Claims
- 1. A planarized film applied to a substrate, wherein the film comprises a planarizing novolac resin having a weight average molecular weight between about 1000 and 2300 amu and wherein the planarizing novolac resin is fractionated to remove the molecules with molecular weight below about 350 amu to a less than about 22% of a total molecular weight distribution, and a surfactant selected from the group consisting of a non-fluorinated hydrocarbon, a fluorinated hydrocarbon and combinations thereof and further wherein the polydispersity of the planarizing novolac resin is less than 1.4.
- 2. The film of claim 1, wherein the planarizing resin further comprises an organic solvent.
- 3. The film of claim 2, wherein the organic solvent comprises at least one of ethyl lactate, ethyl acetate, propyl acetate, and butyl acetate.
- 4. The film of claim 1, wherein the planarizing novolac resin has a fraction with molecular weight below about 350 amu that is less than about 15% of the total.
- 5. The film of claim 1, wherein the planarizing novolac resin is a phenolic resin.
- 6. The film of claim 1, wherein the planarizing novolac resin has a polydispersity of less than about 1.2.
- 7. The film of claim 1, wherein the surfactant is an ester derivative of a fluorinated hydrocarbon.
- 8. The film of claim 1, wherein the planarizing novolac resin is spin-coated onto the substrate.
- 9. The film of claim 1, wherein the substrate comprises silicon.
- 10. The film of claim 9, wherein the substrate comprises a circuit pattern on the surface of the substrate.
- 11. An integrated circuit comprising the film of claim 10.
- 12. A microelectronic device comprising the film of claim 1.
RELATED APPLICATION
This application is a division of U.S. application Ser. No. 09/205,006, filed Dec. 2, 1998.
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