Claims
- 1. A method for producing at least one patterned feature of extruded paste on an essentially planar microelectronic substrate having high aspect ratio vias, said method comprising the steps of:
- (a) obtaining a substrate having high aspect ratio vias characterized by a via depth to via width ratio of greater than about 2;
- (b) contacting the substrate with an essentially planar patterned screen;
- (c) contacting the screen with a nozzle comprising a nozzle body having an inlet, an elongate outlet formed to receive an insert, and an internal passage in communication therewith, and a nozzle insert formed to compliantly and sealably mount to the nozzle body outlet, said insert having a flat surface located adjacent to said outlet for conformably contacting said essentially planar screen, having a second surface joined to and angled away from said flat surface at a position away from said outlet, and having an elongate slit therein for the extrusion of paste, wherein said second surface is angled in the range of about 2 to about 4 degrees away from said flat surface; and
- (d) extruding a paste through said nozzle and said screen onto said substrate.
- 2. The method of claim 1 wherein the nozzle further comprises a plurality of support strips fixably mounted in the nozzle body to retain the insert in the nozzle body.
- 3. The method of claim 1 wherein the nozzle insert flat surface comprises a region extending beyond each end of the elongate opening to dynamically seal to the screen.
- 4. The method of claim 3 wherein said flat surface of said insert has width between about 0.020 inches and about 0.060 inches.
- 5. The method of claim 1 wherein the vias of the substrate have an opening width of not greater than about 0.040 inches.
- 6. The method of claim 1 wherein said insert further comprises a beveled edge.
- 7. The method of claim 1 wherein said elongate slit has an opening width in the range from about 0.093 inches to about 0.180 inches.
- 8. The method of claim 1 wherein said elongate slit has width in a range between about 18 and about 50 multiples of said predetermined via width.
RELATED APPLICATION
The application is a division of application Ser. No. 08/753,127, filed Nov. 20, 1996 now abandoned. U.S. patent application Ser. No. 08/753,129, filed Nov. 6, 1996, entitled "Nozzle Apparatus for Extruding Conductive Paste" assigned to the assignee hereof, discloses a similar nozzle apparatus and method of use.
US Referenced Citations (13)
Non-Patent Literature Citations (1)
Entry |
S. W. Cornell, et al., "Extrusion Screening Nozzle", IBM Technical Disclosure Bulletin vol. 14, No. 3, Aug. 1971, p. 739. |
Divisions (1)
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Number |
Date |
Country |
Parent |
753127 |
Nov 1996 |
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