for via connections in organic insulating substrates

Industry

CPC
H05K3/4069

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4069for via connections in organic insulating substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing undesired metal within vias from p...
- Patent number 11,997,800
- Issue date May 28, 2024
- TTM Technologies, Inc.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via bond attachment
- Patent number 11,950,378
- Issue date Apr 2, 2024
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming electrical interconnections using capillary microfluidics
- Patent number 11,937,381
- Issue date Mar 19, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
- Patent number 11,856,713
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Masanori Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method of manufacturing printed wiring board
- Patent number 11,540,390
- Issue date Dec 27, 2022
- Kyocera Corporation
- Tomoya Nagase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,523,517
- Issue date Dec 6, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayered board
- Patent number 11,503,707
- Issue date Nov 15, 2022
- UNIJET CO., LTD.
- Sung-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,382,218
- Issue date Jul 5, 2022
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,350,520
- Issue date May 31, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Mayr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing printed wire boards
- Patent number 11,337,309
- Issue date May 17, 2022
- Rohm and Haas Electronic Materials LLC
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices comprising a via and methods of forming such ele...
- Patent number 11,284,521
- Issue date Mar 22, 2022
- 3M Innovative Properties, Company
- Matthew S. Stay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 11,026,335
- Issue date Jun 1, 2021
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a PCB
- Patent number 10,980,126
- Issue date Apr 13, 2021
- The United States of America, as represented by the Secretary of the Navy
- Stephen J. Vetter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing trapezoidal through-hole in component carrier material
- Patent number 10,950,463
- Issue date Mar 16, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, electronic circuit device, and production method of...
- Patent number 10,932,373
- Issue date Feb 23, 2021
- Stanley Electric Co., Ltd.
- Akihiko Hanya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self regulating flexible heating device
- Patent number 10,856,365
- Issue date Dec 1, 2020
- Mark Allen Ester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, electronic device, and a method for manufactu...
- Patent number 10,813,209
- Issue date Oct 20, 2020
- Murata Manufacturing Co., Ltd.
- Shuichi Kezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit substrate, semiconductor device, method of producing...
- Patent number 10,790,209
- Issue date Sep 29, 2020
- Toppan Printing Co., Ltd.
- Koji Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive polymers within drilled holes of printed circuit boards
- Patent number 10,772,215
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method and wiring board
- Patent number 10,757,818
- Issue date Aug 25, 2020
- Nichia Corporation
- Rie Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive polymers within drilled holes of printed circuit boards
- Patent number 10,750,622
- Issue date Aug 18, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230118261
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via Bond attachment
- Publication number 20230053225
- Publication date Feb 16, 2023
- Harbor Electronics, Inc.
- Sergio Ramirez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230047768
- Publication date Feb 16, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220369458
- Publication date Nov 17, 2022
- LG Innotek Co., Ltd.
- Sung Wuk RYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH MOLD VIA FRAME
- Publication number 20220319971
- Publication date Oct 6, 2022
- ROCKLEY PHOTONICS LIMITED
- SEUNGJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...
- Publication number 20220151069
- Publication date May 12, 2022
- Mitsui Chemicals, Inc.
- Taichi KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS
- Publication number 20220078918
- Publication date Mar 10, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071000
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220046802
- Publication date Feb 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING-QIU ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...
- Publication number 20210410296
- Publication date Dec 30, 2021
- Murata Manufacturing Co., Ltd.
- Masanori OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED-WIRING BOARD AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD
- Publication number 20210185812
- Publication date Jun 17, 2021
- KYOCERA CORPORATION
- Tomoya NAGASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST, LOW LOSS MATERIAL FOR MICROWAVE OR ANTENNA PRINTED CIRCUI...
- Publication number 20210151869
- Publication date May 20, 2021
- Hughes Network Systems, LLC
- Bingqian LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM P...
- Publication number 20210136928
- Publication date May 6, 2021
- TTM TECHNOLOGIES, INC.
- Mace Lehrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210059058
- Publication date Feb 25, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210045233
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Günther Mayr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...
- Publication number 20200296837
- Publication date Sep 17, 2020
- Rohm and Haas Electronic Materials L.L.C.
- Tina Aoude
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Trapezoidal Through-Hole in Component Carrier Material
- Publication number 20200251351
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF REGULATING FLEXIBLE HEATING DEVICE
- Publication number 20200154526
- Publication date May 14, 2020
- Mark Allen Ester
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD
- Publication number 20200077526
- Publication date Mar 5, 2020
- Nichia Corporation.
- Rie MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200029433
- Publication date Jan 23, 2020
- Unimicron Technology Corp.
- Chien-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190373742
- Publication date Dec 5, 2019
- TDK Corporation
- Takaaki MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20190350091
- Publication date Nov 14, 2019
- Avary Holding (Shenzhen) Co., Limited.
- TZU-CHIEN YEH
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...
- Publication number 20190281705
- Publication date Sep 12, 2019
- Stanley Electric Co., Ltd
- Akihiko HANYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE
- Publication number 20190104611
- Publication date Apr 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Akihito GOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, PLANAR TRANSFORMER, AND METHOD OF MANUFACTURING THE W...
- Publication number 20190027296
- Publication date Jan 24, 2019
- NGK SPARK PLUG CO., LTD.
- Masahito MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUD...
- Publication number 20190029117
- Publication date Jan 24, 2019
- The United States of America, as represented by the Secretary of the Navy
- Stephen J. Vetter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

for via connections in organic insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer substrate

Circuit board and method for manufacturing the same

Systems and methods for removing undesired metal within vias from p...

Via bond attachment

Forming electrical interconnections using capillary microfluidics

Circuit board preparation method

Sn—Bi and copper powder conductive paste in through hole of insulat...

Multilayer resin substrate and method of manufacturing multilayer r...

Multilayer coil circuit substrate

Circuit board structure and method for manufacturing a circuit boar...

Printed wiring board and method of manufacturing printed wiring board

Circuit board structure and manufacturing method thereof

Circuit board and method for manufacturing the same

Manufacturing method of multilayered board

Component carrier with embedded component and horizontally elongate...

Printed wiring board and method for manufacturing the same

Component carrier and method of manufacturing the same

Methods of manufacturing printed wire boards

Electronic devices comprising a via and methods of forming such ele...

Circuit board structure and method for manufacturing a circuit boar...

Wiring board manufacturing method and wiring board

Apparatus for manufacturing a PCB

Manufacturing trapezoidal through-hole in component carrier material

Circuit board, electronic circuit device, and production method of...

Self regulating flexible heating device

Multilayer substrate, electronic device, and a method for manufactu...

Wiring circuit substrate, semiconductor device, method of producing...

Conductive polymers within drilled holes of printed circuit boards

Wiring board manufacturing method and wiring board

Conductive polymers within drilled holes of printed circuit boards

Patents Applicationslast 30 patents

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

MULTILAYER SUBSTRATE

Via Bond attachment

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

THROUGH MOLD VIA FRAME

ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...

FORMING ELECTRICAL INTERCONNECTIONS USING CAPILLARY MICROFLUIDICS

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...

PRINTED-WIRING BOARD AND METHOD OF MANUFACTURING PRINTED-WIRING BOARD

LOW COST, LOW LOSS MATERIAL FOR MICROWAVE OR ANTENNA PRINTED CIRCUI...

SYSTEMS AND METHODS FOR REMOVING UNDESIRED METAL WITHIN VIAS FROM P...

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Component Carrier and Method of Manufacturing the Same

PRINTED WIRE BOARDS, METHODS OF MANUFACTURE THEREOF AND ARTICLES CO...

Manufacturing Trapezoidal Through-Hole in Component Carrier Material

SELF REGULATING FLEXIBLE HEATING DEVICE

WIRING BOARD MANUFACTURING METHOD AND WIRING BOARD

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE PRINTED CIRCUIT BOARD

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND PRODUCTION METHOD OF...

LAMINATED SUBSTRATE AND METHOD OF MANUFACTURING LAMINATED SUBSTRATE

WIRING BOARD, PLANAR TRANSFORMER, AND METHOD OF MANUFACTURING THE W...

PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUD...

VIA AND SKIP VIA STRUCTURES