluid from a first fluid circuit through a first port disposed adjacent a perimeter of the carrier plate to a space at least partially bounded by the substrate and the carrier plate; coupling a second fluid circuit to the space between the substrate and the carrier plate through a second port disposed on the carrier plate inward of the first port; and coupling a third fluid circuit to the space between the substrate and the carrier plate through a third port disposed inward of the second port.
- 12. The method of claim 11 further comprising the steps of:having no flow through the second port; and having no flow through the third port.
- 13. The method of claim 11 further comprising the steps of:flowing a fluid into the space through the second port; and having no flow through the third port.
- 14. The method of claim 11 further comprising the steps of:flowing a fluid from the space through the second port; and having no flow through the third port.
- 15. The method of claim 11 further comprising the steps of:having no flow through the second port; and flowing a fluid to the space through the third port.
- 16. The method of claim 11 further comprising the steps of:having no flow through the second port; and flowing a fluid from the space through the third port.
- 17. The method of claim 11 further comprising the steps of: flowing a first fluid to the space through the second port; andflowing a second fluid to the space through the third port.
- 18. The method of claim 11 further comprising the steps of:flowing a first fluid to the space through the second port; and flowing a second fluid from the space through the third port.
- 19. The method of claim 11 further comprising the steps of:flowing a first fluid from the space through the second port; and flowing a second fluid from the space through the 25 third port.
Parent Case Info
This application is a continuation-in-part of copending U.S. patent application Ser. No. 09/258,042, filed Feb. 25, 1999 by Sommer et al., which is hereby incorporated by reference herein in its entirety.
This application additionally claims benefit of U.S. Provisional Application Ser. No. 60/185,778, filed Feb. 29, 2000 by Butterfield et al., which is hereby incorporated by reference herein in its entirety.
US Referenced Citations (24)
Foreign Referenced Citations (4)
Number |
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0 589 433 |
Mar 1994 |
EP |
0786310 |
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Provisional Applications (1)
|
Number |
Date |
Country |
|
60/185778 |
Feb 2000 |
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/258042 |
Feb 1999 |
US |
Child |
09/718050 |
|
US |